DE2361531C3 - Elektrolumineszierende Anordnung und Verfahren zu ihrem Betrieb - Google Patents

Elektrolumineszierende Anordnung und Verfahren zu ihrem Betrieb

Info

Publication number
DE2361531C3
DE2361531C3 DE2361531A DE2361531A DE2361531C3 DE 2361531 C3 DE2361531 C3 DE 2361531C3 DE 2361531 A DE2361531 A DE 2361531A DE 2361531 A DE2361531 A DE 2361531A DE 2361531 C3 DE2361531 C3 DE 2361531C3
Authority
DE
Germany
Prior art keywords
current
electroluminescent
diode
luminous flux
radiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE2361531A
Other languages
German (de)
English (en)
Other versions
DE2361531A1 (de
DE2361531B2 (de
Inventor
Jacques Caen Calvados Lebailly
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of DE2361531A1 publication Critical patent/DE2361531A1/de
Publication of DE2361531B2 publication Critical patent/DE2361531B2/de
Application granted granted Critical
Publication of DE2361531C3 publication Critical patent/DE2361531C3/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0756—Stacked arrangements of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
  • Illuminated Signs And Luminous Advertising (AREA)
DE2361531A 1972-12-13 1973-12-11 Elektrolumineszierende Anordnung und Verfahren zu ihrem Betrieb Expired DE2361531C3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7244359A FR2248663B1 (enrdf_load_stackoverflow) 1972-12-13 1972-12-13

Publications (3)

Publication Number Publication Date
DE2361531A1 DE2361531A1 (de) 1974-06-20
DE2361531B2 DE2361531B2 (de) 1981-05-21
DE2361531C3 true DE2361531C3 (de) 1982-01-21

Family

ID=9108628

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2361531A Expired DE2361531C3 (de) 1972-12-13 1973-12-11 Elektrolumineszierende Anordnung und Verfahren zu ihrem Betrieb

Country Status (7)

