DE29506550U1 - Arrangement of a power semiconductor component and a heat sink - Google Patents

Arrangement of a power semiconductor component and a heat sink

Info

Publication number
DE29506550U1
DE29506550U1 DE29506550U DE29506550U DE29506550U1 DE 29506550 U1 DE29506550 U1 DE 29506550U1 DE 29506550 U DE29506550 U DE 29506550U DE 29506550 U DE29506550 U DE 29506550U DE 29506550 U1 DE29506550 U1 DE 29506550U1
Authority
DE
Germany
Prior art keywords
arrangement
heat sink
power semiconductor
semiconductor component
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE29506550U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Doduco Solutions GmbH
Original Assignee
Doduco GmbH and Co KG Dr Eugen Duerrwaechter
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Doduco GmbH and Co KG Dr Eugen Duerrwaechter filed Critical Doduco GmbH and Co KG Dr Eugen Duerrwaechter
Priority to DE29506550U priority Critical patent/DE29506550U1/en
Publication of DE29506550U1 publication Critical patent/DE29506550U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE29506550U 1995-04-25 1995-04-25 Arrangement of a power semiconductor component and a heat sink Expired - Lifetime DE29506550U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE29506550U DE29506550U1 (en) 1995-04-25 1995-04-25 Arrangement of a power semiconductor component and a heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE29506550U DE29506550U1 (en) 1995-04-25 1995-04-25 Arrangement of a power semiconductor component and a heat sink

Publications (1)

Publication Number Publication Date
DE29506550U1 true DE29506550U1 (en) 1995-11-02

Family

ID=8006974

Family Applications (1)

Application Number Title Priority Date Filing Date
DE29506550U Expired - Lifetime DE29506550U1 (en) 1995-04-25 1995-04-25 Arrangement of a power semiconductor component and a heat sink

Country Status (1)

Country Link
DE (1) DE29506550U1 (en)

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 19951214

R156 Lapse of ip right after 3 years

Effective date: 19990202