DE3305105A1 - Process for producing a base material for circuit boards - Google Patents

Process for producing a base material for circuit boards

Info

Publication number
DE3305105A1
DE3305105A1 DE19833305105 DE3305105A DE3305105A1 DE 3305105 A1 DE3305105 A1 DE 3305105A1 DE 19833305105 DE19833305105 DE 19833305105 DE 3305105 A DE3305105 A DE 3305105A DE 3305105 A1 DE3305105 A1 DE 3305105A1
Authority
DE
Germany
Prior art keywords
base material
producing
plates
circuit boards
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19833305105
Other languages
German (de)
Inventor
Karl-Heinz 7916 Nersingen Pfeffer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Priority to DE19833305105 priority Critical patent/DE3305105A1/en
Publication of DE3305105A1 publication Critical patent/DE3305105A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/32—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof from compositions containing microballoons, e.g. syntactic foams
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0254—Microballoons or hollow filler particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Laminated Bodies (AREA)

Abstract

A dense packing of small hollow beads (microballoons) is cast with a resin, especially epoxy or polyimide resin, to form sheets. A glass fibre fabric can be applied to the surface for mechanical stiffening.

Description

Verfahren zur Herstellung eines Basismaterials für Leiter-Process for the production of a base material for conductor

platten Die Erfindung betrifft ein Verfahren nach dem Oberbegriff des Anspruchs 1.plates The invention relates to a method according to the preamble of claim 1.

Es sind Basismaterialien für gedruckte Schaltungen mit guten dielektrischen Eigenschaften bekannt, insbesondere das Material Teflon (PTFE). Diese Materialien sind teuer und schwer, weisen einen relativ großen Wärme-Ausdehnungskoeffizienten auf und sind schlecht verklebbar.There are base materials for printed circuits with good dielectric Properties known, in particular the material Teflon (PTFE). These materials are expensive and heavy, have a relatively high coefficient of thermal expansion and are difficult to glue.

Aufgabe der Erfindung ist es, ein Verfahren der eingangs genannten Art anzugeben, welches ein Basismaterial ergibt, das bei ebenfalls guten dielektrischen Eigenschaften die vorgenannten Nachteile nicht aufweist.The object of the invention is to provide a method of the type mentioned at the beginning Specify type, which results in a base material that is also good dielectric Properties does not have the aforementioned disadvantages.

Die Erfindung ist im Patentanspruch 1 gekennzeichnet.The invention is characterized in claim 1.

Die weiteren Ansprüche beinhalten vorteilhafte Ausbildungen bzw. Weiterbildungen der Erfindung.The further claims contain advantageous designs or further developments the invention.

Gemäß der Erfindung wird eine dichte Packung von kleinen hohlen Kugeln, sog. Microbalons, die kleiner als 200 /um sind, mit Harz, vorzugsweise einem Epoxidharz oder Polyimidharz, zu Platten vergossen. Dieser physikalisch hergestellte Schaum, auch syntaktischer Schaum genannt, ist wegen der hohen Festigkeit der Kugeln und deren großer Mantelfläche mechanisch sehr stabil.According to the invention, a close packing of small hollow spheres, so-called microballoons, which are smaller than 200 μm, with resin, preferably an epoxy resin or polyimide resin, cast into sheets. This physically produced foam, Also called syntactic foam, is because of the high strength of the balls and whose large surface area is mechanically very stable.

Zur Erhöhung der Biegefestigkeit werden die Platten vorteilhafterweise noch mit einem Glasfasergewebe auf den Oberflächen verstärkt.To increase the flexural strength, the plates are advantageously reinforced with a glass fiber fabric on the surfaces.

Kaschiert man die Platten schließlich noch mit Metallfolien, so erhält man ein fertiges Basismaterial für gedruckte Schaltungen. Die Figur zeigt einen Schnitt durch eine solche Leiterplatte.If you finally laminate the plates with metal foils, you get a ready-made base material for printed circuits. The figure shows one Section through such a circuit board.

