DE3262018D1 - Encapsulating housing for a power semiconductor functioning in a 2 to 20 ghz frequency range - Google Patents

Encapsulating housing for a power semiconductor functioning in a 2 to 20 ghz frequency range

Info

Publication number
DE3262018D1
DE3262018D1 DE8282400785T DE3262018T DE3262018D1 DE 3262018 D1 DE3262018 D1 DE 3262018D1 DE 8282400785 T DE8282400785 T DE 8282400785T DE 3262018 T DE3262018 T DE 3262018T DE 3262018 D1 DE3262018 D1 DE 3262018D1
Authority
DE
Germany
Prior art keywords
frequency range
power semiconductor
ghz frequency
encapsulating housing
semiconductor functioning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8282400785T
Other languages
German (de)
English (en)
Inventor
Bernard Carnez
Guy Bessonneau
Henri Derewonko
Georges Chambaudu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Application granted granted Critical
Publication of DE3262018D1 publication Critical patent/DE3262018D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/047—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/647—Resistive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Microwave Amplifiers (AREA)
  • Wire Bonding (AREA)
DE8282400785T 1981-05-19 1982-04-29 Encapsulating housing for a power semiconductor functioning in a 2 to 20 ghz frequency range Expired DE3262018D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8109935A FR2506520A1 (fr) 1981-05-19 1981-05-19 Boitier d'encapsulation pour semiconducteur de puissance fonctionnant dans une gamme de frequences de 2 a 20 ghz

Publications (1)

Publication Number Publication Date
DE3262018D1 true DE3262018D1 (en) 1985-03-07

Family

ID=9258627

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8282400785T Expired DE3262018D1 (en) 1981-05-19 1982-04-29 Encapsulating housing for a power semiconductor functioning in a 2 to 20 ghz frequency range

Country Status (4)

Country Link
EP (1) EP0065443B1 (OSRAM)
JP (1) JPS57196550A (OSRAM)
DE (1) DE3262018D1 (OSRAM)
FR (1) FR2506520A1 (OSRAM)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2538617B1 (fr) * 1982-12-28 1986-02-28 Thomson Csf Boitier d'encapsulation pour semiconducteur de puissance, a isolement entree-sortie ameliore
GB8520907D0 (en) * 1985-08-21 1985-09-25 M O Valve Co Ltd Hybrid circuit packages
JPH0846073A (ja) * 1994-07-28 1996-02-16 Mitsubishi Electric Corp 半導体装置
RU2659304C1 (ru) * 2017-06-14 2018-06-29 Российская Федерация, От Имени Которой Выступает Министерство Промышленности И Торговли Российской Федерации Корпус мощной гибридной свч интегральной схемы

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4177480A (en) * 1975-10-02 1979-12-04 Licentia Patent-Verwaltungs-G.M.B.H. Integrated circuit arrangement with means for avoiding undesirable capacitive coupling between leads
US4038157A (en) * 1976-04-16 1977-07-26 The United States Of America As Represented By The Secretary Of The Air Force Method of hermetically sealing semiconductor devices
FR2376520A1 (fr) * 1976-12-31 1978-07-28 Radiotechnique Compelec Diode semiconductrice et ensemble comprenant une telle diode

Also Published As

Publication number Publication date
FR2506520B1 (OSRAM) 1984-10-12
EP0065443B1 (fr) 1985-01-23
FR2506520A1 (fr) 1982-11-26
EP0065443A1 (fr) 1982-11-24
JPS57196550A (en) 1982-12-02

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Legal Events

Date Code Title Description
8339 Ceased/non-payment of the annual fee