DE2921211A1 - PCB chassis mounting method - by symmetrical setting of printed conductors and of components w.r.t. centreline for wire bridges joining - Google Patents

Abstract

Rational production of p.c.b.s with connecting pins reducing fabrication cost is ensured by symmetrical setting of two board (2, 3) w.r.t. the centre line. The printed conductors and components are spaced at equal distances from the centre line allowing for joining with wire bridges (13) secured by dip soldering. The connectors are parted at the mid-line when the board is divided to provide two similar p.c.b.s. This is facilitated by openings (7) separated by bridge pieces (8) symmetrically located w.r.t. the mid-line.

Description

Process for the manufacture of printed circuit boards

Summary: Process for the manufacture of printed circuit boards with connecting pins. The individual same printed circuit boards will be Arranged in pairs around a center line, manufactured using the dip soldering process, wherein the printed lines and the electronic components connecting them are point-symmetrical are arranged with respect to a point lying on the center line. The ends of the printed lines lie in pairs at equal distances from the line opposite and are connected to one another by wire bridges when the boards are fitted. After cutting the wire jumpers along the center line and severing the circuit board in the area between the centerline and the end connections of the printed lines result in two identical circuit boards with a row of connecting pins in the form of the wire ends.

State of the art: The ever advancing miniaturization of components for electronic devices allows a significant reduction in Housing dimensions or the dimensions of entire assemblies in these devices. at With the same dimensions of the housing, it is in turn possible to have significantly more functional groups to be built into the devices, so that they are more powerful and versatile in their Use and exploitation are.

However, every electronic circuit is characterized by its special wiring can only be reduced to a limited extent in terms of their areal expansion. Do you want that make better use of the available space, one must use the existing third dimension, any component placed on the printed circuit board as a result its height. Therefore the electronic circuits have been further subdivided and housed in a smaller volume in that with a 'main board smaller plug-in or solderable circuit boards were connected. The smaller ones Boards have individual connection pins that are inserted after the board has been assembled be connected to this in the dip soldering process. These individual connector pins but are relatively expensive in terms of material and in terms of the effort involved in equipping them.

Object of the invention: The invention is therefore based on the object specify a method for producing such pluggable or solderable circuit boards, which is very rational, with the connection pins fully satisfying the requirements consist of cost-saving material.

This object is characterized by what is stated in the claims Measures resolved.

Description: The invention is explained below on the basis of an exemplary embodiment explained with the help of the drawing.

Figure 1 shows the arrangement of several printed circuit boards on a common board; FIG. 2 shows a section of FIG. 1; figure 3 shows a side cross section of FIG. 2; Figure 4 shows a further side cross-section of Figure 2; FIG. 5 shows a view of a circuit board manufactured according to the method FIG. 6 shows several such circuit boards arranged on a module; figure 7 shows the solder side of the circuit board according to FIG.

According to the method specified in the claim, the individual Circuit boards in known technology for printed circuit boards on a Board 1 applied, as indicated in FIG. Two of the same in each case Circuit boards 2, 3 are arranged in pairs with point symmetry around center lines 4. This is shown in an enlarged illustration of section A in FIG. To Production of the main board 1 will be the individual smaller boards 2,3 of the point symmetry accordingly equipped with e.g. passive components 5 and active integrated ones Components 6. The plates 2, 3 arranged around the center lines 4 have openings 7 with intermediate webs 8.

The breakthroughs 7 have side edges 11 along the lines 9,10, 12, where end connections of the printed circuit boards are located. These end connections are connected with wire bridges 13 when equipping the board. Then takes place the well-known dip soldering process. Then the individual smaller boards 2, 3 punched out of the board 1. In Figure 3 is a side view III-III and shown in Figure 4 in a side view IV-IV of Figure 2, as with the help The webs 8 are severed by punches 12 and the wire bridges 13 are severed with the aid of punches 13 will.

In Figure 7 is the solder side of two not yet separated boards 2 and 3 shown. Here it becomes clear how the ~ -the connections 17 of the printed Circuits connecting wire bridges are fixed and aligned prior to severing will. After these wire bridges have been cut, the wire bridge ends are in place beyond the board and serve as plug-in connection pins as shown in FIG. on in this way, expensive power strips are saved, since they replaced by cheap wires.

Advantageously, the boards 2, 3 are only shortly before use separated from each other in the manufacture of the electronic device. this happens either by the punching process described above or by simply breaking around pre-scored lines 9, 10 after the wire bridges in the area of the center line 4 have been separated. This ensures that the protruding The wire ends remain aligned in parallel until the circuit board is installed.

In Figure 6 it is shown how several different, according to the above described method produced, individual boards 21, 22, 23 with a motherboard 16 connected to form a compact unit.

Claims (2)

Claims: 1. Process for the production of printed circuit boards with connecting pins for connection by plugging in or soldering to another printed circuit board, characterized in that in pairs around a center line (4) arranged two identical circuit boards (2,3) manufactured in the dip soldering process the printed lines and the components connecting them (5,5) point symmetrical with respect to a point (B) lying on the center line (4) are arranged and the ends (17) of the printed lines at equal intervals away from the center line (4) in pairs opposite each other with the help of wire bridges (13) are connected to one another in the immersion soldering process, after which they are separated the wire bridges in the area of the center line (4) as well as by cutting through or Breaking through the circuit board in the area between the center line (4) and the with the circuit boards (2,3) soldered wire ends two identical circuit plastics arise, with the protruding wire ends the connecting pins of the circuit board (2,3) form. 2. The method according to claim 1, characterized in that before the Equip the circuit boards along the center line C43 with openings (7) intermediate webs (8) are attached and the openings (7) with the Wire bridges (13) come to cover.