DE3273554D1 - Contact probe assembly for integrated circuits - Google Patents
Contact probe assembly for integrated circuitsInfo
- Publication number
- DE3273554D1 DE3273554D1 DE8282105760T DE3273554T DE3273554D1 DE 3273554 D1 DE3273554 D1 DE 3273554D1 DE 8282105760 T DE8282105760 T DE 8282105760T DE 3273554 T DE3273554 T DE 3273554T DE 3273554 D1 DE3273554 D1 DE 3273554D1
- Authority
- DE
- Germany
- Prior art keywords
- integrated circuits
- probe assembly
- contact probe
- contact
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US27895081A | 1981-06-30 | 1981-06-30 | |
US06/279,128 US4506215A (en) | 1981-06-30 | 1981-06-30 | Modular test probe |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3273554D1 true DE3273554D1 (en) | 1986-11-06 |
Family
ID=26959361
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8282105760T Expired DE3273554D1 (en) | 1981-06-30 | 1982-06-29 | Contact probe assembly for integrated circuits |
Country Status (2)
Country | Link |
---|---|
EP (1) | EP0068493B1 (en) |
DE (1) | DE3273554D1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4518910A (en) * | 1983-06-30 | 1985-05-21 | International Business Machines Corporation | Buckling beam twist probe contactor assembly with spring biased stripper plate |
GB2146849B (en) * | 1983-09-17 | 1987-08-05 | Marconi Instruments Ltd | Electrical test probe head assembly |
US4622514A (en) * | 1984-06-15 | 1986-11-11 | Ibm | Multiple mode buckling beam probe assembly |
EP0165331B1 (en) * | 1984-06-22 | 1988-08-24 | Ibm Deutschland Gmbh | Buckling beam test probe assembly |
DE3734647A1 (en) * | 1986-10-14 | 1988-04-21 | Feinmetall Gmbh | Pin board |
DE69326609T2 (en) * | 1993-07-23 | 2000-04-27 | Ibm | Test probe arrangement with articulation needles |
-
1982
- 1982-06-29 DE DE8282105760T patent/DE3273554D1/en not_active Expired
- 1982-06-29 EP EP19820105760 patent/EP0068493B1/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
EP0068493A1 (en) | 1983-01-05 |
EP0068493B1 (en) | 1986-10-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |