DE3260187D1 - Piezo-electric oscillator and its manufacturing process - Google Patents

Piezo-electric oscillator and its manufacturing process

Info

Publication number
DE3260187D1
DE3260187D1 DE8282810102T DE3260187T DE3260187D1 DE 3260187 D1 DE3260187 D1 DE 3260187D1 DE 8282810102 T DE8282810102 T DE 8282810102T DE 3260187 T DE3260187 T DE 3260187T DE 3260187 D1 DE3260187 D1 DE 3260187D1
Authority
DE
Germany
Prior art keywords
casing
parts
cavity
piezo
manufacturing process
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8282810102T
Other languages
English (en)
Inventor
Claude Laesser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebauchesfabrik ETA AG
Original Assignee
Ebauches SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebauches SA filed Critical Ebauches SA
Application granted granted Critical
Publication of DE3260187D1 publication Critical patent/DE3260187D1/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/05—Holders; Supports
    • H03H9/10—Mounting in enclosures
    • H03H9/1007—Mounting in enclosures for bulk acoustic wave [BAW] devices
    • H03H9/1014—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device
    • H03H9/1021—Mounting in enclosures for bulk acoustic wave [BAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the BAW device the BAW device being of the cantilever type
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
DE8282810102T 1981-04-02 1982-03-08 Piezo-electric oscillator and its manufacturing process Expired DE3260187D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH2237/81A CH643980B (fr) 1981-04-02 1981-04-02 Oscillateur piezo-electrique et procede pour sa fabrication.

Publications (1)

Publication Number Publication Date
DE3260187D1 true DE3260187D1 (en) 1984-07-05

Family

ID=4229063

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8282810102T Expired DE3260187D1 (en) 1981-04-02 1982-03-08 Piezo-electric oscillator and its manufacturing process

Country Status (4)

Country Link
EP (1) EP0062604B1 (de)
JP (1) JPS57174917A (de)
CH (1) CH643980B (de)
DE (1) DE3260187D1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60129717U (ja) * 1984-02-08 1985-08-30 日本電波工業株式会社 圧電振動子
CH655423GA3 (de) * 1984-02-15 1986-04-30
JP5048471B2 (ja) * 2007-12-05 2012-10-17 セイコーインスツル株式会社 パッケージの製造方法、パッケージ、電子デバイス、圧電振動子、発振器、電子機器及び電波時計
EP3242538A1 (de) * 2012-08-28 2017-11-08 mb-microtec ag Verfahren zur herstellung eines hermetischen gehäuses für ein elektronisches gerät
AT513324B1 (de) 2012-08-28 2015-01-15 Mb Microtec Ag Verfahren zur Herstellung eines selbstleuchtenden Körpers und selbstleuchtender Körper

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5260090A (en) * 1975-11-12 1977-05-18 Citizen Watch Co Ltd Thin and small type piezo electric vibrator
US4191905A (en) * 1977-06-17 1980-03-04 Citizen Watch Company Limited Sealed housings for a subminiature piezoelectric vibrator

Also Published As

Publication number Publication date
CH643980GA3 (de) 1984-07-13
EP0062604B1 (de) 1984-05-30
CH643980B (fr)
JPS57174917A (en) 1982-10-27
EP0062604A1 (de) 1982-10-13

Similar Documents

Publication Publication Date Title
JPS6430975A (en) Lip seal device
FR2724439B1 (fr) Joint metal-elastomere, notamment joint d'etancheite plat
IE57174B1 (en) Improvements in or relating to piezoelectric composites
ES275450U (es) Dispositivo de union de piezas, por ejemplo arboles o similares
ATE234397T1 (de) Dichtelement
TW248531B (de)
DE3274810D1 (en) Disposable pharmaceutical filter assembly
GB2091748B (en) Impression material formed from organopolysiloxanes and process for providing reciprocal adhesion at the interface between two contacting layers
DE3260187D1 (en) Piezo-electric oscillator and its manufacturing process
SE8004810L (sv) Axeltetningsring
ES251136U (es) Articulacion doble centrada y procedimiento para su montaje
DE3360738D1 (en) Method of producing fibre-reinforced flat bodies
JPS57131561A (en) Rotary printing press
ES278527U (es) Articulacion elastica (articulacion molecular) especialmente para vehiculos automoviles.
AU5183890A (en) Sealing
ZA805519B (en) Composite compacting cylinder
ATE45018T1 (de) Ventileinrichtung.
DE3470794D1 (en) Gasket
DE3264991D1 (en) Method of manufacturing a composite piezoelectric material
FR2622233B1 (fr) Dalle pour plancher sureleve
SE8604703D0 (sv) Forband och tetningselement for detsamma
GR3000705T3 (en) Sealing device for mounting smooth and parallel faces, and sealing joints obtained
AU2327488A (en) A combination seal for sealing between two machine parts
FR2511464B1 (de)
JPS6439738A (en) Resin sealer for semiconductor device

Legal Events

Date Code Title Description
8327 Change in the person/name/address of the patent owner

Owner name: ETA S.A. FABRIQUES D'EBAUCHES, GRENCHEN, CH

8328 Change in the person/name/address of the agent

Free format text: SPARING, K., DIPL.-ING. ROEHL, W., DIPL.-PHYS. DR.RER.NAT., PAT.-ANW., 4000 DUESSELDORF

8339 Ceased/non-payment of the annual fee