DE29904493U1 - Auf einer Leiterplatte montierbare Stiftleiste mit abgewinkelten Kontaktstiften - Google Patents

Auf einer Leiterplatte montierbare Stiftleiste mit abgewinkelten Kontaktstiften

Info

Publication number
DE29904493U1
DE29904493U1 DE29904493U DE29904493U DE29904493U1 DE 29904493 U1 DE29904493 U1 DE 29904493U1 DE 29904493 U DE29904493 U DE 29904493U DE 29904493 U DE29904493 U DE 29904493U DE 29904493 U1 DE29904493 U1 DE 29904493U1
Authority
DE
Germany
Prior art keywords
circuit board
printed circuit
contact pins
pin header
angled contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE29904493U
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE29904493U priority Critical patent/DE29904493U1/de
Publication of DE29904493U1 publication Critical patent/DE29904493U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716—Coupling device provided on the PCB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10424—Frame holders
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
DE29904493U 1999-03-11 1999-03-11 Auf einer Leiterplatte montierbare Stiftleiste mit abgewinkelten Kontaktstiften Expired - Lifetime DE29904493U1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE29904493U DE29904493U1 (de) 1999-03-11 1999-03-11 Auf einer Leiterplatte montierbare Stiftleiste mit abgewinkelten Kontaktstiften

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE29904493U DE29904493U1 (de) 1999-03-11 1999-03-11 Auf einer Leiterplatte montierbare Stiftleiste mit abgewinkelten Kontaktstiften

Publications (1)

Publication Number Publication Date
DE29904493U1 true DE29904493U1 (de) 1999-06-10

Family

ID=8070722

Family Applications (1)

Application Number Title Priority Date Filing Date
DE29904493U Expired - Lifetime DE29904493U1 (de) 1999-03-11 1999-03-11 Auf einer Leiterplatte montierbare Stiftleiste mit abgewinkelten Kontaktstiften

Country Status (1)

Country Link
DE (1) DE29904493U1 (de)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1406351A2 (de) † 2002-10-02 2004-04-07 Siemens Aktiengesellschaft Stiftleiste
FR2856200A1 (fr) * 2003-06-16 2004-12-17 Framatome Connectors Int Ensemble de connexion electrique pour une carte de circuit imprime comprenant un connecteur, une entretoise d'appui et un organe de manipulation.
EP1719208A2 (de) * 2004-02-17 2006-11-08 Pem Management, Inc. Leiterplatten-anbringvorrichtung
DE102009017523A1 (de) * 2009-04-17 2010-10-28 Phoenix Contact Gmbh & Co. Kg Vorrichtung zur Montage von Stiften auf einer Leiterplatte
CN103974556B (zh) * 2013-01-30 2017-04-12 控制技术有限公司 一种在焊接前协助对准排针的方法及工具
WO2019086066A1 (de) 2017-11-06 2019-05-09 Phoenix Contact Gmbh & Co. Kg Steckverbinder
DE102018113432A1 (de) * 2018-06-06 2019-12-12 Samytronic UG Stiftleiste zur Montage an einer Leiterplatte
DE102018209899A1 (de) * 2018-06-19 2019-12-19 Continental Automotive Gmbh Diagnosemodul für ein Kraftfahrzeug
DE202022101142U1 (de) 2022-03-01 2023-06-02 PTR HARTMANN GmbH Stiftleiste
DE102022124994A1 (de) 2022-09-28 2024-03-28 Phoenix Contact Gmbh & Co. Kg Stiftleistenanordnung

