DE3278997D1 - A method of etching copper circuit boards and an etch solution - Google Patents

A method of etching copper circuit boards and an etch solution

Info

Publication number
DE3278997D1
DE3278997D1 DE8585107432T DE3278997T DE3278997D1 DE 3278997 D1 DE3278997 D1 DE 3278997D1 DE 8585107432 T DE8585107432 T DE 8585107432T DE 3278997 T DE3278997 T DE 3278997T DE 3278997 D1 DE3278997 D1 DE 3278997D1
Authority
DE
Germany
Prior art keywords
circuit boards
copper circuit
etch solution
etching copper
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8585107432T
Other languages
German (de)
Inventor
William Robert Brasch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shipley Co Inc
Original Assignee
LeaRonal Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US06/316,108 external-priority patent/US4378270A/en
Application filed by LeaRonal Inc filed Critical LeaRonal Inc
Application granted granted Critical
Publication of DE3278997D1 publication Critical patent/DE3278997D1/en
Expired legal-status Critical Current

Links

DE8585107432T 1981-10-29 1982-10-29 A method of etching copper circuit boards and an etch solution Expired DE3278997D1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/316,108 US4378270A (en) 1981-10-29 1981-10-29 Method of etching circuit boards and recovering copper from the spent etch solutions
EP82110026A EP0079505B1 (en) 1981-10-29 1982-10-29 A method of recovering copper from spent etch solutions

Publications (1)

Publication Number Publication Date
DE3278997D1 true DE3278997D1 (en) 1988-10-13

Family

ID=26084404

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8585107432T Expired DE3278997D1 (en) 1981-10-29 1982-10-29 A method of etching copper circuit boards and an etch solution

Country Status (1)

Country Link
DE (1) DE3278997D1 (en)

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee