DE3138474A1 - "verfahren zur selektiven chemischen metallisierung" - Google Patents

"verfahren zur selektiven chemischen metallisierung"

Info

Publication number
DE3138474A1
DE3138474A1 DE19813138474 DE3138474A DE3138474A1 DE 3138474 A1 DE3138474 A1 DE 3138474A1 DE 19813138474 DE19813138474 DE 19813138474 DE 3138474 A DE3138474 A DE 3138474A DE 3138474 A1 DE3138474 A1 DE 3138474A1
Authority
DE
Germany
Prior art keywords
radiation
areas
layer
sensitive
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19813138474
Other languages
German (de)
English (en)
Other versions
DE3138474C2 (enrdf_load_stackoverflow
Inventor
Armin Dr.rer.nat. 7902 Blaubeuren Gemmler
Josef L. Dr.rer.nat. 7900 Ulm Jostan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Priority to DE19813138474 priority Critical patent/DE3138474A1/de
Publication of DE3138474A1 publication Critical patent/DE3138474A1/de
Application granted granted Critical
Publication of DE3138474C2 publication Critical patent/DE3138474C2/de
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
    • C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/185—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method by making a catalytic pattern by photo-imaging

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE19813138474 1981-09-26 1981-09-26 "verfahren zur selektiven chemischen metallisierung" Granted DE3138474A1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19813138474 DE3138474A1 (de) 1981-09-26 1981-09-26 "verfahren zur selektiven chemischen metallisierung"

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19813138474 DE3138474A1 (de) 1981-09-26 1981-09-26 "verfahren zur selektiven chemischen metallisierung"

Publications (2)

Publication Number Publication Date
DE3138474A1 true DE3138474A1 (de) 1983-04-14
DE3138474C2 DE3138474C2 (enrdf_load_stackoverflow) 1989-02-09

Family

ID=6142766

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19813138474 Granted DE3138474A1 (de) 1981-09-26 1981-09-26 "verfahren zur selektiven chemischen metallisierung"

Country Status (1)

Country Link
DE (1) DE3138474A1 (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0151413A3 (en) * 1984-01-17 1985-11-27 Inoue Japax Research Incorporated Auto-selective metal deposition on dielectric surfaces
US5017423A (en) * 1985-11-14 1991-05-21 German Textile Research Center North-West Fiber, filament, yarn and/or flat articles and/or nonwoven material containing these, as well as a process for producing the former
DE19705745A1 (de) * 1997-02-14 1998-08-20 Fraunhofer Ges Forschung Verfahren zum Bilden einer strukturierten Metallisierung auf einem Halbleiterwafer
EP1138804A3 (de) * 2000-03-27 2003-06-25 Infineon Technologies AG Bauelement mit zumindest zwei aneinander grenzenden Isolierschichten und Herstellungsverfahren dazu

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10300476A1 (de) * 2003-01-09 2004-07-22 Braun Gmbh Verfahren zum Herstellen einer partiellen Beschichtung auf der Oberfläche eines Kunststoffteils

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3436468A (en) * 1965-05-28 1969-04-01 Texas Instruments Inc Plastic bodies having regions of altered chemical structure and method of making same
DE1924817B2 (de) * 1968-05-15 1972-11-09 Shipley Co., Inc., Newton, Mass. (V.St.A.) Verfahren zur selektiven chemischen Metallisierung eines nichtleitenden Kunststoffsubstrats

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3436468A (en) * 1965-05-28 1969-04-01 Texas Instruments Inc Plastic bodies having regions of altered chemical structure and method of making same
DE1924817B2 (de) * 1968-05-15 1972-11-09 Shipley Co., Inc., Newton, Mass. (V.St.A.) Verfahren zur selektiven chemischen Metallisierung eines nichtleitenden Kunststoffsubstrats

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0151413A3 (en) * 1984-01-17 1985-11-27 Inoue Japax Research Incorporated Auto-selective metal deposition on dielectric surfaces
US5017423A (en) * 1985-11-14 1991-05-21 German Textile Research Center North-West Fiber, filament, yarn and/or flat articles and/or nonwoven material containing these, as well as a process for producing the former
DE19705745A1 (de) * 1997-02-14 1998-08-20 Fraunhofer Ges Forschung Verfahren zum Bilden einer strukturierten Metallisierung auf einem Halbleiterwafer
US6284639B1 (en) 1997-02-14 2001-09-04 Fraunhofer-Gesellschaft Zur Foerderung Der Angwandten Forschung E.V. Method for forming a structured metallization on a semiconductor wafer
DE19705745C2 (de) * 1997-02-14 2002-02-07 Fraunhofer Ges Forschung Verfahren zum Bilden einer strukturierten Metallisierung auf einem Halbleiterwafer
EP1138804A3 (de) * 2000-03-27 2003-06-25 Infineon Technologies AG Bauelement mit zumindest zwei aneinander grenzenden Isolierschichten und Herstellungsverfahren dazu
US6905726B2 (en) 2000-03-27 2005-06-14 Infineon Technologies Ag Component having at least two mutually adjacent insulating layers and corresponding production method

Also Published As

Publication number Publication date
DE3138474C2 (enrdf_load_stackoverflow) 1989-02-09

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee