DE3215966A1 - Process for eliminating finely divided residues of a silver-containing solder - Google Patents

Process for eliminating finely divided residues of a silver-containing solder

Info

Publication number
DE3215966A1
DE3215966A1 DE19823215966 DE3215966A DE3215966A1 DE 3215966 A1 DE3215966 A1 DE 3215966A1 DE 19823215966 DE19823215966 DE 19823215966 DE 3215966 A DE3215966 A DE 3215966A DE 3215966 A1 DE3215966 A1 DE 3215966A1
Authority
DE
Germany
Prior art keywords
silver
parts
ammonia
hydrogen peroxide
ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19823215966
Other languages
German (de)
Other versions
DE3215966C2 (en
Inventor
Jürgen 7900 Ulm Geißer
Klaus Gerland
Emil 7915 Elchingen Schmid
Hermann Dr.Rer.Nat. 7900 Ulm Widmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Priority to DE19823215966 priority Critical patent/DE3215966A1/en
Publication of DE3215966A1 publication Critical patent/DE3215966A1/en
Application granted granted Critical
Publication of DE3215966C2 publication Critical patent/DE3215966C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
    • H01J9/38—Exhausting, degassing, filling, or cleaning vessels
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
    • C03C23/0075—Cleaning of glass
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/53—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone involving the removal of at least part of the materials of the treated article, e.g. etching, drying of hardened concrete
    • C04B41/5338—Etching
    • C04B41/5353—Wet etching, e.g. with etchants dissolved in organic solvents

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Geochemistry & Mineralogy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Structural Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Detergent Compositions (AREA)

Abstract

To eliminate silver-containing solder residues on ceramic or glass components, washing with an aqueous solution is proposed, which contains a mixture of ammonia and hydrogen peroxide.

Description

Beschreibungdescription

Verfahren zum Entfernen von fein verteilten Rückständen eines silberhaltigen Lotes.Process for removing finely divided residues of a silver-containing Plumb bobs.

Die vorliegende Erfindung betrifft ein Verfahren zum Entfernen von fein verteilten Rückständen eines silberhaltigen Lotes auf mit Metallteilen verlöteten Glas- oder Keramikteilen durch Waschen mit einer wässerigen Lösung.The present invention relates to a method for removing finely distributed residues of a silver-containing solder soldered to metal parts Glass or ceramic parts by washing with an aqueous solution.

Es ist bekannt, optoelektronische Bauelemente, wie Bildverstärkerröhren und dergleichen, in Glasmetall- bzw.It is known, optoelectronic components, such as image intensifier tubes and the like, in glass metal resp.

Metallkeramik-Technik herzustellen. Zum Herstellen der Vakuumgehäuse, insbesondere zur Herstellung von Vebindungen zwischen Metall- und Isolierteilen, werden üblicherweise Kupfer-Silber-Lote verwendet. Bei den für die Lötung erforderlichen Temperaturen ist nicht auszuschließen, daß geringe Mengen des Lotes abdampfen und sich in unerwünschter Weise auf den Oberflächen der Glas- bzw.Manufacture of metal-ceramic technology. To manufacture the vacuum housing, especially for making connections between metal and insulating parts, Usually copper-silver solders are used. With the for the soldering required temperatures cannot be ruled out that small amounts of solder evaporate and in an undesirable way on the surfaces of the glass or

Keramikteile niederschlagen. Solche Niederschläge auf den inneren Oberflächen von optoelektronischen Röhren führen zu Betriebsstörungen und müssen vermiedern werden. Da andererseits solche optoelektronischen Röhren chemisch sehr empfindliche Elektroden, wie z. B. Fotokathoden oder Leuchschirme enthalten, ist die Entfernung solcher Niederschläge von silberhaltigen Loten auf Isolierteilen schwierig. Kaliumcyanidlösungen, die beispielsweise für solche Fälle brauchbar wären, erforden zusätzliche umfangreiche Spülvorgänge, sollen nicht störende Cyanidreste zurückbleiben.Knock down ceramic parts. Such precipitation on the interior Surfaces of optoelectronic tubes lead to malfunctions and must will avoid. On the other hand, such optoelectronic tubes are very chemically sensitive electrodes, such as B. photocathodes or fluorescent screens are included the removal of such deposits from solder containing silver on insulating parts difficult. Potassium cyanide solutions, which would be useful for such cases, for example, If additional, extensive rinsing processes are required, cyanide residues should not be a problem lag behind.

Der vorliegenden Erfindung liegt die Aufgabe zugrunde, ein Verfahren anzugeben, mit welchem insbesondere bei optoelektronischen Röhren Niederschläge von silberhaltigen Loten auf Glas- oder Keramikteilen entfernbar sind.The present invention is based on the object of a method indicate with which precipitation, especially in the case of optoelectronic tubes can be removed from solders containing silver on glass or ceramic parts.

Diese Aufgabe wird gemäß der Erfindung dadurch gelöst, daß die verlöteten Teile mit einer wässerigen Lösung gewaschen werden, die zumindest zu einem Drittel aus einem Gemisch von Ammoniak und Wasserstoffperoxid besteht.This object is achieved according to the invention in that the soldered Parts are washed with an aqueous solution that is at least one third consists of a mixture of ammonia and hydrogen peroxide.

Es zeigte sich, daß durch die Anwendung einer wässerigen Lösung mit einem Gemisch aus Wasserstoffperoxid und Ammoniak auch hoch silberhaltige Kupfer-Silber-Lote, die als Niederschläge auf Keramik- oder Glasteilen vorhanden sind, in einfacher Weise entfernbar sind, ohne daß Rückstände zu befürchten sind, die z. B. die Herstellung und den Betrieb von Fotokathoden oder ähnlich empfindlichen Elektroden stören könnten.It was found that by using an aqueous solution with a mixture of hydrogen peroxide and ammonia also high-silver copper-silver solders, which are present as deposits on ceramic or glass parts, in simple Way can be removed without the fear of residues that z. B. the production and could interfere with the operation of photocathodes or similar sensitive electrodes.

Die Anwendung erfolgt zweckmäßig in der Weise, daß die noch nicht endgütlig verschlossenen, aber bereits mit Kupfer-Silber-Loten verlöteten Vakuumgefäße von optoelektronischen Röhren mit einer wässerigen Lösung gewaschen werden, die mindestens zu einem Drittel aus einem Gemisch aus Ammoniak und Wasserstoffperoxid enthält. Dieses Waschen kann bei normalen Zimmertemperaturen erfolgen. Ganz besonders bewährt hat sich eine Waschlösung, die Wasser, Ammoniak und Wasserstoffperoxid etwa zu je einem Volumensdrittel enthält. Eine solche Lösung entfernt fein verteilte Niederschläge von Kupfer-Silber-Loten rasch und sorgfältig, ohne daß die eigentlichen Lötnähte in störendem Maße zu stark angegriffen würden. Die Kupfer-Silber-Lote können dabei einen sehr hohen Anteil von Silber, beispielsweise etwa zu 75% aus Silber bestehen.The application is expedient in such a way that the not yet finally closed, but already soldered with copper-silver solder from optoelectronic tubes to be washed with an aqueous solution containing the at least one third from a mixture of ammonia and hydrogen peroxide contains. This washing can be done at normal room temperatures. Most notably A washing solution that contains water, ammonia and hydrogen peroxide has proven itself contains one third of the volume each. Such a solution removes finely divided Deposits of copper-silver solders quickly and carefully, without affecting the actual Soldered seams would be attacked too severely to a disruptive extent. The copper-silver solders can a very high proportion of silver, for example about 75% silver exist.

Claims (6)

Patentansprüche I Verfahren zum Entfernen von fein verteilten Rückständen eines silberhaltigen Lotes auf mit Metallteilen verlöteten Glas- oder Keramikteilen durch Waschen mit einer wässerigen Lösung, dadurch gekennzeichnet, daß die verlöteten Teile mit einer wässerigen Lösung gewaschen werden, die zumindest zu einem Drittel aus einem Gemisch von Ammoniak und Wasserstoffperoxid besteht.Claims I Process for removing finely divided residues a silver-containing solder on glass or ceramic parts soldered to metal parts by washing with an aqueous solution, characterized in that the soldered Parts are washed with an aqueous solution that is at least one third consists of a mixture of ammonia and hydrogen peroxide. 2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß die Waschlösung im wesentlichen nur aus Wasser, Ammoniak und Wasserstoffperoxid besteht.2. The method according to claim 1, characterized in that the washing solution consists essentially only of water, ammonia and hydrogen peroxide. 3. Verfahren nach Anspruch 1 oder Anspruch 2, dadurch gekennnzeichnet, daß die Waschlösung etwa gleiche Volumenanteile an Ammoniak und Wasserstoffperoxid enthält.3. The method according to claim 1 or claim 2, characterized in that that the washing solution has approximately equal proportions by volume of ammonia and hydrogen peroxide contains. 4. Verfahren nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, daß die Waschlösung etwa gleiche Volumensanteile an Wasser, Wasserstoffperoxid und Ammoniak enthält.4. The method according to any one of claims 1 to 3, characterized in that that the washing solution has approximately equal proportions by volume of water, hydrogen peroxide and Contains ammonia. 5. Verfahren nach einem der Ansprüche 1 bis 4, gekennzeicnet durch die Anwendung bei Elektronenröhren, deren Vakuumgehäuse in Metallkeramik- und/oder Glasmetall-Technik durch Verlöten dieser Teile mittels eines silberhaltigen Lotes hergestellt sind.5. The method according to any one of claims 1 to 4, gekennzeicnet by the application in electron tubes, their vacuum housing in metal ceramic and / or Glass-metal technique by soldering these parts using a solder containing silver are made. 6. Verfahren nch einem der Ansprüche 1 bis 5, gekennzeichnet durch die Anwendung zum Entfernen von fein verteilten Rückständen eines Kupfer-Silber-Lotes auf Keramik oder Glasteilen.6. The method according to one of claims 1 to 5, characterized by the application for removing finely distributed residues of a copper-silver solder on ceramic or glass parts.
DE19823215966 1982-04-29 1982-04-29 Process for eliminating finely divided residues of a silver-containing solder Granted DE3215966A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19823215966 DE3215966A1 (en) 1982-04-29 1982-04-29 Process for eliminating finely divided residues of a silver-containing solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19823215966 DE3215966A1 (en) 1982-04-29 1982-04-29 Process for eliminating finely divided residues of a silver-containing solder

Publications (2)

Publication Number Publication Date
DE3215966A1 true DE3215966A1 (en) 1983-11-03
DE3215966C2 DE3215966C2 (en) 1990-05-17

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Status (1)

Country Link
DE (1) DE3215966A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0209950A2 (en) * 1985-07-23 1987-01-28 Micronix Corporation Process for making a mask used in x-ray photolithography
EP0327880A2 (en) * 1988-02-06 1989-08-16 Degussa Aktiengesellschaft Apparatus and process for removing a wash coat from the channels of a freshly coated monolithic or honeycomb catalyst support, and its use
WO1991009987A1 (en) * 1989-12-20 1991-07-11 Hughes Aircraft Company Peroxide composition for removing organic contaminants and method of using same
EP0560324A1 (en) 1992-03-11 1993-09-15 Mitsubishi Gas Chemical Company, Inc. Cleaning fluid for semiconductor substrate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1289720B (en) * 1964-01-16 1969-02-20 Collardin Gmbh Gerhard Preparations for removing copper from and cleaning metal surfaces
US3860423A (en) * 1973-08-24 1975-01-14 Rca Corp Etching solution for silver

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1289720B (en) * 1964-01-16 1969-02-20 Collardin Gmbh Gerhard Preparations for removing copper from and cleaning metal surfaces
US3860423A (en) * 1973-08-24 1975-01-14 Rca Corp Etching solution for silver

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0209950A2 (en) * 1985-07-23 1987-01-28 Micronix Corporation Process for making a mask used in x-ray photolithography
EP0209950A3 (en) * 1985-07-23 1989-01-11 Micronix Corporation Process for making a mask used in x-ray photolithography
EP0327880A2 (en) * 1988-02-06 1989-08-16 Degussa Aktiengesellschaft Apparatus and process for removing a wash coat from the channels of a freshly coated monolithic or honeycomb catalyst support, and its use
EP0327880A3 (en) * 1988-02-06 1990-05-30 Degussa Aktiengesellschaft Apparatus and process for removing a wash coat from the channels of a freshly coated monolithic or honeycomb catalyst support, and its use
WO1991009987A1 (en) * 1989-12-20 1991-07-11 Hughes Aircraft Company Peroxide composition for removing organic contaminants and method of using same
EP0560324A1 (en) 1992-03-11 1993-09-15 Mitsubishi Gas Chemical Company, Inc. Cleaning fluid for semiconductor substrate
US5705089A (en) * 1992-03-11 1998-01-06 Mitsubishi Gas Chemical Company, Inc. Cleaning fluid for semiconductor substrate

Also Published As

Publication number Publication date
DE3215966C2 (en) 1990-05-17

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D2 Grant after examination
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