DE3315230A1 - Housing, especially for electrical components inserted into the housing, whose free space is filled with potting compound - Google Patents

Housing, especially for electrical components inserted into the housing, whose free space is filled with potting compound

Info

Publication number
DE3315230A1
DE3315230A1 DE19833315230 DE3315230A DE3315230A1 DE 3315230 A1 DE3315230 A1 DE 3315230A1 DE 19833315230 DE19833315230 DE 19833315230 DE 3315230 A DE3315230 A DE 3315230A DE 3315230 A1 DE3315230 A1 DE 3315230A1
Authority
DE
Germany
Prior art keywords
housing
wall
potting compound
undercuts
filled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19833315230
Other languages
German (de)
Inventor
Josef Dipl Ing Dirmeyer
Hans Kinzler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE19833315230 priority Critical patent/DE3315230A1/en
Publication of DE3315230A1 publication Critical patent/DE3315230A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing

Abstract

A housing (1), especially a housing for a radio-suppression filter, having electrical components which are inserted into the housing, and whose free space is filled with potting compound, the housing inner wall having undercuts (3), for example so-called dovetails. <IMAGE>

Description

Gehäuse, insbesondere für in das Gehäuse eingesetzteHousing, especially for used in the housing

elektrische Bauelemente, dessen freier Raum mit Verqußmasse gefüllt ist.electrical components, the free space of which is filled with sealing compound is.

Die Erfindung betrifft ein Gehäuse, insbesondere für ein elektrisches Entstörfilter mit in das Gehäuse eingesetzten elektrischen Bauelementen, dessen freier Raum mit Vergußmasse, z.B. Epoxidharz, gefüllt ist.The invention relates to a housing, in particular for an electrical one Interference filter with electrical components inserted into the housing, its free space is filled with potting compound, e.g. epoxy resin.

An ein in ein Filtergehäuse eingesetztes und eingegossenes Entstörfilter werden hohe Temperatur-Schock-Forderungen gestellt. So darf z.B. bei Rundfiltern, d.h. bei Filtern mit einem Aluminium-Filtergehäuse mit kreiszylindrischem Querschnitt die Vergußmasse, üblicherweise Epoxidharz, auch bei 20 schockartig auftretenden Temperaturstürzen von +85 0C auf -25 0C nicht von der Ge-Gehäusewand abheben. Um dies zu gewährleisten, wurde bislang die Gehäuseinnenwand von Hand mittels geeigneten Fräßwerkzeugen aufgerauht. Die so geschaffene Oberflächenrauhigkeit erleichtert das "Verkrallen" der Vergußmasse mit der Gehäusewand.To an interference suppression filter that is inserted and cast in a filter housing high temperature shock requirements are made. For example, in the case of round filters, i.e. for filters with an aluminum filter housing with a circular cylindrical cross-section the potting compound, usually epoxy resin, even with 20 sudden occurrences Temperature drops from +85 0C to -25 0C do not stand out from the Ge housing wall. Around To ensure this, the inner wall of the housing was previously made by hand using suitable Milling tools roughened. The surface roughness created in this way facilitates the "clawing" of the potting compound with the housing wall.

Der vorliegenden Erfindung liegt die Aufgabe zugrunde, die Innenwand der eingangs genannten Gehäuse so zu gestalten, daß die Haftfähigkeit der Vergußmasse an der Gehäuse-Innenwand erhöht und gleichzeitig das Wärmeableitvermögen des Gehäuses verbessert wird.The present invention is based on the object, the inner wall to design the aforementioned housing so that the adhesiveness of the potting compound on the inside wall of the housing increases and at the same time the heat dissipation capacity of the housing is improved.

#ur Lösung dieser Aufgabe sieht die Erfindung bei einem Gehäuse gemäß Oberbegriff des Anspruchs vor, daß die Gehäuse-Innenwand Hinterschneidungen und zwar vorzugsweise über die Gehäuse-Innenwand verteilte Hinterschneidungen aufweist.#To achieve this object, the invention provides a housing according to The preamble of claim that the housing inner wall undercuts and although preferably undercuts distributed over the inside wall of the housing having.

Durch die Hinterschneidungen wird das an sich auf den unterschiedlichen Ausdehnungskoeffizienten des Gehäuse-und des Vergußmaterials beruhende Abheben der Vergußmasse von der Gehäusewand weitgehend unterdrückt.Due to the undercuts, this becomes in itself on the different Expansion coefficient of the housing and the potting material based lifting of the Potting compound largely suppressed from the housing wall.

Zusätzlich wird durch die Hinterschneidungen und die damit geschaffene Oberflächenvergrößerung der Gehäuse-Innenwand eine größere Fläche für die Wärmeabfuhr geschaffen.In addition, the undercuts and the resulting Surface enlargement of the inside wall of the housing, a larger area for heat dissipation created.

In einer bevorzugten Ausführungsform sind parallel zur Gehäusemantellinie und vorzugsmäßig gleichmäßig verteilt über die Gehäuse-Innenwand hinterschnittene Rippen, z.3. sogenannte Schwalbenschwänze, an die Gehäuse-Innenwand einstückig angeformt. Beispielsweise kann hierzu als Gehäuse ein fließ- oder stranggepreßtes Aluminiumgehäuse vorgesehen sein, das mittels eines auf seiner Mantelfläche mit entsprechenden Hinterschneidungen ausgebildeten Formstempels gefertigt ist.In a preferred embodiment, they are parallel to the casing shell line and undercut preferably evenly distributed over the inner wall of the housing Ribs, e.g. 3. so-called dovetail, molded in one piece onto the inner wall of the housing. For example, an extruded or extruded aluminum housing can be used as the housing be provided by means of a on its outer surface with corresponding undercuts trained forming stamp is made.