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1406351A2 (de) † 2002-10-02 2004-04-07 Siemens Aktiengesellschaft Stiftleiste
DE10246094A1 (de) * 2002-10-02 2004-04-22 Siemens Ag Stiftleiste
EP1406351B2 (de) † 2002-10-02 2013-01-16 Siemens Aktiengesellschaft Stiftleiste
FR2856200A1 (fr) * 2003-06-16 2004-12-17 Framatome Connectors Int Ensemble de connexion electrique pour une carte de circuit imprime comprenant un connecteur, une entretoise d'appui et un organe de manipulation.
EP1719208A2 (de) * 2004-02-17 2006-11-08 Pem Management, Inc. Leiterplatten-anbringvorrichtung
EP1719208A4 (de) * 2004-02-17 2008-02-27 Pem Man Inc Leiterplatten-anbringvorrichtung
DE102009017523A1 (de) * 2009-04-17 2010-10-28 Phoenix Contact Gmbh & Co. Kg Vorrichtung zur Montage von Stiften auf einer Leiterplatte
CN103974556B (zh) * 2013-01-30 2017-04-12 控制技术有限公司 一种在焊接前协助对准排针的方法及工具
WO2019086066A1 (de) 2017-11-06 2019-05-09 Phoenix Contact Gmbh & Co. Kg Steckverbinder
DE102017125811A1 (de) 2017-11-06 2019-05-09 Phoenix Contact Gmbh & Co. Kg Steckverbinder
DE202018006398U1 (de) 2017-11-06 2020-04-16 Phoenix Contact Gmbh & Co. Kg Steckverbinder
DE102018113432A1 (de) * 2018-06-06 2019-12-12 Samytronic UG Stiftleiste zur Montage an einer Leiterplatte
DE102018209899A1 (de) * 2018-06-19 2019-12-19 Continental Automotive Gmbh Diagnosemodul für ein Kraftfahrzeug
DE202022101142U1 (de) 2022-03-01 2023-06-02 PTR HARTMANN GmbH Stiftleiste
DE102023104254A1 (de) 2022-03-01 2023-09-07 PTR HARTMANN GmbH Stiftleiste
DE102022124994A1 (de) 2022-09-28 2024-03-28 Phoenix Contact Gmbh & Co. Kg Stiftleistenanordnung

Similar Documents

Publication Publication Date Title
DE69939297D1 (de) Modularer Steckverbinder mit einer Leiterplatte
DE60045173D1 (de) Mehrschichtige Leiterplatte mit einer Lötstoppzusammensetzung
DE69420619D1 (de) Auf eine Leiterplatte montierbare, modulare Telefonsteckerbuchse
DE69812179D1 (de) Gedruckte schaltungsplatine mit integrierter schmelzsicherung
GB2316237B (en) Printed circuit board with electronic devices mounted thereon
DE69936235D1 (de) Mehrschichtige Leiterplatte mit gefüllten Kontaktlöchern
DE69943290D1 (de) Gedruckte Leiterplatte
DE60043603D1 (de) Verbinder für gedruckte Leiterplatten
KR950004865U (ko) 래치 클립이 장착된 인쇄 회로 기판의 전기 커넥터
DE69918489D1 (de) Erdungsklemme und dessen Montagestruktur auf einer Leiterplatte
FR2669149B1 (fr) Connecteur intermediaire entre carte de circuit imprime et substrat a circuits electroniques actifs.
DE60039569D1 (de) Gedruckte Leiterplatte
DE60028460D1 (de) EMV-gerechte Schirmkappe für einer Leiterplatte
DE60012834D1 (de) Leiterplattenkontaktierungsstruktur, elektronisches Gerät mit einer Leiterplattenkontaktierungsstruktur und darin verwendeter Verbinder
DE29904493U1 (de) Auf einer Leiterplatte montierbare Stiftleiste mit abgewinkelten Kontaktstiften
GB2360399B (en) Printed circuit board connector
DE69420144D1 (de) Elektrisches Stiftfeld auf einer Leiterplatte
GB0001573D0 (en) Printed circuit board with fuse
DE59913214D1 (de) Leiterplatte mit einem Kupplungselement einer Steckvorrichtung
SG91842A1 (en) Printed circuit board with shielded circuitry
DE60039650D1 (de) Folienschmelzsicherung auf einer Leiterplatte
DE69939157D1 (de) Gedruckte Leiterplatte
DE69503096D1 (de) Einrichtung zum Montieren von elektrischen Teilen auf einer Leiterplatte
FI19992062A (fi) Painettu piirilevy
DE69804921D1 (de) Anschlusselement für eine Leiterplatte

Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 19990722

R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01R0009090000

Ipc: H01R0012040000

R150 Utility model maintained after payment of first maintenance fee after three years

Effective date: 20020725

R151 Utility model maintained after payment of second maintenance fee after six years

Effective date: 20050606

R158 Lapse of ip right after 8 years

Effective date: 20071002