DE2405429A1 - PROCEDURE FOR DRAWNING AN OBJECT - Google Patents

Description

PATENT LAWYERS

Dr.-Ing. HVJS RUSCHKE Dip! - Ing. OLAF RUSCHKE Dip: .- In5.}: .- \ NS E. RUSCHKE

I OERLlN 33
Auguste-Viktofia-Siraße 65

PjT ¹ CFi j rhi tn EIeC ⁺ TTn Jr-H ₁ ip ^ T ^ ni C ".. Ltd ..

\ ./ pT ^> F => h ' ^p pn τι iii ¹ Ü ^ pr ^ iohpn one

D? .5 ETfinr1un ⁿ h ^^ p. ° ht- ^ tnh puf p ^ p. PROVIDED ¹ Pn to ^{overturn Bin 1} ? ¹ "" pp ¹ 5 nshpn ^ priprp pi if a Verf ^ bppn ·? Ιιγρ Knittgu ^ h γΙ · πγ7 ff'iT · γΙί r? F'rir3c ^ annT> n (i! Jl-j + i pn, ⁰ PP !!. ΠΠ ¹ ^ t ΙΕ ?! ".

yppt-nbrcp z ¹ 'in UbETZ ¹ PPPP ^v / nn i-! e ^r ' Pp ^c ! t ^ npp.n known only to a j ° nder ei ° em GigsnhBrz'.n. Tn practice is ÖPT riarip the üblinhste method for Ri.Tdung a Hprzüberzugs, that one applies a carrier material which contains the Überzunsharz to an article by ALfsprühen or dipping and curing the so applied coating after drying. Another method is to adhere and cure a powdery method of forming a glass draft on a heated gene stand. The usual procedure for forming a glass cover consists in puffing the glass with a brush or cloth. Problems arise with the formation of the heart cover and the glass ^cover · ^ζ Η _Γπ} ^ r ^ nnch of the usual methods aufqetrsrene coating on each ü ^h erzc "-; 2n2n Hörpcr from part to Toil a uno.leichm5 ^R ip.E thickness and has further comprising one fairly small Dicks leg Übrziehen electronic. parts is also hei schuierin the usual procedures 3ine contamination from a part of the supply line that should uerrien soldered to an electrical Schaltuno of the electronic part ^1, to prevent it.

509832/0598

T- ixr2 ⁿ t die Auf ^ nhn ^ '^ rundG, ^ in process of coating cj + rjnHnn τΰΐ g: * π ^π η dici'nn Hnr ^ - GC ⁴ Gr GJasüberzug with Uniform Thickness

Dr ₃ T- Ft-fΐPt ¹ VH "lin ^ ^J -Fnr-PGr the Ai. ' ⁷ ^? ¹ ^ e is based on a conviction to the l'berziehon ι'ηπ Π ^^ ππβϊγγΊ ^ π rnit ρ ^ πήπ ^^ "" 7— ndGT Glasüberz'jn without holes added. Po- "πη r-ιΗρτ- B "l ΞΞΕΠ Z '! GCh-T ^ f ίΠ.

^r lTrh dar Erfinriun "should also nin V / Grf-nhrRn for covering vcn GenenBtänrlpn" Dr ^ri 2r; ch.la ".ep uerdsn, rinp · hcnnnders is suitable for the t-iasscnpraduktian.

P'ac'i eier invention is also intended to provide a method for coating electronic Parts with the connected supply lines are created through which the Do not contaminate the supply line with excess material.

Z ': r LnEun ^ djeser Ai'fr-n ^h en nnf - l-'vt the invention a l / learned to cover a property not to be added \ ynr, which is characterized thereby, riaR the GG ^ Rnstand? I on one ria ⁿ temperature below freezing van Ch] nrfluorGthan, DASR sin NichtlncunGsmitte] forms for the coating particles, (the RenGnGtnnd) a ^h ki'hlt, Oine Susncnsion vnn Chlcrfluorethan with disper therein ^ ierten HarzüberzurcteilrhGn forms, dipping the article into the suspension, so A layer of the suspension is formed on the surface of the chlorofluoroethane by freezing the chlorofluoroethane, the suspension is kept at a temperature above the freezing point of the chlorofluoroethane, the result of the suspension being taken out of the chlorofluorethane contained in the frozen layer Er'-crmen of the article to a temperature above the boiling point of Chlorfluoräthans removed and a layer of the H? tz zurückcebliebsnen the particles on the surface of the article by EruSrnen ^h ildet.

These and other objects on which the invention is based and their solution are the following detailed description in connection with the Refer to drawings.

509 832/0598 _BAD original

Ip c! C2D Ζπϊ nhnU ^ EP Cl ΠΓ ¹ the F? "^ ijrnn 1 ι · ηΗ 9 τ; γ; · -ο '-' γ '" ¹ "'". "γ! ~ 2 Dt ¹ TT :!" ¹ "? ^Ί 'Τ-" πη ΓΓ U ¹ Tr p.hti in ⁿ rur DuTcbf'! Her ¹ inr dos [

is figure 3 a Dianrarnn, dan you? fc-iehun ^ nunnnhen dor thickness rtcr? never Coating on .the Genenstand applied layer and the temperature of the cooled object reproduces una

are the figures k Ca) to - + Cc) schEmaux & chs Unrf-: ce .jur ~ rjr i'r ^ vgv. unr ^ .- is zum L ^ ore -'- eiiies EleKuruiiibuntiu idils v-.jmi axialbu type qu "iLj ..; üüp invention.

According to the invention, particles of a coating material, resin or glass, which are applied as a layer, are dispersed in a layer for these particles and a susceptibility is formed by coating particles. LJenn the suspension at one temperature o ^o he dnn GifriErpun -: t of the Uri-jendetsn IMichtlösunnsmittels is held, it is located in a liquid state. Further, the viscosity rier suspension dur-nh Repelunn the concentration of riispErniertEn it treat with resin! Uring sn Einnestellt is that the Uisknsität for immersion de.? The object to be coated is suitable for the suspension. For the FpII des Hgrzühsrzu ^ s, the preferred concentration of the particles takes care of almost 1o ^h : s 5n * Grw .-? ^{Ü, h} r2zones on the non-absorbent.

At a concentration above 5 % by weight, the flowability of the suspension for immersion of the object in the suspension is undesirably reduced. For the glass coating, the preferred concentration is higher than that for the resin coating because the specific gravity of the glass particles is greater than that of the resin particles.

The object to be coated is brought to a temperature below freezing point of the Michtlnsunnsmittel used and cooled in the suspension submerged. Then, after freezing, the air-conditioning agent is frozen Layer formed from the suspension on the surface of the article. This frozen layer consists of a mixture of the rubbing solvent and the superfluous particles.

509832/0598

BATH ORIGINAL

Uenn der Gencin ^ tanri in γΈγ suspension rehaltpn yjrd, which is a hfiherp. temperature pi.Ts the GpfriErnunkt of the IM ^ nhtlosnnr-R means, melts the neh: lrietp. Layer j π of the suspension. Hence, the genealogy on which The frozen layer has formed on the surface, removed from the suspension, and at the same time the object is heated to remove the insolvent to evaporate and one only existed by the practitioners Layer to hilripn. Then, by further heating, the superfluous particles hardens and a uniform layer is formed on the object.

The above-described coating method is intended for mass production suitable for its simplicity, and the layer formed is by a It is quite thick and has no holes. Pores open. Because of the method of enveloping, it is convenient to hold an object such as a To coat a film capacitor for which heating is unsuitable and for which such a coating by conventional methods is difficult is to be raised. After learning the invention, an article easily coated with any shape such as a tubular object. Objects with complex shapes can be used after the conventional method, such as the spray method, is difficult be coated.

Material useful as a light solvent for the resin particles is included a chlorofluoroethane system with preferably a freezing point close to room temperature, if the freezing point is too low, problems arise as a result, that it is difficult and expensive to remove the object to be coated cool to a temperature below freezing point. Furthermore, if the object is wetted by the water contained in the air, in ' causes small holes or pores in the layer formed. If other- ' Since the freezing point of the nonsolvent is too high, heating is possible the suspension lost weight solvers. Further, when the boiling point of the non-solvent is too high, the resin particles will be dissolved before I. the non-solvent is completely evaporated, and the j Layer uneven because of the nonsolvent I content it contains middle. In addition, an increase in temperature because of a shortening of the i Pot life or service life of the coating particles is undesirable. Even though

509832/0598.!

different types of chlorofluoroethane are available, from the point of view of practical handling, when cooling the genes and evaporating the solvent, the preferred chlorofluoroethanes CCl _n FCCl ₀ F (according to international

C. C-

national abbreviation 112), CCl-JCClF ₉ (112a) and CCl FCClF ₀ (113a), the freezing points of 23.5, 4o, 6 and 1'f C and Sieriepun'-te of ⁿ 2, B,? 1.5 and /! 5.7 ^° C. The temperature of the suspension is kept slightly higher than the freezing point of the nonsolvent. If it is too high, the cold temperature of the object immersed in the suspension will be moderated and no frozen layer will be formed from the suspension.

If the suspension has a low concentration of the coating particles, It is activated as soon as the non-solvent of the formed on the object frozen layer is evaporated from the suspension by heating, sometimes causes the layer of remaining particles to slide down. In such a case the suspension suitably contains a binder. Then the layer does not slide down and can be fed to the subsequent hardening process. To form an even layer should be the binder in the non-solvent for the layer to be applied Resin particles be soluble. For the case of a resin coating belong to suitable binders Polvstyloi (polystylene) and denatured Silicone resin. The latter dissolves well in epoxy resin, which is preferably used as a coating material for the method of the invention. The preferred one Binder concentration ranges from 0.1 to 5.0% by weight. Too big one The amount of the binder undesirably affects the properties of the resin particles and leads to unevenness of the obtained layer.

en

Embodiments of the invention are described in more detail in the following examples explained.

example 1

Disk-type resistors have been coated with epoxy resin, as will be explained in more detail below with reference to Figs. In Figure 1 the resistors indicated by the reference number 1 were cooled from Snheibentyp to a temperature close 5 ^D C in a refrigerating chamber. 2

509 8 3 2/0598

Dry air was continuously poured into the cooling chamber 2 and a diving chamber x 3 VDn a year. <f from einoeieiteb. u ± e cooled Luiderstünde were
in the TsüLjhkami.iar j klärmeschutzwand beyond a 5 and brought into the
The suspension 6 contained in the immersion tank 9 is immersed.

The suspension G consisted of epoxy resin particles with the composition given below as a coating material and a mixture of 9o parts by weight of 1,2-difluoro-1,1,2,2-tetrachloroethane (CCl ₂ FCCl ₂ F) and 1o parts by weight of 2,2-difluoro- 1,1,1,2-tetrachloroethane (CCl ₃ CClF ₂ ), which was the non-solvent of the particles. Such a mixture is commercially available under the trade name Daiflnn S "(manufactured by VDn Daikin-kogyo-Cn., Japan) and has a freezing point of 26 ^D C and a boiling point of
91 to 93 C. The composition of the epoxy resin used is as follows:

Base composition: Bisphenol A-type epoxy resin, Epikote 1oo7 (Shell Chem.
Co., USA) lon π

Hardener: aromatic amine, '+, it'-diaminodiphenyl sulfone, 3.5 g i

Filler: SiD ₂ , 25 π:

Lubricant: stearic acid, 10 g
Pigment: ^ ^e ? ^a s> ¹¹ p

The composition had a melting range of 1oo to 119 ⁰ C. The Honzentration i of the epoxy resin particles was 1o to 5o Geu .-%. The temperature of the suspen- j

ο ■

Sion was continuously at almost 3o C by means of a heating device! 1o and a cooler 11 held. In addition, the suspension was easily i stirred with a stirrer 12 in order to achieve a uniform concentration in the suspension to accomplish. When the resistors are immersed in the suspension 6 the stirring was stopped.

After immersing the resistors in the suspension for 5 seconds
the resistors removed. It then had a frozen layer
13 from the suspension, ie the mixture of the Epoxyharzteilohsn and the
Non-solvent Daiflon S _{2 formed} on the surface of each resistor.

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_ 7 -

The resistors 1 removed from the suspension immediately became the supplied to the next process stage. That is, the pjichtlnünrjsmittel was by The resistors are heated in a drying chamber 14, which is shown in FIG is evaporated. A layer 15 consisting only of the Epoxy resin particles was formed there.

The layer 15 slipped down when there was some vibration on the resistance was exercised. In addition, when the concentration of the epoxy resin particles was low, the same problem was caused. The sliding down of the Layer 15 could by adding Polystylnl in a concentration of 100 ppm to the suspension as a binder can be prevented. Denatured Silicone resin was also used to prevent the layer from slipping off 15 suitable.

The dry layer 15 was then at 13o C, the curing temperature of the Epoxy resin, heated for 20 minutes, and it became a hardened layer 16 formed. The thickness of the layer obtained was 1, d to 1.2 mm.

Transporting the resistors into and out of chambers 2, 3 and 14 was carried out continuously by means of sliding devices. The steam of the Weight solvent in the drying chamber 14 was pumped 18 absorbed and condensed in a cooler 18. The steam could be collected in a container 19. This is to degrade the plating box he wishes.

In general, the thickness of the layer formed increased with the increase the temperature difference between the object to be coated and the Suspension. Figure 3 shows such a relationship between temperature of the object and the thickness of the layer obtained for those in the figure specified conditions.

j. Example-2

A suspension which corresponded to that of Example 1 was used. The concentration the epoxy resin particles was 35 to 45 Geu .-%, and the temperature

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The suspension was kept at 27 to 32 ° C. 3 types of resistors, in the form of an electronic part of the axial type with two lead wires lengthways at the two ends, with a diameter of Β mm and a length of ο mm, a diameter of θ mm and a length of 20 mm and a diameter of 1.5 mm and a length of 8 mm, were ^{cooled to a temperature of -9 to -15 0} C and in the suspension 41 for 5 to 1d seconds up to a point of 1.5 mm Conductor 44 is immersed from the end of the resistor body as shown in Figure 4 (a). The frozen layer 43 of the suspension was then formed on the surface of the resistor body 42, the other lead wire 44 'and the portion of the lead wire 44 which is immersed in the suspension 41, as shown in Figure 4 (b).

After removing the resistors from the immersion bath, a cutting tool was used 45 to the frozen layer formed on the lead wire 44 'from a horizontal direction A, as in Figure 4 (c) is shown, pressed to cut this layer, and then was the cutting tool moves downward in the direction B accordingly, wherein it slid along the lead wire 44 '. Then the one on the lead wire could 44 'formed frozen layer 46 can easily be removed therefrom.

This procedure of pressing and moving the cutting tool was carried out, while the formed layer 43 was kept as it was. Through this procedure, the layer formed on the resistor body became 43 not damaged. It wasn't necessary to see the full scope of the Cutting around lead wire, and also by cutting only part of it the layer 46 this could easily be removed. After that the shift stayed only back on the desired part, i.e. on the resistor body and on the part of the lead wires.

Then, as in Example 1, the resistors were placed in the dryer with a Brought to a temperature of .12o ° C, in which the non-solvent is first! was steamed and the surface of the epoxy resin particles was partially pale,

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could be prevented by the sliding of the layer due to the heating. With increasing temperature, the melt Epaxyharzteilchen and formed a uniform layer hl, k as shown in FIG dnr Cd) is shown. The thickness of the layer obtained was n, fi bin 1, n mm.

Example 3

A suspension was prepared by the same l \ iinhtläsun ^ri agents like in the example 1, and 3d wt .-> u fJylonteilchen 12 and 2 wt .-> o Palystylal ujurüen as binders in the auspension qsliiRt. The small air level as in Example c was thawed into the duspension, and the frozen layer from the suspension was formed in the same way. After the layer was separated from the lead wire 2 as in Example 2, the remaining layer was formed by heating the surface. A uniform iMylon layer 12 was formed.

remaining layer hardened by heating the resistor at 200 ° C.

Example h

33 wt / ow polyvinyl chloride particles were immersed in the same non-solvent dispersed as in Example 1, and a cooled iron plate was immersed in the suspension obtained. The pool of the iron plate on the surface The frozen layer formed from the suspension was kept at 12o C hardened, and thereby the iron plate was coated with a uniform layer of polyvinyl chloride.

Example 5

Wirewound resistors have been used with low melting point glass coated with a suspension system with the following composition:

Iodine g glass powder

2.15 g binder, ethyl cellulose

193.2 g non-solvent, Daiflon S ₂

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- 1α -

The glass powders consisted of 88% by weight of PbO and 12% by weight of BO and had an average grain size of 1.0 μm. The suspension was kept at 27 ^° C. and the wire resistors were cooled to -12 ° C. and then immersed in the suspension so that a frozen layer of the suspension formed on the surface of the resistor. After the resistors had been removed from the suspension, the nonsolvent was first evaporated and then the resistors were kept in the vicinity of 30 ° C. for 3 minutes, so that the binder was completely burned off. Thereafter, the resistor was heated for a further 10 minutes at 35.degree. C. in order to completely melt the glass powder. Finally, the resistor was cooled to room temperature at a rate of 10 ° C./minute and a uniform layer of glass was formed on the surface of the wire resistor, this glass chain having no holes or pores and a thickness of 0.8 mm.

Dr.Ue / Ho

509832/0598

Claims (1)

Claims M. I. A process for coating an article with coating particles, characterized in that at a temperature below the freezing point van ChlorfluDräthan, which is a IMichtlösunnsmittel for coating particles, cooling the object, forms a suspension of Chlarfluaräthan-dispersed coating particles, the article in the suspension is immersed so that a layer of the suspension is formed on the surface of the object by freezing the chlorofluoroethane, the suspension is kept at a temperature above the freezing point of the chlorofluoroethane, the object is removed from the suspension, the chlorofluoroethane contained in the frozen layer through Heating the gene stand to a temperature above the boiling point of the chlorofluoroethane and forms a layer of the remaining particles on the surface of the gene stand by heating. 2. The method according to claim 1, characterized in that Chlorfluoräthan from the group consisting of CCl ₂ FCCl ₂ F (112 ^ ₁ CCl ₃ CClF ₂ (112a), and CCl ₂ selects group consisting -FCClF ₂ (113a). 3. The method according to claim 1, characterized in that the Coating particles are resin particles. k. Process according to Claim 3, characterized in that the resin particles are dispersed at a concentration of 1o to 5o% by weight, based on chlorine luojbethane. j 5. The method according to claim 3, characterized in that the Sus pension contains a binder in a concentration of d, 1 to 5, o Geu .-%, which is soluble in chlorofluoromethane and this binder consists of polystyrene and / D the denatured silicone resin. 6. The method according to claim 1, characterized in that the coating particles are glass particles 509832/0598 7. The method according to claim 1, characterized in that the object An electrical part is. 8. The method according to claim 7, characterized in that the electronic part is an axial type with zljei LeitunnsdrähtEn along dsn
both ends of the wire, εϊπεγ of the two lead wires and the nanzE body of the electronic part immersed in the suspension, and that one formed on the surface of the immersed wire
Layer the suspension by means of a cutting tool after removing the said part from the suspension. 509832/0598