Die Erfindung wird nachstehend anhand eines Ausführungsbeispieles näher erläutert. Die einzige Figur zeigt dabei in teilweise geschnittener und perspektivischer Ansicht ein Gehäuse 1 samt Gehäuseboden 2 mit Hinterschneidungen 3, die als sogenannte Schwalbenschwänze ausgebildet sind. Die zur Veranschaulichung nicht dargestellte Vergußmasse hintergreift die Kanten 4 der Hinterschneidungen 3 und dringt in die zwischen der Gehäuseinnenwand und den Hinterschneidungen gebildeten Räume ein.The invention is explained below using an exemplary embodiment explained in more detail. The only figure shows it in partially cut and perspective View of a housing 1 including housing base 2 with undercuts 3, which are known as Swallowtails are formed. The one not shown for illustration Potting compound engages behind the edges 4 of the undercuts 3 and penetrates into the spaces formed between the housing inner wall and the undercuts.

- Leerseite -- blank page -

Claims (6)

Patentansprüche Gehäuse, insbesondere für in das Gehäuse eingesetzte elektrische Bauelemente, dessen freier Raum mit Vergußmasse gefüllt ist, d a d u r c h g e k e n n -z e i c h n e t, daß die Gehäuse-Innenwand Hinterschneidungen (3) aufweist. Housing claims, in particular for those used in the housing electrical components whose free space is filled with potting compound, d a d u r c h g e k e n n -z e i c h n e t that the housing inner wall has undercuts (3). 2. Gehäuse nach Anspruch 1, d a d u r c h g e k e n nz e i c h n e t, daß die Hinterschneidungen (3) über die Gehäuse-Innenwand verteilt angeordnet sind. 2. Housing according to claim 1, d a d u r c h g e k e n nz e i c h n e t that the undercuts (3) are arranged distributed over the inner wall of the housing are. 3. Gehäuse nach Anspruch 1 und 2, d a d u r c h g ek e n n z e i c h n e t, daß parallel zur Gehäuse-Mantellinie und vorzugsw#eise gleichmäßig verteilt über die Gehäuse-Innenwand hinterschnittene Rippen an die Gehäuse-Innenwand angeformt sind. 3. Housing according to claim 1 and 2, d a d u r c h g ek e n n z e i c h n e t that parallel to the casing surface line and preferably evenly distributed Ribs undercut over the inner wall of the housing are formed on the inner wall of the housing are. 4. Gehäuse nach Anspruch 1 und 3, d a d u r c h g ek e n n z e i c h n e t, daß die Rippen als Schwalbenschwänze (3) ausgebildet sind. 4. Housing according to claim 1 and 3, d a d u r c h g ek e n n z e i c h n e t that the ribs are designed as dovetails (3). 5. Gehäuse nach Anspruch 1 und wenigstens einem der vorhergehenden Ansprüche, d a d u r c h g e k e n nz e i c h n e t, daß als Gehäuse (1) ein fließ- oder stranggepreßtes Aluminiumgehäuse vorgesehen ist, das mittels eines auf seiner Mantelfläche mit entsprechenden Hinterschneidungen ausgebildeten Formstempels gefertigt ist. 5. Housing according to claim 1 and at least one of the preceding Claims that the housing (1) is a flowing or extruded aluminum housing is provided, which by means of a on his Outer surface made with corresponding undercuts formed forming stamp is. 6. Gehäuse nach Anspruch 1 und wenigstens einem der vorhergehenden Ansprüche, d a d u r c h g e k e n nz e i c h n et , daß als Gehäuse (1) ein Becher mit kreisscheibenförmigem Querschnitt vorgesehen ist. 6. Housing according to claim 1 and at least one of the preceding Claims that the housing (1) is a cup is provided with a circular disk-shaped cross-section.
DE19833315230 1983-04-27 1983-04-27 Housing, especially for electrical components inserted into the housing, whose free space is filled with potting compound Withdrawn DE3315230A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19833315230 DE3315230A1 (en) 1983-04-27 1983-04-27 Housing, especially for electrical components inserted into the housing, whose free space is filled with potting compound

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19833315230 DE3315230A1 (en) 1983-04-27 1983-04-27 Housing, especially for electrical components inserted into the housing, whose free space is filled with potting compound

Publications (1)

Publication Number Publication Date
DE3315230A1 true DE3315230A1 (en) 1984-10-31

Family

ID=6197476

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19833315230 Withdrawn DE3315230A1 (en) 1983-04-27 1983-04-27 Housing, especially for electrical components inserted into the housing, whose free space is filled with potting compound

Country Status (1)

Country Link
DE (1) DE3315230A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4033999A1 (en) * 1990-10-25 1992-04-30 Siemens Ag CIRCUIT MODULE WITH SAFETY HOUSING
WO2001063995A1 (en) * 2000-02-24 2001-08-30 Optimel Schmelzgusstechnik Gmbh & Co. Kg Device for accommodating electronic components

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4033999A1 (en) * 1990-10-25 1992-04-30 Siemens Ag CIRCUIT MODULE WITH SAFETY HOUSING
WO2001063995A1 (en) * 2000-02-24 2001-08-30 Optimel Schmelzgusstechnik Gmbh & Co. Kg Device for accommodating electronic components
US6674002B2 (en) 2000-02-24 2004-01-06 Optimel Schmelzgusstechnik Gmbh & Co. Kg Device for accomodating electronic components

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