DE3307669A1 - Koppelanordnung zwischen einem elektro-optischen und/oder opto-elektrischen halbleiterbauelement und einem lichtwellenleiter - Google Patents

Koppelanordnung zwischen einem elektro-optischen und/oder opto-elektrischen halbleiterbauelement und einem lichtwellenleiter

Info

Publication number
DE3307669A1
DE3307669A1 DE19833307669 DE3307669A DE3307669A1 DE 3307669 A1 DE3307669 A1 DE 3307669A1 DE 19833307669 DE19833307669 DE 19833307669 DE 3307669 A DE3307669 A DE 3307669A DE 3307669 A1 DE3307669 A1 DE 3307669A1
Authority
DE
Germany
Prior art keywords
coupling arrangement
semiconductor component
arrangement according
optical
depression
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19833307669
Other languages
German (de)
English (en)
Other versions
DE3307669C2 (enrdf_load_stackoverflow
Inventor
Manfred 7900 Ulm Rode
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Priority to DE19833307669 priority Critical patent/DE3307669A1/de
Publication of DE3307669A1 publication Critical patent/DE3307669A1/de
Application granted granted Critical
Publication of DE3307669C2 publication Critical patent/DE3307669C2/de
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/30—Optical coupling means for use between fibre and thin-film device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
    • G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3684—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
    • G02B6/3696—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier by moulding, e.g. injection moulding, casting, embossing, stamping, stenciling, printing, or with metallic mould insert manufacturing using LIGA or MIGA techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
DE19833307669 1983-03-04 1983-03-04 Koppelanordnung zwischen einem elektro-optischen und/oder opto-elektrischen halbleiterbauelement und einem lichtwellenleiter Granted DE3307669A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19833307669 DE3307669A1 (de) 1983-03-04 1983-03-04 Koppelanordnung zwischen einem elektro-optischen und/oder opto-elektrischen halbleiterbauelement und einem lichtwellenleiter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19833307669 DE3307669A1 (de) 1983-03-04 1983-03-04 Koppelanordnung zwischen einem elektro-optischen und/oder opto-elektrischen halbleiterbauelement und einem lichtwellenleiter

Publications (2)

Publication Number Publication Date
DE3307669A1 true DE3307669A1 (de) 1984-09-06
DE3307669C2 DE3307669C2 (enrdf_load_stackoverflow) 1992-05-21

Family

ID=6192501

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19833307669 Granted DE3307669A1 (de) 1983-03-04 1983-03-04 Koppelanordnung zwischen einem elektro-optischen und/oder opto-elektrischen halbleiterbauelement und einem lichtwellenleiter

Country Status (1)

Country Link
DE (1) DE3307669A1 (enrdf_load_stackoverflow)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2573220A1 (fr) * 1984-11-13 1986-05-16 Cit Alcatel Source optique
DE3531734A1 (de) * 1985-09-05 1987-03-12 Siemens Ag Einrichtung zur positionierung eines halbleiterlasers mit selbstjustierender wirkung fuer eine anzukoppelnde glasfaser
WO1987002518A1 (en) * 1985-10-16 1987-04-23 British Telecommunications Public Limited Company Mounting a component to a substrate
DE3542020A1 (de) * 1984-09-14 1987-06-04 Licentia Gmbh Verfahren zum koppeln optischer bauelemente und anordnung zur durchfuehrung des verfahrens
US4760568A (en) * 1985-09-26 1988-07-26 Mitsubishi Denki Kabushiki Kaisha Optical information processing device
WO1990009606A1 (en) * 1989-02-13 1990-08-23 Litton Systems, Inc. Methods for rugged attachement of fibers to integrated optics chips and product thereof
EP0635737A1 (en) * 1993-07-23 1995-01-25 Lucas Industries Public Limited Company Brazed bonding of optical glass fiber and silicon substrate
WO1998026885A1 (en) * 1996-12-19 1998-06-25 Telefonaktiebolaget Lm Ericsson (Publ) Micro-replication in metal
EP0871049A1 (en) * 1997-04-11 1998-10-14 Hewlett-Packard Company Semiconductor device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4240460C2 (de) * 1992-12-02 1995-01-05 Ant Nachrichtentech Vorrichtung zur lösbaren Verbindung von Lichtwellenleitern

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2620158A1 (de) * 1975-05-14 1976-11-25 Philips Nv Vorrichtung zur kupplung einer lichtquelle mit einer optischen faser
DE2829548A1 (de) * 1977-07-08 1979-01-11 Hitachi Ltd Traeger fuer eine lichtemittierende vorrichtung
EP0006042A1 (fr) * 1978-05-18 1979-12-12 Thomson-Csf Procédé de fabrication d'une source laser à semiconducteur

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2620158A1 (de) * 1975-05-14 1976-11-25 Philips Nv Vorrichtung zur kupplung einer lichtquelle mit einer optischen faser
DE2829548A1 (de) * 1977-07-08 1979-01-11 Hitachi Ltd Traeger fuer eine lichtemittierende vorrichtung
EP0006042A1 (fr) * 1978-05-18 1979-12-12 Thomson-Csf Procédé de fabrication d'une source laser à semiconducteur

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3542020A1 (de) * 1984-09-14 1987-06-04 Licentia Gmbh Verfahren zum koppeln optischer bauelemente und anordnung zur durchfuehrung des verfahrens
US4701013A (en) * 1984-11-13 1987-10-20 Compagnie Industrielle Des Telecommunications Optical source with optical fiber carrier
EP0183124A1 (fr) * 1984-11-13 1986-06-04 Alcatel Cit Source optique
FR2573220A1 (fr) * 1984-11-13 1986-05-16 Cit Alcatel Source optique
DE3531734A1 (de) * 1985-09-05 1987-03-12 Siemens Ag Einrichtung zur positionierung eines halbleiterlasers mit selbstjustierender wirkung fuer eine anzukoppelnde glasfaser
US4768199A (en) * 1985-09-05 1988-08-30 Siemens Aktiengesellschaft Mechanism for self-adjusting positioning of a semiconductor laser relative to an optical fiber to be coupled thereto
US4760568A (en) * 1985-09-26 1988-07-26 Mitsubishi Denki Kabushiki Kaisha Optical information processing device
WO1987002474A1 (en) * 1985-10-16 1987-04-23 British Telecommunications Public Limited Company Positioning optical components and waveguides
EP0226296A1 (en) * 1985-10-16 1987-06-24 BRITISH TELECOMMUNICATIONS public limited company Optical component and waveguide assembly
EP0223414A1 (en) * 1985-10-16 1987-05-27 BRITISH TELECOMMUNICATIONS public limited company Mounting a component to a substrate
WO1987002518A1 (en) * 1985-10-16 1987-04-23 British Telecommunications Public Limited Company Mounting a component to a substrate
US4802727A (en) * 1985-10-16 1989-02-07 British Telecommunications Public Limited Company Positioning optical components and waveguides
US4846930A (en) * 1985-10-16 1989-07-11 British Telecommunications Public Limited Company Mounting a component to a substrate
US4896936A (en) * 1985-10-16 1990-01-30 British Telecommunications Component mounted to substrate with overlying bridge-shaped supporte
WO1990009606A1 (en) * 1989-02-13 1990-08-23 Litton Systems, Inc. Methods for rugged attachement of fibers to integrated optics chips and product thereof
EP0635737A1 (en) * 1993-07-23 1995-01-25 Lucas Industries Public Limited Company Brazed bonding of optical glass fiber and silicon substrate
WO1998026885A1 (en) * 1996-12-19 1998-06-25 Telefonaktiebolaget Lm Ericsson (Publ) Micro-replication in metal
CN1072993C (zh) * 1996-12-19 2001-10-17 艾利森电话股份有限公司 在金属上进行显微复制的方法和装置
EP0871049A1 (en) * 1997-04-11 1998-10-14 Hewlett-Packard Company Semiconductor device

Also Published As

Publication number Publication date
DE3307669C2 (enrdf_load_stackoverflow) 1992-05-21

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Legal Events

Date Code Title Description
8127 New person/name/address of the applicant

Owner name: LICENTIA PATENT-VERWALTUNGS-GMBH, 6000 FRANKFURT,

8110 Request for examination paragraph 44
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee