DE3066922D1 - A semiconductor memory device in which soft errors due to alpha particles are prevented - Google Patents

A semiconductor memory device in which soft errors due to alpha particles are prevented

Info

Publication number
DE3066922D1
DE3066922D1 DE8080301294T DE3066922T DE3066922D1 DE 3066922 D1 DE3066922 D1 DE 3066922D1 DE 8080301294 T DE8080301294 T DE 8080301294T DE 3066922 T DE3066922 T DE 3066922T DE 3066922 D1 DE3066922 D1 DE 3066922D1
Authority
DE
Germany
Prior art keywords
prevented
memory device
semiconductor memory
errors due
alpha particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8080301294T
Other languages
German (de)
Inventor
Junji Sakurai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE3066922D1 publication Critical patent/DE3066922D1/en
Expired legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C11/00Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/21Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
    • G11C11/34Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
    • G11C11/40Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
    • G11C11/401Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
    • G11C11/403Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh
    • G11C11/404Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh with one charge-transfer gate, e.g. MOS transistor, per cell
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/552Protection against radiation, e.g. light or electromagnetic waves
    • H01L23/556Protection against radiation, e.g. light or electromagnetic waves against alpha rays
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/10Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/107Substrate region of field-effect devices
    • H01L29/1091Substrate region of field-effect devices of charge coupled devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/762Charge transfer devices
    • H01L29/765Charge-coupled devices
    • H01L29/768Charge-coupled devices with field effect produced by an insulated gate
    • H01L29/76833Buried channel CCD
    • H01L29/7685Three-Phase CCD
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • H10B12/30DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H10B12/33DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor extending under the transistor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE8080301294T 1979-05-02 1980-04-23 A semiconductor memory device in which soft errors due to alpha particles are prevented Expired DE3066922D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5460679A JPS55146956A (en) 1979-05-02 1979-05-02 Semiconductor element having function for avoiding generation of soft error due to alpha ray

Publications (1)

Publication Number Publication Date
DE3066922D1 true DE3066922D1 (en) 1984-04-19

Family

ID=12975387

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8080301294T Expired DE3066922D1 (en) 1979-05-02 1980-04-23 A semiconductor memory device in which soft errors due to alpha particles are prevented

Country Status (4)

Country Link
EP (1) EP0018764B1 (en)
JP (1) JPS55146956A (en)
CA (1) CA1153829A (en)
DE (1) DE3066922D1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57210665A (en) * 1981-06-19 1982-12-24 Mitsubishi Electric Corp Semiconductor memory device
JPS602782B2 (en) * 1982-06-30 1985-01-23 富士通株式会社 semiconductor storage device
JPS60126861A (en) * 1983-12-13 1985-07-06 Fujitsu Ltd Semiconductor memory device
EP0169938B1 (en) * 1983-12-15 1989-03-29 Kabushiki Kaisha Toshiba Semiconductor memory device having trenched capacitor
US4688063A (en) * 1984-06-29 1987-08-18 International Business Machines Corporation Dynamic ram cell with MOS trench capacitor in CMOS
JPS62114265A (en) * 1985-11-13 1987-05-26 Mitsubishi Electric Corp Semiconductor memory device
US4852060A (en) * 1988-03-31 1989-07-25 International Business Machines Corporation Soft error resistant data storage cells
JPH07101733B2 (en) * 1988-05-20 1995-11-01 日本電気株式会社 Semiconductor memory device
JPH01305561A (en) * 1988-06-03 1989-12-08 Fujitsu Ltd Semiconductor storage device
FR2655197B1 (en) * 1989-11-28 1995-03-17 Sgs Thomson Microelectronics INTEGRATED CIRCUIT COMPRISING MEMORIES AND ITS MANUFACTURING METHOD.
JPH11224935A (en) 1997-12-02 1999-08-17 Mitsubishi Electric Corp Semiconductor integrated circuit board and manufacture of semiconductor integrated circuit thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5279787A (en) * 1975-12-26 1977-07-05 Toshiba Corp Integrated circuit device
DE2736473A1 (en) * 1977-08-12 1979-02-22 Siemens Ag METHOD OF MAKING A SINGLE TRANSISTOR MEMORY CELL

Also Published As

Publication number Publication date
EP0018764B1 (en) 1984-03-14
CA1153829A (en) 1983-09-13
EP0018764A1 (en) 1980-11-12
JPS6262065B2 (en) 1987-12-24
JPS55146956A (en) 1980-11-15

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Legal Events

Date Code Title Description
8339 Ceased/non-payment of the annual fee