DE3176292D1 - Substrate and integrated circuit module with this substrate - Google Patents
Substrate and integrated circuit module with this substrateInfo
- Publication number
- DE3176292D1 DE3176292D1 DE8181102043T DE3176292T DE3176292D1 DE 3176292 D1 DE3176292 D1 DE 3176292D1 DE 8181102043 T DE8181102043 T DE 8181102043T DE 3176292 T DE3176292 T DE 3176292T DE 3176292 D1 DE3176292 D1 DE 3176292D1
- Authority
- DE
- Germany
- Prior art keywords
- substrate
- integrated circuit
- circuit module
- module
- integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5383—Multilayer substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/15—Ceramic or glass substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Inorganic Insulating Materials (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/143,216 US4364100A (en) | 1980-04-24 | 1980-04-24 | Multi-layered metallized silicon matrix substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3176292D1 true DE3176292D1 (en) | 1987-08-06 |
Family
ID=22503105
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8181102043T Expired DE3176292D1 (en) | 1980-04-24 | 1981-03-19 | Substrate and integrated circuit module with this substrate |
Country Status (4)
Country | Link |
---|---|
US (1) | US4364100A (de) |
EP (1) | EP0038931B1 (de) |
JP (1) | JPS5927120B2 (de) |
DE (1) | DE3176292D1 (de) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57181356A (en) * | 1981-04-30 | 1982-11-08 | Hitachi Ltd | Sintered aluminum nitride body with high heat conductivity |
US4540621A (en) * | 1983-07-29 | 1985-09-10 | Eggerding Carl L | Dielectric substrates comprising cordierite and method of forming the same |
US4619697A (en) * | 1984-08-30 | 1986-10-28 | Mitsubishi Kinzoku Kabushiki Kaisha | Sputtering target material and process for producing the same |
US4608354A (en) * | 1984-12-24 | 1986-08-26 | Gte Laboratories Incorporated | Silicon nitride substrate |
DE3536883A1 (de) * | 1985-10-16 | 1987-04-16 | Isola Werke Ag | Basismaterial fuer gedruckte schaltungen |
US4882454A (en) * | 1988-02-12 | 1989-11-21 | Texas Instruments Incorporated | Thermal interface for a printed wiring board |
US4882657A (en) * | 1988-04-06 | 1989-11-21 | Ici Array Technology, Inc. | Pin grid array assembly |
DE3814863A1 (de) * | 1988-05-02 | 1989-11-16 | Siemens Ag | Verfahren zum herstellen von vielschichtenkeramik auf silikatbasis |
DE69117868T2 (de) * | 1990-05-15 | 1996-07-25 | Toshiba Kawasaki Kk | Zerstäubungstarget und dessen herstellung |
JP2756075B2 (ja) * | 1993-08-06 | 1998-05-25 | 三菱電機株式会社 | 金属ベース基板およびそれを用いた電子機器 |
US9741881B2 (en) * | 2003-04-14 | 2017-08-22 | S'tile | Photovoltaic module including integrated photovoltaic cells |
GB0623328D0 (en) * | 2006-11-22 | 2007-01-03 | Airbus Uk Ltd | A method for forming a feature in a piece of composite material |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3180742A (en) * | 1961-06-27 | 1965-04-27 | Dwight G Bennett | Elevated temperature resistant ceramic structural adhesives |
US3461524A (en) * | 1966-11-02 | 1969-08-19 | Bell Telephone Labor Inc | Method for making closely spaced conductive layers |
GB1180908A (en) * | 1966-11-17 | 1970-02-11 | English Electric Co Ltd | Improvements in or relating to processes for Forming an Insulating Coating on Silicon, and to Coated Silicon |
US3628778A (en) * | 1970-04-02 | 1971-12-21 | United States Steel Corp | Inner cover and method of making the same |
US3826813A (en) * | 1972-06-20 | 1974-07-30 | Ibm | Process for the preparation of mullite by a solid state reaction |
US3996885A (en) * | 1973-01-26 | 1976-12-14 | Eastman Kodak Company | Apparatus for coating a multiple number of layers onto a substrate |
US4040849A (en) * | 1976-01-06 | 1977-08-09 | General Electric Company | Polycrystalline silicon articles by sintering |
US4109377A (en) * | 1976-02-03 | 1978-08-29 | International Business Machines Corporation | Method for preparing a multilayer ceramic |
US4168343A (en) * | 1976-03-11 | 1979-09-18 | Matsushita Electric Industrial Co., Ltd. | Thermal printing head |
US4261781A (en) * | 1979-01-31 | 1981-04-14 | International Business Machines Corporation | Process for forming compound semiconductor bodies |
-
1980
- 1980-04-24 US US06/143,216 patent/US4364100A/en not_active Expired - Lifetime
-
1981
- 1981-03-19 DE DE8181102043T patent/DE3176292D1/de not_active Expired
- 1981-03-19 EP EP81102043A patent/EP0038931B1/de not_active Expired
- 1981-03-20 JP JP56039735A patent/JPS5927120B2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
EP0038931B1 (de) | 1987-07-01 |
EP0038931A3 (en) | 1984-07-25 |
JPS56161696A (en) | 1981-12-12 |
US4364100A (en) | 1982-12-14 |
EP0038931A2 (de) | 1981-11-04 |
JPS5927120B2 (ja) | 1984-07-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |