DE2815982A1 - Mask for making single and double sided printed circuits - uses conducting adhesive to bond pattern to foil and to allow correctness checks using ohmmeter - Google Patents

Mask for making single and double sided printed circuits - uses conducting adhesive to bond pattern to foil and to allow correctness checks using ohmmeter

Info

Publication number
DE2815982A1
DE2815982A1 DE19782815982 DE2815982A DE2815982A1 DE 2815982 A1 DE2815982 A1 DE 2815982A1 DE 19782815982 DE19782815982 DE 19782815982 DE 2815982 A DE2815982 A DE 2815982A DE 2815982 A1 DE2815982 A1 DE 2815982A1
Authority
DE
Germany
Prior art keywords
mask
foil
ohmmeter
printed circuits
allow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19782815982
Other languages
German (de)
Inventor
Martin Schweisser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE19782815982 priority Critical patent/DE2815982A1/en
Publication of DE2815982A1 publication Critical patent/DE2815982A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The mask consists of foil onto which patterns representing the finished circuit conducting paths and points representing connections for the final electronic components are bonded using an adhesive. The adhesive contains a conducting substance mixed into it in order to check the correctness of the finished mask pattern using an ohmmeter. The conducting substance may be carbon or copper powder. In the case of double-sided circuits, the patterns on opposite sides of the foil are connected electrically using fine needles passing through the foil at the appropriate places.

Description

Stand der TechnikState of the art

Die Erfindung geht aus von einer Maske nach der Gattung des Hauptanspruchs. Die Richtigkeit dieser fertig geklebten Masken wird bisher auf visuelle Weise überprüft. Das hat aber den Nachteil, daß bei einer Vielzahl von Leiterbahnen und Anschlußpunkten Fehler übersehen werden können, die dann erst nach der Herstellung der gedruckten Schaltung entdeckt werden.The invention is based on a mask according to the preamble of the main claim. The correctness of these pre-glued masks has so far been checked visually. But this has the disadvantage that with a large number of conductor tracks and connection points Errors can be overlooked only after the printed ones have been made Circuit to be discovered.

Vorteile der Erfindung Die erfindungsgemäße Maske mit den kennzeichnenden Merkmalen des Hauptanspruchs hat demgegenüber den Vorteil, daß es durch die Durchmischung des Klebematerials mit einem leitfähigen Material möglich ist, den Verlauf der Leiterbahnen mit einem Ohmmeter oder einem akustischen Prüfgerät zu überprüfen.Advantages of the invention The mask according to the invention with the characteristic Features of the main claim has the advantage that it is due to the mixing of the adhesive material with a conductive material is possible, the course of the conductor tracks check with an ohmmeter or an acoustic tester.

Beschreibung der Erfindung Zur Herstellung von gedruckten Schaltungen werden Masken verwendet, die auf kupferkaschierte, mit Fotolack beschichtete Platinen gelegt werden. Diese Anordnung wird belichtet und anschließend entwickelt. Die belichteten Lackflächen bleiben stehen und die unbelichteten werden entfernt. Die Masken werden in der Weise hergestellt, daß Klebematerial, das die Form von Leiterbahnen und Anschlußpunkten der elektrischen Bauelemente hat, in dem gewünschten Schaltungsverlauf auf eine Folie geklebt wird. Wenn große Systeme in gedruckter Schaltungstechnik entwickelt werden, gestaltet sich das Überprüfen der geklebten Maske äußerst schwierig und zeitraubend, da nur eine visuelle Kontrolle möglich ist.Description of the Invention For the manufacture of printed circuit boards masks are used that are mounted on copper-clad printed circuit boards coated with photoresist be placed. This arrangement is exposed and then developed. The exposed Lacquer areas remain and the unexposed ones are removed. The masks are Manufactured in such a way that adhesive material, which the shape of conductor tracks and connection points the electrical components has, in the desired circuit course on a Foil is glued. When developing large systems in printed circuit technology checking the bonded mask is extremely difficult and Time-consuming, as only a visual check is possible.

Wird dagegen das Klebematerial mit einem leitfähigen Material durchmischt, so ist die Möglichkeit der Überprüfung der Leiterbahnverläufe mit einem Ohmmeter oder mit einem akustischen Prüfgerät gegeben Dadurch läßt sich die Ausschußquote durch Fehler auf gedruckten Schaltungen verringern.If, on the other hand, the adhesive material is mixed with a conductive material, so is the possibility of review of the conductor tracks with given with an ohmmeter or with an acoustic tester Reduce scrap rate due to errors on printed circuit boards.

Für doppelseitig gedruckte Platinen gestaltet sich die Prüfung etwas schwieriger, da leitfähige Verbindungen zwischen den Leiterbahnen und Anschlußpunkten auf der unteren und der oberen Seite der Maske gegeben sein müssen.For circuit boards printed on both sides, the test is somewhat more complex more difficult because there are conductive connections between the conductor tracks and connection points must be given on the lower and upper side of the mask.

Es wird für jede Seite der Platine eine Maske auf Folie erstellt, die anschließend übereinandergelegt und an den Übergangspunkten von der unteren auf die obere Seite mit feinen Nadeln leitend verbunden werden. Durch diese zusätzliche Maßnahme ist wiederum die Prüfung durch Ohmmeter oder durch akustische Prüfgeräte möglich.A mask is created on foil for each side of the board, which are then superimposed and at the transition points from the lower one be conductively connected on the upper side with fine needles. Through this additional The measure is again testing with an ohmmeter or acoustic test equipment possible.

Claims (4)

Ansprüche ii. Maske zur Herstellung von einfachen oder doppelseitig bedruckten Schaltungen, bei der die Leiterbahnen und Anschlußpunkte der elektrischen Bauelemente mit Hilfe eines Klebematerials in der entsprechenden Form nachgebildet und auf eine Folie geklebt sind, dadurch gekennzeichnet, daß das Klebematerial mit einem leitfähigen Material durchmischt ist.Claims ii. Mask for making single or double sided printed circuits, in which the conductor tracks and connection points of the electrical Structural elements reproduced in the appropriate form with the aid of an adhesive material and are glued to a film, characterized in that the adhesive material with a conductive material is mixed. 2. Maske nach Anspruch 1, dadurch gekennzeichnet, daß das Klebematerial mit Kohlenstoff durchmischt ist.2. Mask according to claim 1, characterized in that the adhesive material is mixed with carbon. 3. Maske nach Anspruch 1, dadurch gekennzeichnet, daß das Klebematerial mit Kupferpulver durchmischt ist.3. Mask according to claim 1, characterized in that the adhesive material is mixed with copper powder. 4. Maske nach Anspruch 1, dadurch gekennzeichnet, daß bei doppelseitiger Beschichtung die nachgeformten Leiterbahnen an den übergangspunkten von der unteren zur oberen Seite der Maske mit feinen Nadeln leitend verbunden sind.4. Mask according to claim 1, characterized in that when double-sided Coating the post-formed conductor tracks at the transition points from the lower one are conductively connected to the upper side of the mask with fine needles.
DE19782815982 1978-04-13 1978-04-13 Mask for making single and double sided printed circuits - uses conducting adhesive to bond pattern to foil and to allow correctness checks using ohmmeter Withdrawn DE2815982A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19782815982 DE2815982A1 (en) 1978-04-13 1978-04-13 Mask for making single and double sided printed circuits - uses conducting adhesive to bond pattern to foil and to allow correctness checks using ohmmeter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19782815982 DE2815982A1 (en) 1978-04-13 1978-04-13 Mask for making single and double sided printed circuits - uses conducting adhesive to bond pattern to foil and to allow correctness checks using ohmmeter

Publications (1)

Publication Number Publication Date
DE2815982A1 true DE2815982A1 (en) 1979-10-18

Family

ID=6036870

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19782815982 Withdrawn DE2815982A1 (en) 1978-04-13 1978-04-13 Mask for making single and double sided printed circuits - uses conducting adhesive to bond pattern to foil and to allow correctness checks using ohmmeter

Country Status (1)

Country Link
DE (1) DE2815982A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2480553A1 (en) * 1980-04-09 1981-10-16 Ruf Kg Wilhelm PRINTED CIRCUIT BOARD AND METHOD FOR THE PRODUCTION THEREOF

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2480553A1 (en) * 1980-04-09 1981-10-16 Ruf Kg Wilhelm PRINTED CIRCUIT BOARD AND METHOD FOR THE PRODUCTION THEREOF
DE3013667A1 (en) * 1980-04-09 1981-10-29 Wilhelm Ruf KG, 8000 München CIRCUIT BOARD AND METHOD FOR THE PRODUCTION THEREOF
US4440823A (en) * 1980-04-09 1984-04-03 Wilhelm Ruf Kg Printed board for electrical circuits

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Legal Events

Date Code Title Description
8139 Disposal/non-payment of the annual fee