DE3063183D1 - Micro helix thermo capsule - Google Patents

Micro helix thermo capsule

Info

Publication number
DE3063183D1
DE3063183D1 DE8080107154T DE3063183T DE3063183D1 DE 3063183 D1 DE3063183 D1 DE 3063183D1 DE 8080107154 T DE8080107154 T DE 8080107154T DE 3063183 T DE3063183 T DE 3063183T DE 3063183 D1 DE3063183 D1 DE 3063183D1
Authority
DE
Germany
Prior art keywords
thermo
capsule
helix
micro
micro helix
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8080107154T
Other languages
English (en)
Inventor
Frank Edward Andros
Robert John Eugene Shay
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=22307161&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE3063183(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3063183D1 publication Critical patent/DE3063183D1/de
Expired legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73253—Bump and layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE8080107154T 1979-12-20 1980-11-18 Micro helix thermo capsule Expired DE3063183D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/105,677 US4313492A (en) 1979-12-20 1979-12-20 Micro helix thermo capsule

Publications (1)

Publication Number Publication Date
DE3063183D1 true DE3063183D1 (en) 1983-06-16

Family

ID=22307161

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8080107154T Expired DE3063183D1 (en) 1979-12-20 1980-11-18 Micro helix thermo capsule

Country Status (5)

Country Link
US (1) US4313492A (de)
EP (1) EP0032178B1 (de)
JP (1) JPS5922154B2 (de)
CA (1) CA1130906A (de)
DE (1) DE3063183D1 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4395728A (en) * 1979-08-24 1983-07-26 Li Chou H Temperature controlled apparatus
US4727932A (en) * 1986-06-18 1988-03-01 The United States Of America As Represented By The Secretary Of The Air Force Expandable pulse power spacecraft radiator
FR2604827B1 (fr) * 1986-10-06 1989-12-29 Alsthom Dispositif de refroidissement par vaporisation pour semi-conducteurs de puissance
JPH0770650B2 (ja) * 1986-10-20 1995-07-31 富士通株式会社 半導体装置の冷却方法
US4789023A (en) * 1987-07-28 1988-12-06 Grant Frederic F Vibration isolating heat sink
US4951740A (en) * 1988-06-27 1990-08-28 Texas A & M University System Bellows heat pipe for thermal control of electronic components
US4842045A (en) * 1988-10-11 1989-06-27 The United States Of America As Represented By The Secretary Of The Air Force Expandable radiator
US5168543A (en) * 1991-04-05 1992-12-01 The Boeing Company Direct contact heater for vacuum evaporation utilizing thermal expansion compensation means
US5305184A (en) * 1992-12-16 1994-04-19 Ibm Corporation Method and apparatus for immersion cooling or an electronic board
US5578869A (en) * 1994-03-29 1996-11-26 Olin Corporation Components for housing an integrated circuit device
US5744752A (en) * 1995-06-05 1998-04-28 International Business Machines Corporation Hermetic thin film metallized sealband for SCM and MCM-D modules
DE10146442B4 (de) * 2001-09-20 2005-01-27 Thyssenkrupp Automotive Ag Vorrichtung zum Verbindung von zwei oder mehr Bauteilen mittels Nieten
US6665187B1 (en) * 2002-07-16 2003-12-16 International Business Machines Corporation Thermally enhanced lid for multichip modules
US20040052052A1 (en) * 2002-09-18 2004-03-18 Rivera Rudy A. Circuit cooling apparatus
US6695039B1 (en) 2003-02-25 2004-02-24 Delphi Technologies, Inc. Orientation insensitive thermosiphon assembly for cooling electronic components
TWI252831B (en) * 2003-03-31 2006-04-11 Jiun-Guang Luo Container having non-pressed sealing end and method for producing the same
US7353860B2 (en) * 2004-06-16 2008-04-08 Intel Corporation Heat dissipating device with enhanced boiling/condensation structure
US7403393B2 (en) * 2005-12-28 2008-07-22 International Business Machines Corporation Apparatus and system for cooling heat producing components
US8176972B2 (en) * 2006-08-31 2012-05-15 International Business Machines Corporation Compliant vapor chamber chip packaging
US7547582B2 (en) * 2006-09-26 2009-06-16 International Business Machines Corporation Method of fabricating a surface adapting cap with integral adapting material for single and multi chip assemblies
GB2543549B (en) * 2015-10-21 2020-04-15 Andor Tech Limited Thermoelectric Heat pump system

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1108663A (fr) * 1953-10-19 1956-01-16 Licentia Gmbh Système conducteur électrique asymétrique
US3450195A (en) * 1967-03-16 1969-06-17 Gen Electric Multiple circuit heat transfer device
GB1275946A (en) * 1969-01-28 1972-06-01 Messerschmitt Boelkow Blohm Apparatus for the conduction or exchange of heat
US3762011A (en) * 1971-12-16 1973-10-02 Trw Inc Method of fabricating a capillary heat pipe wick
DE2429985A1 (de) * 1974-06-21 1976-01-08 Siemens Ag Vorrichtung zur luftkuehlung eines scheibenthyristors
DE2505129A1 (de) * 1975-02-07 1976-08-19 Kabel Metallwerke Ghh Waermerohr
US3957107A (en) * 1975-02-27 1976-05-18 The United States Of America As Represented By The Secretary Of The Air Force Thermal switch
US3978518A (en) * 1975-11-12 1976-08-31 Rca Corporation Reinforced transcalent device

Also Published As

Publication number Publication date
EP0032178A1 (de) 1981-07-22
CA1130906A (en) 1982-08-31
US4313492A (en) 1982-02-02
JPS56100294A (en) 1981-08-12
EP0032178B1 (de) 1983-05-11
JPS5922154B2 (ja) 1984-05-24

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Legal Events

Date Code Title Description
8331 Complete revocation