DE29802062U1 - Target für die Sputterkathode einer Vakuumbeschichtungsanlage - Google Patents

Target für die Sputterkathode einer Vakuumbeschichtungsanlage

Info

Publication number
DE29802062U1
DE29802062U1 DE29802062U DE29802062U DE29802062U1 DE 29802062 U1 DE29802062 U1 DE 29802062U1 DE 29802062 U DE29802062 U DE 29802062U DE 29802062 U DE29802062 U DE 29802062U DE 29802062 U1 DE29802062 U1 DE 29802062U1
Authority
DE
Germany
Prior art keywords
target
coating system
vacuum coating
sputter cathode
sputter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE29802062U
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WC Heraus GmbH and Co KG
Original Assignee
Leybold Materials GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leybold Materials GmbH filed Critical Leybold Materials GmbH
Priority to DE29802062U priority Critical patent/DE29802062U1/de
Publication of DE29802062U1 publication Critical patent/DE29802062U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • H01J37/3423—Shape
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
DE29802062U 1998-02-06 1998-02-06 Target für die Sputterkathode einer Vakuumbeschichtungsanlage Expired - Lifetime DE29802062U1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE29802062U DE29802062U1 (de) 1998-02-06 1998-02-06 Target für die Sputterkathode einer Vakuumbeschichtungsanlage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE29802062U DE29802062U1 (de) 1998-02-06 1998-02-06 Target für die Sputterkathode einer Vakuumbeschichtungsanlage

Publications (1)

Publication Number Publication Date
DE29802062U1 true DE29802062U1 (de) 1998-04-02

Family

ID=8052323

Family Applications (1)

Application Number Title Priority Date Filing Date
DE29802062U Expired - Lifetime DE29802062U1 (de) 1998-02-06 1998-02-06 Target für die Sputterkathode einer Vakuumbeschichtungsanlage

Country Status (1)

Country Link
DE (1) DE29802062U1 (de)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2641558A1 (de) * 1976-09-15 1978-03-16 Siemens Ag Verfahren zum aufbringen von elektrisch isolierenden schichten auf ein substrat durch hf-zerstaeubung (sputtern)
DD277471A1 (de) * 1988-11-28 1990-04-04 Mansfeld Kombinat W Pieck Veb Verbundtarget
WO1992004482A1 (en) * 1990-08-30 1992-03-19 Materials Research Corporation Pretextured cathode sputtering target and method of preparation thereof and sputtering therewith
WO1996033294A1 (en) * 1995-04-21 1996-10-24 Materials Research Corporation Method of making sputter target/backing plate assembly
EP0780487A1 (de) * 1995-12-22 1997-06-25 Applied Materials, Inc. Target-Anordnung mit einer Flachdichtung

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2641558A1 (de) * 1976-09-15 1978-03-16 Siemens Ag Verfahren zum aufbringen von elektrisch isolierenden schichten auf ein substrat durch hf-zerstaeubung (sputtern)
DD277471A1 (de) * 1988-11-28 1990-04-04 Mansfeld Kombinat W Pieck Veb Verbundtarget
WO1992004482A1 (en) * 1990-08-30 1992-03-19 Materials Research Corporation Pretextured cathode sputtering target and method of preparation thereof and sputtering therewith
WO1996033294A1 (en) * 1995-04-21 1996-10-24 Materials Research Corporation Method of making sputter target/backing plate assembly
EP0780487A1 (de) * 1995-12-22 1997-06-25 Applied Materials, Inc. Target-Anordnung mit einer Flachdichtung

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 19980514

R163 Identified publications notified

Effective date: 19980403

R150 Term of protection extended to 6 years

Effective date: 20010215

R157 Lapse of ip right after 6 years

Effective date: 20040901