DE3367483D1 - Liquid treatment apparatus and method - Google Patents

Liquid treatment apparatus and method

Info

Publication number
DE3367483D1
DE3367483D1 DE8383100292T DE3367483T DE3367483D1 DE 3367483 D1 DE3367483 D1 DE 3367483D1 DE 8383100292 T DE8383100292 T DE 8383100292T DE 3367483 T DE3367483 T DE 3367483T DE 3367483 D1 DE3367483 D1 DE 3367483D1
Authority
DE
Germany
Prior art keywords
treatment apparatus
liquid treatment
liquid
treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8383100292T
Other languages
German (de)
Inventor
Charles Anthony Cortellino
Joseph Eli Levine
Henry Carl Schick
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3367483D1 publication Critical patent/DE3367483D1/en
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer
DE8383100292T 1982-03-22 1983-01-14 Liquid treatment apparatus and method Expired DE3367483D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/360,157 US4429983A (en) 1982-03-22 1982-03-22 Developing apparatus for exposed photoresist coated wafers

Publications (1)

Publication Number Publication Date
DE3367483D1 true DE3367483D1 (en) 1986-12-11

Family

ID=23416836

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8383100292T Expired DE3367483D1 (en) 1982-03-22 1983-01-14 Liquid treatment apparatus and method

Country Status (4)

Country Link
US (1) US4429983A (en)
EP (1) EP0089454B1 (en)
JP (1) JPS58168229A (en)
DE (1) DE3367483D1 (en)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6064436A (en) * 1983-09-19 1985-04-13 Fujitsu Ltd Spin drier
US4801335A (en) * 1984-07-02 1989-01-31 Fsi Corporation Rinsing in acid processing of substrates
US4682615A (en) * 1984-07-02 1987-07-28 Fsi Corporation Rinsing in acid processing of substrates
US4745422A (en) * 1985-11-18 1988-05-17 Kabushiki Kaisha Toshiba Automatic developing apparatus
JPS63271931A (en) * 1987-04-28 1988-11-09 Tokyo Electron Ltd Development device
US5025280A (en) * 1987-12-17 1991-06-18 Texas Instruments Incorporated Immersion development and rinse machine and process
US4902608A (en) * 1987-12-17 1990-02-20 Texas Instruments Incorporated Immersion development and rinse machine and process
US4857430A (en) * 1987-12-17 1989-08-15 Texas Instruments Incorporated Process and system for determining photoresist development endpoint by effluent analysis
US5168886A (en) * 1988-05-25 1992-12-08 Semitool, Inc. Single wafer processor
US5224504A (en) * 1988-05-25 1993-07-06 Semitool, Inc. Single wafer processor
US5168887A (en) * 1990-05-18 1992-12-08 Semitool, Inc. Single wafer processor apparatus
US5230743A (en) * 1988-05-25 1993-07-27 Semitool, Inc. Method for single wafer processing in which a semiconductor wafer is contacted with a fluid
US4922277A (en) * 1988-11-28 1990-05-01 The United States Of America As Represented By The Secretary Of The Air Force Silicon wafer photoresist developer
US5155961A (en) * 1989-08-14 1992-10-20 Amsted Industries Incorporated Lightweight cooling tower with cruciform columns
US5030980A (en) * 1990-03-19 1991-07-09 Lewis John D Photo development apparatus
JPH0411728A (en) * 1990-04-30 1992-01-16 Seiichiro Sogo Washer for semiconductor wafer
US6375741B2 (en) * 1991-03-06 2002-04-23 Timothy J. Reardon Semiconductor processing spray coating apparatus
US6355397B1 (en) * 1997-04-11 2002-03-12 Taiwan Semiconductor Manufacturing Company Method and apparatus for improving resist pattern developing
KR100271764B1 (en) * 1997-12-24 2000-12-01 윤종용 Developer for semiconductor device fabrication and its controling method
US6516815B1 (en) * 1999-07-09 2003-02-11 Applied Materials, Inc. Edge bead removal/spin rinse dry (EBR/SRD) module
JP3713447B2 (en) * 2001-04-05 2005-11-09 東京エレクトロン株式会社 Development processing equipment
US6824612B2 (en) 2001-12-26 2004-11-30 Applied Materials, Inc. Electroless plating system
US6770565B2 (en) 2002-01-08 2004-08-03 Applied Materials Inc. System for planarizing metal conductive layers
JP2012181523A (en) * 2011-02-28 2012-09-20 Rohm & Haas Electronic Materials Llc Developer composition and method of forming photolithographic pattern
US10698313B2 (en) * 2017-11-22 2020-06-30 Taiwan Semiconductor Manufacturing Co., Ltd. Apparatus and method for developing a photoresist coated substrate

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT246807B (en) * 1963-09-23 1966-05-10 Siegfried Ing Gessner Device for setting the spatial position of a preparation plate
CH435908A (en) * 1965-12-31 1967-05-15 Balzers Patent Beteilig Ag Device for adjusting the spatial position of parts to be treated in a vacuum chamber
US3769992A (en) 1971-12-06 1973-11-06 Fluoroware Inc Spray processing machine
US3849906A (en) 1973-11-07 1974-11-26 Ibm Rotary fluid applicator
US3933539A (en) * 1973-12-26 1976-01-20 Texas Instruments Incorporated Solution growth system for the preparation of semiconductor materials
JPS513743U (en) * 1974-06-25 1976-01-12
US3990462A (en) 1975-05-19 1976-11-09 Fluoroware Systems Corporation Substrate stripping and cleaning apparatus
US4021278A (en) * 1975-12-12 1977-05-03 International Business Machines Corporation Reduced meniscus-contained method of handling fluids in the manufacture of semiconductor wafers
US4161356A (en) 1977-01-21 1979-07-17 Burchard John S Apparatus for in-situ processing of photoplates
US4132567A (en) 1977-10-13 1979-01-02 Fsi Corporation Apparatus for and method of cleaning and removing static charges from substrates
US4197000A (en) 1978-05-23 1980-04-08 Fsi Corporation Positive developing method and apparatus
JPS552213A (en) * 1978-06-19 1980-01-09 Chiyou Lsi Gijutsu Kenkyu Kumiai Developing method
JPS55108742U (en) * 1979-01-25 1980-07-30
US4286541A (en) 1979-07-26 1981-09-01 Fsi Corporation Applying photoresist onto silicon wafers
JPS5655048A (en) * 1979-10-11 1981-05-15 Matsushita Electric Ind Co Ltd Developing method and device therefor
JPS5666031A (en) * 1979-11-01 1981-06-04 Toshiba Corp Pattern formation of positive resist

Also Published As

Publication number Publication date
EP0089454B1 (en) 1986-11-05
JPS58168229A (en) 1983-10-04
JPH0136697B2 (en) 1989-08-02
EP0089454A1 (en) 1983-09-28
US4429983A (en) 1984-02-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee