CN102625574A - Low-dielectric-constant PCB (Printed Circuit Board) base plate and manufacturing method thereof - Google Patents
Low-dielectric-constant PCB (Printed Circuit Board) base plate and manufacturing method thereof Download PDFInfo
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- CN102625574A CN102625574A CN2012100941896A CN201210094189A CN102625574A CN 102625574 A CN102625574 A CN 102625574A CN 2012100941896 A CN2012100941896 A CN 2012100941896A CN 201210094189 A CN201210094189 A CN 201210094189A CN 102625574 A CN102625574 A CN 102625574A
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- hollow glass
- resin liquid
- pcb substrate
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 239000011347 resin Substances 0.000 claims abstract description 54
- 229920005989 resin Polymers 0.000 claims abstract description 53
- 239000011521 glass Substances 0.000 claims abstract description 45
- 239000007788 liquid Substances 0.000 claims abstract description 35
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 29
- 239000011889 copper foil Substances 0.000 claims abstract description 28
- 229920001721 polyimide Polymers 0.000 claims abstract description 23
- 239000004744 fabric Substances 0.000 claims abstract description 19
- 239000009719 polyimide resin Substances 0.000 claims abstract description 18
- 239000004643 cyanate ester Substances 0.000 claims abstract description 17
- 238000002156 mixing Methods 0.000 claims abstract description 14
- 229920006026 co-polymeric resin Polymers 0.000 claims abstract description 12
- 239000000758 substrate Substances 0.000 claims description 34
- 238000003756 stirring Methods 0.000 claims description 25
- 238000004026 adhesive bonding Methods 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 21
- -1 diallyl bisphenol Chemical compound 0.000 claims description 14
- 238000007334 copolymerization reaction Methods 0.000 claims description 10
- 238000004945 emulsification Methods 0.000 claims description 10
- 230000008569 process Effects 0.000 claims description 10
- 238000013459 approach Methods 0.000 claims description 9
- 238000005304 joining Methods 0.000 claims description 9
- 238000003825 pressing Methods 0.000 claims description 9
- 238000010792 warming Methods 0.000 claims description 9
- 238000005303 weighing Methods 0.000 claims description 9
- 229930185605 Bisphenol Natural products 0.000 claims description 6
- WOCGGVRGNIEDSZ-UHFFFAOYSA-N 4-[2-(4-hydroxy-3-prop-2-enylphenyl)propan-2-yl]-2-prop-2-enylphenol Chemical compound C=1C=C(O)C(CC=C)=CC=1C(C)(C)C1=CC=C(O)C(CC=C)=C1 WOCGGVRGNIEDSZ-UHFFFAOYSA-N 0.000 abstract description 9
- 238000001035 drying Methods 0.000 abstract description 8
- 239000004642 Polyimide Substances 0.000 abstract description 5
- 239000004005 microsphere Substances 0.000 abstract description 4
- 230000008901 benefit Effects 0.000 abstract description 3
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 239000011152 fibreglass Substances 0.000 abstract 1
- 229910001220 stainless steel Inorganic materials 0.000 description 30
- 239000010935 stainless steel Substances 0.000 description 30
- 238000012360 testing method Methods 0.000 description 14
- 238000001816 cooling Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- AHZMUXQJTGRNHT-UHFFFAOYSA-N [4-[2-(4-cyanatophenyl)propan-2-yl]phenyl] cyanate Chemical compound C=1C=C(OC#N)C=CC=1C(C)(C)C1=CC=C(OC#N)C=C1 AHZMUXQJTGRNHT-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000011161 development Methods 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
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Abstract
The invention discloses a low-dielectric-constant PCB (Printed Circuit Board) base plate and a manufacturing method thereof. The PCB base plate is formed in the way that copper foils are coated and pressed on two surfaces of piled one or overlapped multiple prepregs, wherein the prepreg is manufactured by coating and drying resin through fiberglass fabric, wherein the resin is prepared by uniformly mixing the following components in parts by weight: 68.7 parts of polyimide resin liquid, 31.3 parts of cyanate ester resin liquid and 3-4 parts of diallyl bisphenol A, and 2-5 parts of hollow glass microspheres are added to the resin. The PCB base plate disclosed by the invention has the advantages that internal advantages of the hollow glass microspheres with superfine grain diameter are fully developed; in addition, Dk is reduced to below 3.0 after a few of hollow glass microspheres are added to a polyimide/cyanate copolymer resin system to be blended and emulsified.
Description
Technical field
The invention belongs to electronic material manufacturing technology field, particularly dielectric materials manufacturing technology field, be specifically related to a kind of low-k PCB substrate and manufacturing approach thereof.
Background technology
Along with the development that electronic information technology is advanced by leaps and bounds, electronic product develops towards the direction of light weight slimming, high performance and multifunction gradually.Got into since 21 century, particularly in recent years, along with the integrated level of very lagre scale integrated circuit (VLSIC) is increasingly high, the element very small dimensions developed to deep-submicron, even had reached the 50nm level.
In the advanced electronic manufacturing technology of frequency PCB substrate field, be badly in need of adopting some low-k (D
k) and low-dielectric loss (D
f) material, especially some low D
k, low D
fResin material.Reducing gradually when the characteristic size of electronic devices and components is that integrated level is when improving constantly; Can cause that resistance-capacitance (RC) postpones to rise; Thereby a series of problems such as signal transmission delay, noise jamming enhancing and power loss increase occur, this will greatly limit the development of electronic devices and components high speed performance.Reduce RC and postpone two approach are arranged with power loss: the one, reduce conductor resistance R, just use the traditional aluminium of copper (20 ℃ time resistivity be 11678 μ Ω m) replacement (20 ℃ time resistivity be 21655 μ Ω m) to process lead; Another one (also being prior simultaneously) is to reduce the parasitic capacitance C that dielectric layer brings.Because capacitor C is proportional to dielectric constant D
kSo, the low-k (D that just needs development of new, low cost and have superperformance
k＜3) material replaces traditional SiO2 (D
kBe about 4.0) make dielectric layer.
At present, for reducing the D of insulating material
k, adopt two kinds of methods of blending and modifying or modification by copolymerization usually.These two kinds of methods can be the D of insulating material
kBe reduced to about 3.5, satisfy general low dielectric requirements, but little for high-performance, high integrated circuit application property.So, be necessary existing method is improved and innovated, to address the above problem.
Summary of the invention
For solving the problems of the technologies described above, the invention discloses a kind of low-k PCB substrate and manufacturing approach thereof.
Technical scheme of the present invention has fully been excavated the inherent advantage of ultra-fine grain diameter hollow glass microballoon, and it is added in polyimides/cyanate copolymer resins system on a small quantity, can make D after the blend emulsification
kBe reduced to below 3.0.
The present invention takes following technical scheme: a kind of low-k PCB substrate; Join by a slice prepreg or multi-disc prepreg are folded that Copper Foil is respectively covered on two surfaces, back and compacting forms; Described prepreg carries out gluing by resin through glass cloth and oven dry makes; Described resin evenly is mixed by weight by following component and forms: 68.7 parts of polyimide resin liquid, 31.3 parts of cyanate ester resin liquid, 3-4 part diallyl bisphenol add 2-5 part hollow glass microballoon in the described resin.
Preferably, the average grain diameter of hollow glass microballoon is 150 μ m, 100 μ m, 50 μ m, 25 μ m, 15 μ m, 10 μ m or 5 μ m.
Preferably, the addition of hollow glass microballoon is 3.0% of polyimide resin liquid, a cyanate ester resin liquid mixing copolymer resins system weight.
The invention also discloses a kind of manufacturing approach of low-k PCB substrate, it carries out as follows:
One, mixed with resin copolymerization
Take by weighing 68.7 parts of polyimide resin liquid, 31.3 parts of cyanate ester resin liquid by weight, and place mixing stirring under 100～105 ℃ of temperature, add diallyl bisphenol 3-4 part; Be warming up to 120～125 ℃; Continue to stir, to gel time 270～350s, be cooled to room temperature; Add hollow glass microballoon 2-5 part, stir, move to the mulser internal emulsification;
Two, gluing
The resin that the first step is made adopts glass cloth to carry out gluing and oven dry, makes prepreg;
Three, folded joining
Need according to thickness, several pieces were made by second step prepreg is folded joins;
Four, compacting
The folded prepreg upper and lower faces for preparing of the 3rd step is respectively covered a Copper Foil; And it is corresponding superimposed with stainless steel template, brown paper; Order is from top to bottom: brown paper (15-25 opens), stainless steel template, Copper Foil, prepreg, Copper Foil, stainless steel template, brown paper (15-25 opens); Send into vacuum press then and suppress, make low-k PCB substrate.Compacting finishes, cooling, and the demoulding removes corrosion resistant plate etc.
Preferably, the average grain diameter of hollow glass microballoon is 150 μ m, 100 μ m, 50 μ m, 25 μ m, 15 μ m, 10 μ m or 5 μ m.
Preferably, the addition of hollow glass microballoon is 3.0% of polyimide resin liquid, a cyanate ester resin liquid mixing copolymer resins system weight.
Preferably, the pressing process in the 4th step is following:
Under 120 ℃ of conditions, suppress 30min earlier; 15min is suppressed in the back under 150 ℃ of conditions;
Under 180 ℃ of conditions, suppress 60min again; Under 240 ℃ of conditions, suppress 180min at last.
Polyimides PI-3102/ bisphenol A cyanate ester resin BCN mixing copolymer resins is a kind of high heat-resisting, low-k D
kExcellent resin material, the glass transition temperature of the PCB substrate of its production about 250 ℃, D
kBetween 3.5～3.8.
In technical scheme of the present invention, the weight ratio of polyimides PI-3102/ bisphenol A cyanate ester resin BCN is 68.7: 31.3, and there is same glass transition temperature Tg in this resin system, helps producing.And when adopting other ratios, 2 glass transition temperature Tg can appear in this resin system, will be unfavorable for actual production process.
In the technical scheme of the present invention, the average grain diameter of adding the hollow glass microballoon of PI-3102/BCN mixing copolymer resins system to can be as follows: 150 μ m, 100 μ m, 50 μ m, 25 μ m, 15 μ m, 10 μ m, 5 μ m.In the technical scheme of the present invention; The addition of hollow glass microballoon all is set at 3.0% of resin liquid (polyimide resin liquid, cyanate ester resin liquid mixing copolymer resins system) weight and (also can between 2-5%, sets arbitrarily; Fixedly the ratio of hollow glass microballoon is convenient to the D of comparative observation different-grain diameter hollow glass microballoon to PI-3102/BCN mixing copolymer resins system
kInfluence).Particle diameter and ratio in aforementioned hollow glass microballoon are added in the PI-3102/BCN mixing copolymer resins system, gluing and suppress the PCB substrate, detect D
kLike following table:
| Particle diameter μ m | 150 | 100 | 50 | 25 | 15 | 10 | 5 | |
| Addition % | Do not add | 3.0 | 3.0 | 3.0 | 3.0 | 3.0 | 3.0 | 3.0 |
| D k | 3.51 | 3.50 | 3.47 | 3.40 | 3.07 | 3.00 | 2.98 | 2.97 |
Can draw from last table, when the average grain diameter of hollow glass microsphere≤25 μ m, D
kDescend clearly, average grain diameter when 10 μ m, 5 μ m, D
k＜3.00.
Low-k PCB substrate of the present invention has following technique effect:
1,, makes the dielectric constant D of polyimides PI-3102/ bisphenol A cyanate ester resin BCN mixing copolymer resins system owing to added hollow glass microballoon
kTangible improvement has been arranged, and along with particle diameter ground reduces, the effect of improvement is obvious more, as its average grain diameter≤25 μ m, it is outstanding especially that low-dielectric can become.
2, the interpolation of hollow glass microballoon also makes the density of PCB substrate descend more than 2%.
3, in addition, because the addition of hollow glass microballoon is less, therefore, little to the machining property influence of PCB substrate.
Embodiment
Elaborate in the face of the preferred embodiments of the present invention down.
Embodiment 1
The first, mixed with resin copolymerization
Take by weighing polyimide resin liquid PI-3102105g, cyanate ester resin liquid BCN 47.83g; Under 100～105 ℃ of conditions, mix and stir 2h, add diallyl bisphenol (DABPA) 5.25g, be warming up to 120～125 ℃; Continue to stir; To gel time behind 270～350s (171 ℃, circular hole method detect), be cooled to room temperature.The hollow glass microballoon 4.75g that adds average grain diameter 150 μ m stirs 10min, moves to mulser internal emulsification 30min.
The second, gluing
The resin that the first step is made adopts electron level glass cloth (7628 cloth) to carry out gluing, and adopts oven for drying, and 170 ℃ of oven temperatures cure 8-10min, make prepreg, and are cut into definite shape on request.Gained prepreg parameter is following:
Grammes per square metre: 380g/m
2
PG(171℃)：127.4s
Mobile: 12.6%
Volatile matter: 0.34%.
Three, folded joining
With the needs of second prepreg that make of step, join several pieces prepregs are folded according to 2mm thickness;
Four, compacting
The folded prepreg upper and lower faces for preparing of the 3rd step is respectively covered one 0.5 ounce copper foil; And it is corresponding superimposed with stainless steel template, brown paper; Order is from top to bottom: brown paper (15), stainless steel template, Copper Foil, prepreg, Copper Foil, stainless steel template, brown paper (15); Send into vacuum press then and suppress, the pressing process temperature is following:
Under 120 ℃ of conditions, suppress 30min earlier;
15min is suppressed in the back under 150 ℃ of conditions;
Under 180 ℃ of conditions, suppress 60min again;
Under 240 ℃ of conditions, suppress 180min at last.
Compacting finishes, cooling, and the demoulding removes corrosion resistant plate etc., gets the PCB substrate.
The the 5th: D
kTest
The PCB substrate that compacting is obtained carries out D
kTest gets its D
k=3.50.
Embodiment 2
The first, mixed with resin copolymerization
Take by weighing polyimide resin liquid PI-3102105g, cyanate ester resin liquid BCN 47.83g, mix in 100～105 ℃ and stir 2h, add DABPA 5.25g; Be warming up to 120～125 ℃, continue stir, to gel time (171 ℃ of 270～350s; The circular hole method detects) after, be cooled to room temperature.The hollow glass microballoon 4.75g that adds average grain diameter 100 μ m stirs 10min, moves to mulser internal emulsification 30min.
The second, gluing
The resin that the first step is made adopts electron level glass cloth (7628 cloth) to carry out gluing, and uses oven for drying, and 170 ℃ of oven temperatures cure 8-10min, get prepreg, and are cut into definite shape on request.The prepreg parameter is following:
Grammes per square metre: 383g/m
2
PG(171℃)：122.9s
Mobile: 11.5%
Volatile matter: 0.32%.
Three, folded joining
With the needs of second prepreg that make of step, join several pieces prepregs are folded according to 2mm thickness;
Four, compacting
The folded prepreg upper and lower faces for preparing of the 3rd step is respectively covered one 0.5 ounce copper foil; And it is corresponding superimposed with stainless steel template, brown paper; Order is from top to bottom: brown paper (15), stainless steel template, Copper Foil, prepreg, Copper Foil, stainless steel template, brown paper (15); Send into vacuum press then and suppress, the pressing process temperature is following:
Under 120 ℃ of conditions, suppress 30min earlier;
15min is suppressed in the back under 150 ℃ of conditions;
Under 180 ℃ of conditions, suppress 60min again;
Under 240 ℃ of conditions, suppress 180min at last.
Compacting finishes, cooling, and the demoulding removes brown paper and stainless steel template, gets the PCB substrate.
The the 5th: D
kTest
The PCB substrate that compacting is obtained carries out D
kTest gets its D
k=3.47.
Embodiment 3
The first, mixed with resin copolymerization
Take by weighing polyimide resin liquid PI-3102105g, cyanate ester resin liquid BCN 47.83g, mix in 100～105 ℃ and stir 2h, add DABPA 5.25g; Be warming up to 120～125 ℃, continue stir, to gel time (171 ℃ of 270～350s; The circular hole method detects) after, be cooled to room temperature.The hollow glass microballoon 4.75g that adds average grain diameter 50 μ m stirs 10min, moves to mulser internal emulsification 30min.
The second, gluing
The resin that the first step is made adopts electron level glass cloth (7628 cloth) to carry out gluing, and uses oven for drying, and 170 ℃ of oven temperatures cure 8-10min, make prepreg, and are cut into definite shape on request.The prepreg parameter is following:
Grammes per square metre: 380g/m
2
PG(171℃)：125.0s
Mobile: 12.2%
Volatile matter: 0.34%.
Three, folded joining
Second prepreg that make of step according to 2mm thickness needs, is folded several pieces prepregs and joined;
Four, compacting
The folded prepreg upper and lower faces for preparing of the 3rd step is respectively covered one 0.5 ounce copper foil; And it is corresponding superimposed with stainless steel template, brown paper; Order is from top to bottom: brown paper (15), stainless steel template, Copper Foil, prepreg, Copper Foil, stainless steel template, brown paper (15); Send into vacuum press then and suppress, the pressing process temperature is following:
Under 120 ℃ of conditions, suppress 30min earlier;
15min is suppressed in the back under 150 ℃ of conditions;
Under 180 ℃ of conditions, suppress 60min again;
Under 240 ℃ of conditions, suppress 180min at last.
Compacting finishes, cooling, and the demoulding removes brown paper and stainless steel template, gets the PCB substrate.
The the 5th: D
kTest
The PCB substrate that compacting is obtained carries out D
kTest gets its D
k=3.40.
Embodiment 4
The first, mixed with resin copolymerization
Take by weighing polyimide resin liquid PI-3102105g, cyanate ester resin liquid BCN 47.83g, mix in 100～105 ℃ and stir 2h, add DABPA 5.25g; Be warming up to 120～125 ℃, continue stir, to gel time (171 ℃ of 270～350s; The circular hole method detects) after, be cooled to room temperature.The hollow glass microballoon 4.75g that adds average grain diameter 25 μ m stirs 10min, moves to mulser internal emulsification 30min.
The second, gluing
The resin that the first step is made adopts electron level glass cloth (7628 cloth) to carry out gluing, and uses oven for drying, and 170 ℃ of oven temperatures cure 8-10min, get prepreg, and are cut into definite shape on request.The prepreg parameter is following:
Grammes per square metre: 379g/m
2
PG(171℃)：130.4s
Mobile: 13.5%
Volatile matter: 0.38%.
Three, folded joining
Second prepreg that make of step according to 2mm thickness needs, is folded several pieces prepregs and joined;
Four, compacting
The folded prepreg upper and lower faces for preparing of the 3rd step is respectively covered one 0.5 ounce copper foil; And it is corresponding superimposed with stainless steel template, brown paper; Order is from top to bottom: brown paper (15), stainless steel template, Copper Foil, prepreg, Copper Foil, stainless steel template, brown paper (15); Send into vacuum press then and suppress, the pressing process temperature is following:
Under 120 ℃ of conditions, suppress 30min earlier;
15min is suppressed in the back under 150 ℃ of conditions;
Under 180 ℃ of conditions, suppress 60min again;
Under 240 ℃ of conditions, suppress 180min at last.
Compacting finishes, cooling, and the demoulding removes brown paper and stainless steel template, gets the PCB substrate.
The the 5th: D
kTest
The PCB substrate that compacting is obtained carries out D
kTest gets its D
k=3.07.
Embodiment 5
The first, mixed with resin copolymerization
Take by weighing polyimide resin liquid PI-3102105g, cyanate ester resin liquid BCN 47.83g, mix in 100～105 ℃ and stir 2h, add DABPA 5.25g; Be warming up to 120～125 ℃; Continue to be stirred to gel time behind 270～350s (171 ℃, the circular hole method detects), be cooled to room temperature.The hollow glass microballoon 4.75g that adds average grain diameter 15 μ m stirs 10min, moves to mulser internal emulsification 30min.
The second, gluing
The resin that the first step is made adopts electron level glass cloth (7628 cloth) to carry out gluing, and uses oven for drying, and 170 ℃ of oven temperatures cure 8-10min, get prepreg, and are cut into definite shape on request.The prepreg parameter is following:
Grammes per square metre: 385g/m
2
PG(171℃)：122.5s
Mobile: 12.0%
Volatile matter: 0.33%.
Three, folded joining
Second prepreg that make of step according to 2mm thickness needs, is folded several pieces prepregs and joined;
Four, compacting
The folded prepreg upper and lower faces for preparing of the 3rd step is respectively covered one 0.5 ounce copper foil; And with the stainless steel template, brown paper should be superimposed; Order is from top to bottom: brown paper (15), stainless steel template, Copper Foil, prepreg, Copper Foil, stainless steel template, brown paper (15); Send into vacuum press then and suppress, the pressing process temperature is following:
Under 120 ℃ of conditions, suppress 30min earlier;
15min is suppressed in the back under 150 ℃ of conditions;
Under 180 ℃ of conditions, suppress 60min again;
Under 240 ℃ of conditions, suppress 180min at last.
Compacting finishes, cooling, and the demoulding removes brown paper and stainless steel template, gets the PCB substrate.
The the 5th: D
kTest
The PCB substrate that compacting is obtained carries out D
kTest gets its D
k=3.00.
Embodiment 6
The first, mixed with resin copolymerization
Take by weighing polyimide resin liquid PI-3102105g, cyanate ester resin liquid BCN 47.83g, mix in 100～105 ℃ and stir 2h, add DABPA 5.25g; Be warming up to 120～125 ℃; Continue to be stirred to gel time behind 270～350s (171 ℃, the circular hole method detects), be cooled to room temperature.The hollow glass microballoon 4.75g that adds average grain diameter 10 μ m stirs 10min, moves to mulser internal emulsification 30min.
The second, gluing
The resin that the first step is made adopts electron level glass cloth (7628 cloth) to carry out gluing, and uses oven for drying, and 170 ℃ of oven temperatures cure 8-10min, get prepreg, and are cut into definite shape on request.The prepreg parameter is following:
Grammes per square metre: 380g/m
2
PG(171℃)：132.1s
Mobile: 13.5%
Volatile matter: 0.40%.
Three, folded joining
Second prepreg that make of step according to 2mm thickness needs, is folded several pieces prepregs and joined;
Four, compacting
The folded prepreg upper and lower faces for preparing of the 3rd step is respectively covered one 0.5 ounce copper foil; And with the stainless steel template, brown paper should be superimposed; Order is from top to bottom: brown paper (15), stainless steel template, Copper Foil, prepreg, Copper Foil, stainless steel template, brown paper (15); Send into vacuum press then and suppress, the pressing process temperature is following:
Under 120 ℃ of conditions, suppress 30min earlier;
15min is suppressed in the back under 150 ℃ of conditions;
Under 180 ℃ of conditions, suppress 60min again;
Under 240 ℃ of conditions, suppress 180min at last.
Compacting finishes, cooling, and the demoulding removes brown paper and stainless steel template, gets the PCB substrate.
The the 5th: D
kTest
The PCB substrate that compacting is obtained carries out D
kTest gets its D
k=2.98.
Embodiment 7
The first, mixed with resin copolymerization
Take by weighing polyimide resin liquid PI-3102105g, cyanate ester resin liquid BCN 47.83g, mix in 100～105 ℃ and stir 2h, add DABPA 5.25g; Be warming up to 120～125 ℃, continue stir, to gel time (171 ℃ of 270～350s; The circular hole method detects) after, be cooled to room temperature.The hollow glass microballoon 4.75g that adds average grain diameter 5 μ m stirs 10min, moves to mulser internal emulsification 30min.
The second, gluing
The resin that the first step is made adopts electron level glass cloth (7628 cloth) to carry out gluing, and uses oven for drying, and 170 ℃ of oven temperatures cure 8-10min, get prepreg, and are cut into definite shape on request.The prepreg parameter is following:
Grammes per square metre: 376g/m
2
PG(171℃)：119.2s
Mobile: 11.3%
Volatile matter: 0.30%.
Three, folded joining
Second prepreg that make of step according to 2mm thickness needs, is folded several pieces prepregs and joined;
Four, compacting
The folded prepreg upper and lower faces for preparing of the 3rd step is respectively covered one 0.5 ounce copper foil; And with the stainless steel template, brown paper should be superimposed; Order is from top to bottom: brown paper (15), stainless steel template, Copper Foil, prepreg, Copper Foil, stainless steel template, brown paper (15); Send into vacuum press then and suppress, the pressing process temperature is following:
Under 120 ℃ of conditions, suppress 30min earlier;
15min is suppressed in the back under 150 ℃ of conditions;
Under 180 ℃ of conditions, suppress 60min again;
Under 240 ℃ of conditions, suppress 180min at last.
Compacting finishes, cooling, and the demoulding removes brown paper and stainless steel template, gets the PCB substrate.
The the 5th: D
kTest
The PCB substrate that compacting is obtained carries out D
kTest gets its D
k=2.97.
Can draw through above embodiment, select the hollow glass microballoon of different-grain diameter for use, correspondingly obtain different D
kValue.
Among the above embodiment, raw material can be selected following manufacturer for use:
Polyimide resin PI-3102: Intelligence Technology (China) Co., Ltd.
Bisphenol A cyanate ester resin BCN: Jiangdu Wuqiao Resin Factory
Diallyl bisphenol (DABPA): the bright Science and Technology Ltd. of Wuhan will
Hollow glass microballoon: sea, Qingdao magnificent fiber Co., Ltd
Those of ordinary skill in the art will be appreciated that the present invention is not limited to the foregoing description, any conversion of the present invention, modification is all fallen into protection scope of the present invention.
Claims (7)
1. low-k PCB substrate; It is characterized in that: join by a slice prepreg or multi-disc prepreg are folded that Copper Foil is respectively covered on two surfaces, back and compacting forms; Described prepreg carries out gluing by resin through glass cloth and oven dry makes; Described resin evenly is mixed by weight by following component and forms: 68.7 parts of polyimide resin liquid, 31.3 parts of cyanate ester resin liquid, 3-4 part diallyl bisphenol, described resin adds 2-5 part hollow glass microballoon.
2. low-k PCB substrate as claimed in claim 1 is characterized in that: the average grain diameter of described hollow glass microballoon is 150 μ m, 100 μ m, 50 μ m, 25 μ m, 15 μ m, 10 μ m or 5 μ m.
3. low-k PCB substrate as claimed in claim 1 is characterized in that: the addition of described hollow glass microballoon is 3.0% of polyimide resin liquid, a cyanate ester resin liquid mixing copolymer resins system weight.
4. the manufacturing approach of a low-k PCB substrate is characterized in that carrying out as follows:
One, mixed with resin copolymerization
Take by weighing 68.7 parts of polyimide resin liquid, 31.3 parts of cyanate ester resin liquid, and place mixing stirring under 100～105 ℃ of temperature, add diallyl bisphenol 3-4 part; Be warming up to 120～125 ℃; Continue to stir, to gel time 270～350s, be cooled to room temperature; Add hollow glass microballoon 2-5 part, stir, move to the mulser internal emulsification;
Two, gluing
The resin that the first step is made adopts glass cloth to carry out gluing and oven dry, makes prepreg;
Three, folded joining
Need according to thickness, several pieces were made by second step prepreg is folded joins;
Four, compacting
Copper Foil is respectively covered on two surfaces of the folded prepreg for preparing with the 3rd step, suppresses then, makes low-k PCB substrate.
5. the manufacturing approach of low-k PCB substrate as claimed in claim 4 is characterized in that: the average grain diameter of described hollow glass microballoon is 150 μ m, 100 μ m, 50 μ m, 25 μ m, 15 μ m, 10 μ m or 5 μ m.
6. like the manufacturing approach of claim 4 or 5 described low-k PCB substrates, it is characterized in that: the addition of described hollow glass microballoon is 3.0% of polyimide resin liquid, a cyanate ester resin liquid mixing copolymer resins system weight.
7. the manufacturing approach of low-k PCB substrate as claimed in claim 4 is characterized in that: the pressing process in the 4th step is following:
Under 120 ℃ of conditions, suppress 30min earlier;
15min is suppressed in the back under 150 ℃ of conditions;
Under 180 ℃ of conditions, suppress 60min again;
Under 240 ℃ of conditions, suppress 180min at last.
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| CN201210094189.6A CN102625574B (en) | 2012-03-31 | 2012-03-31 | Low-dielectric-constant PCB (Printed Circuit Board) base plate and manufacturing method thereof |
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| CN104249512A (en) * | 2013-06-28 | 2014-12-31 | 深圳光启创新技术有限公司 | Cyanate ester resin compound, composite substrate and manufacturing method of composite substrate |
| CN106433122A (en) * | 2016-09-07 | 2017-02-22 | 深圳先进技术研究院 | Modified cyanate ester composite material, and preparation method and application thereof |
| CN106480735A (en) * | 2015-08-28 | 2017-03-08 | 广东生益科技股份有限公司 | Circuit substrate and preparation method thereof |
| CN106947251A (en) * | 2017-04-13 | 2017-07-14 | 江苏先诺新材料科技有限公司 | A kind of low dielectric polymer base wave-penetrating composite material and its preparation method and application |
| CN109115581A (en) * | 2018-10-30 | 2019-01-01 | 北京航空航天大学 | A kind of preparation method of the sample for high-q cavity method test fiber dielectric properties |
| CN115181419A (en) * | 2022-07-14 | 2022-10-14 | 重庆工商大学 | Method for modifying cyanate ester by vinyl mesoporous silica and polyimide |
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| CN104249512A (en) * | 2013-06-28 | 2014-12-31 | 深圳光启创新技术有限公司 | Cyanate ester resin compound, composite substrate and manufacturing method of composite substrate |
| CN106480735A (en) * | 2015-08-28 | 2017-03-08 | 广东生益科技股份有限公司 | Circuit substrate and preparation method thereof |
| CN106480735B (en) * | 2015-08-28 | 2019-06-14 | 广东生益科技股份有限公司 | Circuit substrate and preparation method thereof |
| CN106433122A (en) * | 2016-09-07 | 2017-02-22 | 深圳先进技术研究院 | Modified cyanate ester composite material, and preparation method and application thereof |
| CN106947251A (en) * | 2017-04-13 | 2017-07-14 | 江苏先诺新材料科技有限公司 | A kind of low dielectric polymer base wave-penetrating composite material and its preparation method and application |
| CN106947251B (en) * | 2017-04-13 | 2019-08-13 | 江苏先诺新材料科技有限公司 | A kind of low dielectric polymer base wave-penetrating composite material and its preparation method and application |
| CN109115581A (en) * | 2018-10-30 | 2019-01-01 | 北京航空航天大学 | A kind of preparation method of the sample for high-q cavity method test fiber dielectric properties |
| CN109115581B (en) * | 2018-10-30 | 2019-11-05 | 北京航空航天大学 | A kind of preparation method of the sample for high-q cavity method test fiber dielectric properties |
| CN115181419A (en) * | 2022-07-14 | 2022-10-14 | 重庆工商大学 | Method for modifying cyanate ester by vinyl mesoporous silica and polyimide |
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| CN102625574B (en) | 2014-08-06 |
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Denomination of invention: A low dielectric constant PCB substrate and its manufacturing method Effective date of registration: 20231128 Granted publication date: 20140806 Pledgee: Agricultural Bank of China Limited Hangzhou Yuhang Branch Pledgor: ZHEJIANG HUAZHENG NEW MATERIAL GROUP Co.,Ltd. Registration number: Y2023980067733 |