Das nach dem erfindungsgemäßen Verfahren hergestellte Basismaterial weist sehr günstige dielektrische Eigenschaften auf. Es ist leicht, mechanisch stabil und gut zu verarbeiten. Der Wärme-Ausdehnungskoeffizient ist in allen Richtungen gleichmäßig klein. Metallfolien sind mit dem Harz gut verklebbar.The base material produced by the method according to the invention has very favorable dielectric properties. It is light, mechanically stable and easy to work with. The coefficient of thermal expansion is in all directions evenly small. Metal foils can be easily glued to the resin.

Claims (6)

Patentansprüche Verfahren zur Herstellung eines Basismaterials für Leiterplatten, dadurch gekennzeichnet, daß eine dichte Packung von kleinen hohlen Kunststoff- oder Glaskugeln mit einem Harz zu Platten vergossen wird.A method for producing a base material for Printed circuit boards, characterized in that a tight packing of small hollow Plastic or glass spheres are cast into plates with a resin. 2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß die Kugeln einen Durchmesser kleiner 200 /um aufweisen und die Schüttdichte e 0,2 kg/dm3 beträgt.2. The method according to claim 1, characterized in that the balls have a diameter of less than 200 μm and the bulk density e is 0.2 kg / dm3. 3. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß ein Epoxidharz verwendet wird.3. The method according to claim 1 or 2, characterized in that a Epoxy resin is used. 4. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß ein Polyimidharz verwendet wird.4. The method according to claim 1 or 2, characterized in that a Polyimide resin is used. 5. Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß auf die Oberflächen der Platten ein Glasfasergewebe aufgebracht wird.5. The method according to any one of the preceding claims, characterized in, that a glass fiber fabric is applied to the surfaces of the plates. 6. Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß in einem letzten Schritt die Oberflächen der Platten mit Metallfolien kaschiert werden.6. The method according to any one of the preceding claims, characterized in, that in a last step, the surfaces of the plates are laminated with metal foils will.
DE19833305105 1983-02-15 1983-02-15 Process for producing a base material for circuit boards Withdrawn DE3305105A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19833305105 DE3305105A1 (en) 1983-02-15 1983-02-15 Process for producing a base material for circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19833305105 DE3305105A1 (en) 1983-02-15 1983-02-15 Process for producing a base material for circuit boards

Publications (1)

Publication Number Publication Date
DE3305105A1 true DE3305105A1 (en) 1984-08-16

Family

ID=6190839

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19833305105 Withdrawn DE3305105A1 (en) 1983-02-15 1983-02-15 Process for producing a base material for circuit boards

Country Status (1)

Country Link
DE (1) DE3305105A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4209381A1 (en) * 1991-03-29 1992-10-01 Matsushita Electric Works Ltd POLYIMIDE COMPOSITION AND PREPREG AND LAMINATE MADE THEREOF
EP1051061A1 (en) * 1999-05-03 2000-11-08 JSR Corporation Low dielectric composition, insulating material, sealing material, and circuit board
CN102625574A (en) * 2012-03-31 2012-08-01 浙江华正新材料股份有限公司 Low-dielectric-constant PCB (Printed Circuit Board) base plate and manufacturing method thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4209381A1 (en) * 1991-03-29 1992-10-01 Matsushita Electric Works Ltd POLYIMIDE COMPOSITION AND PREPREG AND LAMINATE MADE THEREOF
EP1051061A1 (en) * 1999-05-03 2000-11-08 JSR Corporation Low dielectric composition, insulating material, sealing material, and circuit board
US6146749A (en) * 1999-05-03 2000-11-14 Jsr Corporation Low dielectric composition, insulating material, sealing material, and circuit board
CN102625574A (en) * 2012-03-31 2012-08-01 浙江华正新材料股份有限公司 Low-dielectric-constant PCB (Printed Circuit Board) base plate and manufacturing method thereof
CN102625574B (en) * 2012-03-31 2014-08-06 浙江华正新材料股份有限公司 Low-dielectric-constant PCB (Printed Circuit Board) base plate and manufacturing method thereof

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