DE3104504A1 - Device for producing any desired electrical circuit, which can be dismantled again, using a clamping technique on prefabricated printed-circuit boards having a matrix circuit - Google Patents

Device for producing any desired electrical circuit, which can be dismantled again, using a clamping technique on prefabricated printed-circuit boards having a matrix circuit

Info

Publication number
DE3104504A1
DE3104504A1 DE19813104504 DE3104504A DE3104504A1 DE 3104504 A1 DE3104504 A1 DE 3104504A1 DE 19813104504 DE19813104504 DE 19813104504 DE 3104504 A DE3104504 A DE 3104504A DE 3104504 A1 DE3104504 A1 DE 3104504A1
Authority
DE
Germany
Prior art keywords
circuit
printed
matrix
soldering
clamping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19813104504
Other languages
German (de)
Inventor
Joachim 8554 Gräfenberg Sojka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE19813104504 priority Critical patent/DE3104504A1/en
Publication of DE3104504A1 publication Critical patent/DE3104504A1/en
Withdrawn legal-status Critical Current

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Classifications

    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09BEDUCATIONAL OR DEMONSTRATION APPLIANCES; APPLIANCES FOR TEACHING, OR COMMUNICATING WITH, THE BLIND, DEAF OR MUTE; MODELS; PLANETARIA; GLOBES; MAPS; DIAGRAMS
    • G09B23/00Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes
    • G09B23/06Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes for physics
    • G09B23/18Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes for physics for electricity or magnetism
    • G09B23/183Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes for physics for electricity or magnetism for circuits
    • G09B23/185Models for scientific, medical, or mathematical purposes, e.g. full-sized devices for demonstration purposes for physics for electricity or magnetism for circuits for building block systems
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0286Programmable, customizable or modifiable circuits
    • H05K1/0287Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H05K1/0289Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Mathematical Analysis (AREA)
  • Computational Mathematics (AREA)
  • Algebra (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mathematical Optimization (AREA)
  • Mathematical Physics (AREA)
  • Pure & Applied Mathematics (AREA)
  • Business, Economics & Management (AREA)
  • Educational Administration (AREA)
  • Educational Technology (AREA)
  • Theoretical Computer Science (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

The invention is essentially intended for the construction of simple electronic circuits. Users are schools, training workshops or beginners in general. Particular advantages result from: the use of an original printed-circuit board, the use of normal components, the avoidance of wire connections (apart from the power supply), no soldering required (clamping or terminal technique), and not linked to circuitry (can be used for various circuits). The student or beginner can thus produce various circuits on one and the same printed-circuit board, without any knowledge of soldering. As a result of the use of the matrix technique, said student or starter is on the one hand confronted with printed-circuit boards and on the other hand avoids wiring as well as soldering. <IMAGE>

Description

B E S C H R E I Z U N G. B E S C H R E I Z U N G.

Die Erfindung hat sich zur Aufgabe gemacht, elektrische bzw.The invention has set itself the task of providing electrical or

elektronische Schaltungen nunmehr sowohl lötfrei, als auch ohne Verwendung von Schaltdrähten auf normalen Leiterplatten herzustellen. Die Schaltung ist nach Fertigstellung wieder zerlegbar.electronic circuits now both solderless and without use of jumper wires on normal printed circuit boards. The circuit is after Completion can be dismantled again.

Die Erfindung bedient sich der bereits bekannten im folgenden nach näher beschriebenen Matrix-Technik unter Verwendung lötfreier kontaktelemente. Damit ist es z.e. möglich, mit gleichen vorgefertigten LeiterplatLen und in lötfreier Technik ohne Verwendung von Schaltdrähten verschiedene Schaltungen aufzubauen.The invention makes use of those already known in the following Matrix technology described in more detail using solderless contact elements. In order to is it z.e. possible with the same prefabricated printed circuit boards and in solderless ones Technique to build different circuits without using jumper wires.

A@wendungsgebiete sind unter anderem: Schulung von Laien ohne Lötkenntnisse.A @ application areas are among others: Training of laypeople without knowledge of soldering.

Lehrmittel für Schulen.Teaching aids for schools.

Erstellung von Labormustern.Creation of laboratory samples.

Herstellung verschiedener Schaltungen auf einheitlichen Leiterplatten.Manufacture of different circuits on uniform printed circuit boards.

Als Basismaterial wird eine doppelseitig kaschierte Leiterplatte verwendet. Die in normalen Leiterplatten als "Lötauf bezeichneten Stützpunkte, auf denen das durch das Loctl gesteckte Bauteil festgelötet wird, werden im folgenden kurz "Loch" genannt.A double-sided laminated circuit board is used as the base material. The support points on which the is soldered by the Loctl plugged component, in the following are short "hole" called.

Auf der LCiterplatte sind zwei Zonen Löcher vorhanden, die jeweils verschiedenen Anwendungszwecken dienen.There are two zone holes on the LCiterplate, each serve different purposes.

zone 1 - Träger der Bauteile Zone 2 - Träger der Matrixpunkte Zur besseren Orientierung können,wie in Abb. 1 ersichtlich, die Löcher der Zone 1 z.B. Mit Nummern bezeichnet werden. zone 1 - carrier of the components Zone 2 - carrier of the matrix points To the For better orientation, as can be seen in Fig. 1, the holes in zone 1 e.g. Be denoted by numbers.

Die Zone 2 ( matrix ) ist l,.it beidseitigen Leiterbahnen versehen, die jeweils in verschiedenen Richtungen laufen, Dadurch wird erreicht, da? sich die Längs laufenden Bahnen der einen Seite, illit den Quer laufenden Bahnen der anderen Seite kreuzen. Befinden sich nun an den Kreuzungspunkten Löcher, so konnen an beliebigen Löchern Verbindungen von bestimmten Leiterbahnen der Seite 1 zu bestimmten Leiterbahnen der Seite 2 hergestellt werden.Zone 2 (matrix) is provided with conductive tracks on both sides, each running in different directions, this achieves that? themselves the longitudinal webs of one side, illit the transverse webs of the cross the other side. If there are now holes at the crossing points, so can Connections from specific conductor tracks on side 1 to specific ones at any holes Conductor tracks of side 2 are produced.

Da sich wie in Abb. 1 ersichtlich alle Leiterbahnen von Seite 1 mit allen Leiterbahnen von Seite 2 kreuzen, ist es möglich, eie Verbindung einer beliebigen Bahn der Seite 1 mit jeder beliebigen Bahn der Seite 2 herzustellen.Since, as can be seen in Fig. 1, all conductor tracks from side 1 are connected to cross all conductor tracks from side 2, it is possible to connect any Make side 1 panel with any side 2 panel.

Dazu muß nur durch das entsprechende kreuzungsloch ein leitfähiges Verbindungselement eingefügt werden. (z.B. Schraube, Niete, Federelement oder Troni-Clip) ( Siehe Pat.Nr.:80 100 910.All you have to do is insert a conductive one through the corresponding crossing hole Connection element can be inserted. (e.g. screw, rivet, spring element or Troni clip) (See Pat.No .: 80 100 910.

Jedes Loch in Zone 3 wirJ nun jeweils sowohl mit einer Bahn auf der Ober- als auch auf der Unterseite Cer Zone 2 verbunden.Each hole in zone 3 now has both a lane on the Top and bottom Cer Zone 2 connected.

Die entsprechenden Bahnen können zweckmäßigerweise mit der cjleichen Kennzeichnung ( z.B. Zahlen oder Buchstaben ) versehen werden.The corresponding tracks can expediently match the same Marking (e.g. numbers or letters) can be provided.

Es entsteht ein Koordinaten-Netz, dessen Kreuzungspunkte lcicht aufzufinden sind. Soll also in Zone 1 eine Verbindung zwischen beliebigen Punkten hergestellt werden, so braucht dazu nur iri Zone 2 am entsprechenden Kreuzungspunkt eine leitfähige Verbindung von der einen zur anderen Leiterbahnseite hergestellt werden. Zum Beispiel ist eine Verbindung von Punkt 2 nach 3 in der Zeichnung mit " X " inarkiert.A coordinate network is created, the crossing points of which can easily be found are. Should a connection be established between any points in zone 1 only need a conductive one in zone 2 at the corresponding crossing point Connection can be made from one to the other side of the conductor track. For example a connection from point 2 to 3 in the drawing is marked with "X".

In Zone 1 können beliebige Bauteile mit Schrauben, Federn, Nieten etc. zwischen beliebigen Punkten leitfähig befestigt werden. Die schaltungsspezifisch erforderlichen Verbindungen zwischen den einzelnen Bauteilen werden jr. Zone 2 durch Einfügen einer leitfähigen Verbindung am Kreuzungspunkt hergestellt.In Zone 1, any components with screws, springs, rivets etc. are conductively attached between any points. The circuit-specific required connections between the individual components are jr. Zone 2 through Insertion of a conductive connection made at the crossing point.

L e e r s e i t eL e r s e i t e

Claims (1)

S C T Z R E C H T E Herstellung von beliebigen elektriscien Schaltungen auf Leiterplatten, in wiederzerlegharer Klemmtechnik dadurch gekennzeichnet, daß auf einer normalen handelsüblichen Leiterplatte elektrische Bauteile in beliebiger Anordnung lötfrei durch Klemmen aufgebracht werden und die Klemnpunkte der Bauteile durch Leiterbahnen mit einer Matrixschaltung verbunden werden. S C T Z R E C H T E Manufacture of any electrical circuits on printed circuit boards, in re-dismantling clamping technology, characterized in that on a normal commercial printed circuit board electrical components in any Arrangement can be applied solderless by clamping and the clamping points of the components are connected to a matrix circuit by conductor tracks. Die schaltungsspezifischen Verbindungen der Bauteile untereinander werden durch einfügen eines Kontaktelementes an den Matrixkreuzungspunkten hergestellt.The circuit-specific connections between the components are made by inserting a contact element at the matrix crossing points.
DE19813104504 1981-02-09 1981-02-09 Device for producing any desired electrical circuit, which can be dismantled again, using a clamping technique on prefabricated printed-circuit boards having a matrix circuit Withdrawn DE3104504A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19813104504 DE3104504A1 (en) 1981-02-09 1981-02-09 Device for producing any desired electrical circuit, which can be dismantled again, using a clamping technique on prefabricated printed-circuit boards having a matrix circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19813104504 DE3104504A1 (en) 1981-02-09 1981-02-09 Device for producing any desired electrical circuit, which can be dismantled again, using a clamping technique on prefabricated printed-circuit boards having a matrix circuit

Publications (1)

Publication Number Publication Date
DE3104504A1 true DE3104504A1 (en) 1982-11-11

Family

ID=6124385

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19813104504 Withdrawn DE3104504A1 (en) 1981-02-09 1981-02-09 Device for producing any desired electrical circuit, which can be dismantled again, using a clamping technique on prefabricated printed-circuit boards having a matrix circuit

Country Status (1)

Country Link
DE (1) DE3104504A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104768327A (en) * 2015-03-26 2015-07-08 北京启智创源科技有限公司 Electronic product and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104768327A (en) * 2015-03-26 2015-07-08 北京启智创源科技有限公司 Electronic product and manufacturing method thereof

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