DE2611749B2 - - Google Patents

Info

Publication number
DE2611749B2
DE2611749B2 DE2611749A DE2611749A DE2611749B2 DE 2611749 B2 DE2611749 B2 DE 2611749B2 DE 2611749 A DE2611749 A DE 2611749A DE 2611749 A DE2611749 A DE 2611749A DE 2611749 B2 DE2611749 B2 DE 2611749B2
Authority
DE
Germany
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE2611749A
Other languages
German (de)
Other versions
DE2611749A1 (de
DE2611749C3 (de
Inventor
Heinz 8000 Muenchen Martin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE2611749A priority Critical patent/DE2611749C3/de
Priority to GB49360/76A priority patent/GB1564965A/en
Priority to US05/775,979 priority patent/US4126883A/en
Priority to JP2853577A priority patent/JPS52114273A/ja
Priority to FR7707651A priority patent/FR2344964A1/fr
Priority to IT21291/77A priority patent/IT1077522B/it
Priority to SE7703078A priority patent/SE7703078L/xx
Publication of DE2611749A1 publication Critical patent/DE2611749A1/de
Publication of DE2611749B2 publication Critical patent/DE2611749B2/de
Application granted granted Critical
Publication of DE2611749C3 publication Critical patent/DE2611749C3/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/073—Apertured devices mounted on one or more rods passed through the apertures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Die Bonding (AREA)
DE2611749A 1976-03-19 1976-03-19 Halbleiteranordnung mit einem über Spannbolzen durch Druck kontaktierbaren Halbleiterbauelement Expired DE2611749C3 (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
DE2611749A DE2611749C3 (de) 1976-03-19 1976-03-19 Halbleiteranordnung mit einem über Spannbolzen durch Druck kontaktierbaren Halbleiterbauelement
GB49360/76A GB1564965A (en) 1976-03-19 1976-11-26 Semiconductor components
US05/775,979 US4126883A (en) 1976-03-19 1977-03-09 Pressure-mounted semiconductive structure
FR7707651A FR2344964A1 (fr) 1976-03-19 1977-03-15 Dispositif a semi-conducteur comprenant un composant semi-conducteur raccordable par pression
JP2853577A JPS52114273A (en) 1976-03-19 1977-03-15 Pressure contact type semiconductor device
IT21291/77A IT1077522B (it) 1976-03-19 1977-03-16 Dispositivo a semiconduttori con un componente a semiconduttori che puo' essere messo in contatto mediante l'applicazione di una pressione
SE7703078A SE7703078L (sv) 1976-03-19 1977-03-17 Halvledaranordning med en medelst tryck kontakterbar halvledarkomponent

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2611749A DE2611749C3 (de) 1976-03-19 1976-03-19 Halbleiteranordnung mit einem über Spannbolzen durch Druck kontaktierbaren Halbleiterbauelement

Publications (3)

Publication Number Publication Date
DE2611749A1 DE2611749A1 (de) 1977-09-22
DE2611749B2 true DE2611749B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1980-02-21
DE2611749C3 DE2611749C3 (de) 1980-11-13

Family

ID=5972963

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2611749A Expired DE2611749C3 (de) 1976-03-19 1976-03-19 Halbleiteranordnung mit einem über Spannbolzen durch Druck kontaktierbaren Halbleiterbauelement

Country Status (7)

Country Link
US (1) US4126883A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS52114273A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE2611749C3 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR (1) FR2344964A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
GB (1) GB1564965A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
IT (1) IT1077522B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
SE (1) SE7703078L (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4224663A (en) * 1979-02-01 1980-09-23 Power Control Corporation Mounting assembly for semiconductive controlled rectifiers
US4559580A (en) * 1983-11-04 1985-12-17 Sundstrand Corporation Semiconductor package with internal heat exchanger
US4686499A (en) * 1984-09-28 1987-08-11 Cincinnati Microwave, Inc. Police radar warning receiver with cantilevered PC board structure
FR2592988B1 (fr) * 1986-01-16 1988-03-18 Jeumont Schneider Dispositifs de refroidissement de semi-conducteurs
US5191224A (en) * 1987-04-22 1993-03-02 Hitachi, Ltd. Wafer scale of full wafer memory system, packaging method thereof, and wafer processing method employed therein
KR960012649B1 (en) * 1987-04-22 1996-09-23 Hitachi Ltd Wafer scale or full wafer memory system, package, method thereof and wafer processing method employed therein
US5539151A (en) * 1992-09-25 1996-07-23 Vlsi Technology, Inc. Reinforced sealing technique for an integrated-circuit package
DE4421319A1 (de) * 1994-06-17 1995-12-21 Abb Management Ag Niederinduktives Leistungshalbleitermodul
US5549155A (en) * 1995-04-18 1996-08-27 Thermacore, Inc. Integrated circuit cooling apparatus
KR200192652Y1 (ko) * 2000-03-29 2000-08-16 조준상 대전력용 회로부품의 특성을 향상시키기 위한 방열장치
DE112011105612B4 (de) * 2011-09-13 2014-12-31 Toyota Jidosha Kabushiki Kaisha Halbleitermodul
DE102012206407B4 (de) * 2012-04-18 2017-05-04 Infineon Technologies Ag Druckkontaktanordnung und verfahren zur herstellung und zum betrieb einer druckkontaktanordnung

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2826725A (en) * 1953-11-10 1958-03-11 Sarkes Tarzian P-n junction rectifier
US2766409A (en) * 1955-02-28 1956-10-09 Internatioanl Rectifier Corp Fluid cooled encapsulated rectifier stack
US2959718A (en) * 1957-04-08 1960-11-08 Int Rectifier Corp Rectifier assembly
US2852723A (en) * 1957-04-22 1958-09-16 Int Rectifier Corp Interplate contactor for a rectifier
CH396220A (de) * 1962-03-30 1965-07-31 Bbc Brown Boveri & Cie Halbleiteranordnung
US3445738A (en) * 1967-01-20 1969-05-20 Int Rectifier Corp Non-polarized clamping selenium rectifier
US3532942A (en) * 1967-05-23 1970-10-06 Int Rectifier Corp Pressure-assembled semiconductor device housing having three terminals
US3475660A (en) * 1967-12-01 1969-10-28 Int Rectifier Corp Hollow cylindrical semiconductor device
DE1924011C3 (de) * 1969-05-10 1979-02-01 Siemens Ag, 1000 Berlin Und 8000 Muenchen Stromrichter mit zwei parallelen, durch Abstandsstücke getrennten Schienen
US3646407A (en) * 1970-09-21 1972-02-29 Philips Corp Radiation detector having a semiconductor crystal
US3652903A (en) * 1971-02-01 1972-03-28 Gen Electric Fluid cooled pressure assembly
US3727114A (en) * 1971-08-03 1973-04-10 Mitsubishi Electric Corp Air cooled semiconductor stack
US3925802A (en) * 1973-02-27 1975-12-09 Mitsubishi Electric Corp Semiconductor device

Also Published As

Publication number Publication date
IT1077522B (it) 1985-05-04
DE2611749A1 (de) 1977-09-22
FR2344964A1 (fr) 1977-10-14
GB1564965A (en) 1980-04-16
JPS52114273A (en) 1977-09-24
US4126883A (en) 1978-11-21
SE7703078L (sv) 1977-09-20
DE2611749C3 (de) 1980-11-13

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Legal Events

Date Code Title Description
OD Request for examination
C3 Grant after two publication steps (3rd publication)
8339 Ceased/non-payment of the annual fee