Country Link
US (1) US3875473A (enrdf_load_stackoverflow)
JP (2) JPS529994B2 (enrdf_load_stackoverflow)
CA (1) CA1011440A (enrdf_load_stackoverflow)
DE (1) DE2361531C3 (enrdf_load_stackoverflow)
FR (1) FR2248663B1 (enrdf_load_stackoverflow)
GB (1) GB1459455A (enrdf_load_stackoverflow)
IT (1) IT1001409B (enrdf_load_stackoverflow)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4063231A (en) * 1976-10-26 1977-12-13 Modern Controls, Inc. Visual display apparatus
US4488149A (en) * 1981-02-26 1984-12-11 Givens Jr William A Electronic display having segments wherein each segment is capable of selectively illuminating two colors
FR2520934B1 (fr) * 1982-01-29 1985-06-07 Radiotechnique Compelec Dispositif semi-conducteur emetteur de lumiere a multicristaux
US4780643A (en) * 1983-03-30 1988-10-25 Minnesota Mining And Manufacturing Company Semiconductor electrodes having multicolor luminescence
US4857801A (en) * 1983-04-18 1989-08-15 Litton Systems Canada Limited Dense LED matrix for high resolution full color video
US4559116A (en) * 1984-07-09 1985-12-17 Minnesota Mining And Manufacturing Company Process of etching semiconductor electrodes
US4864370A (en) * 1987-11-16 1989-09-05 Motorola, Inc. Electrical contact for an LED
US5652178A (en) * 1989-04-28 1997-07-29 Sharp Kabushiki Kaisha Method of manufacturing a light emitting diode using LPE at different temperatures
US5707891A (en) * 1989-04-28 1998-01-13 Sharp Kabushiki Kaisha Method of manufacturing a light emitting diode
DE3940853A1 (de) * 1989-12-11 1991-06-13 Balzers Hochvakuum Anordnung zur niveauregelung verfluessigter gase
TW383508B (en) * 1996-07-29 2000-03-01 Nichia Kagaku Kogyo Kk Light emitting device and display
US6274890B1 (en) * 1997-01-15 2001-08-14 Kabushiki Kaisha Toshiba Semiconductor light emitting device and its manufacturing method
TW408497B (en) * 1997-11-25 2000-10-11 Matsushita Electric Works Ltd LED illuminating apparatus
DE19952932C1 (de) * 1999-11-03 2001-05-03 Osram Opto Semiconductors Gmbh LED-Weißlichtquelle mit breitbandiger Anregung
US6513949B1 (en) * 1999-12-02 2003-02-04 Koninklijke Philips Electronics N.V. LED/phosphor-LED hybrid lighting systems
US6666567B1 (en) 1999-12-28 2003-12-23 Honeywell International Inc. Methods and apparatus for a light source with a raised LED structure
AUPQ818100A0 (en) * 2000-06-15 2000-07-06 Arlec Australia Limited Led lamp
US7320632B2 (en) 2000-06-15 2008-01-22 Lednium Pty Limited Method of producing a lamp
US6525464B1 (en) * 2000-09-08 2003-02-25 Unity Opto Technology Co., Ltd. Stacked light-mixing LED
JP2002314143A (ja) * 2001-04-09 2002-10-25 Toshiba Corp 発光装置
JP4101468B2 (ja) * 2001-04-09 2008-06-18 豊田合成株式会社 発光装置の製造方法
US6841931B2 (en) * 2001-04-12 2005-01-11 Toyoda Gosei Co., Ltd. LED lamp
NZ531587A (en) 2002-06-14 2008-06-30 Lednium Technology Pty Ltd A lamp and method of producing a lamp
TW591811B (en) * 2003-01-02 2004-06-11 Epitech Technology Corp Ltd Color mixing light emitting diode
TW200507226A (en) * 2003-03-12 2005-02-16 Lednium Pty Ltd A lamp and a process for producing a lamp
EP1473771A1 (en) * 2003-04-14 2004-11-03 Epitech Corporation, Ltd. Color mixing light emitting diode
US7204050B2 (en) * 2003-12-29 2007-04-17 Sargent Manufacturing Company Exit device with lighted touchpad
US7339332B2 (en) * 2004-05-24 2008-03-04 Honeywell International, Inc. Chroma compensated backlit display
JP4841550B2 (ja) * 2004-06-30 2011-12-21 ソウル オプト デバイス カンパニー リミテッド 発光素子及びその製造方法並びにこれを用いた発光装置
JP2009519598A (ja) * 2005-12-14 2009-05-14 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 所望の色点の光を作り出す方法及び半導体光源
US20070274093A1 (en) * 2006-05-25 2007-11-29 Honeywell International, Inc. LED backlight system for LCD displays
DE102006035658B4 (de) 2006-07-31 2013-07-18 Ivoclar Vivadent Ag Handgeführtes LIchthärtgerät
DE102007011637A1 (de) * 2007-03-09 2008-09-18 Ivoclar Vivadent Ag Lichtemissionsvorrichtung
CN102341740B (zh) * 2009-06-22 2015-09-16 财团法人工业技术研究院 发光单元阵列、其制造方法和投影设备

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3499158A (en) * 1964-04-24 1970-03-03 Raytheon Co Circuits utilizing the threshold properties of recombination radiation semiconductor devices
US3603833A (en) * 1970-02-16 1971-09-07 Bell Telephone Labor Inc Electroluminescent junction semiconductor with controllable combination colors
US3740570A (en) * 1971-09-27 1973-06-19 Litton Systems Inc Driving circuits for light emitting diodes

Also Published As

Publication number Publication date
US3875473A (en) 1975-04-01
IT1001409B (it) 1976-04-20
FR2248663A1 (enrdf_load_stackoverflow) 1975-05-16
JPS5472484U (enrdf_load_stackoverflow) 1979-05-23
CA1011440A (en) 1977-05-31
FR2248663B1 (enrdf_load_stackoverflow) 1978-08-11
JPS529994B2 (enrdf_load_stackoverflow) 1977-03-19
JPS49100988A (enrdf_load_stackoverflow) 1974-09-24
GB1459455A (en) 1976-12-22
DE2361531A1 (de) 1974-06-20
DE2361531B2 (de) 1981-05-21

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Legal Events

Date Code Title Description
C3 Grant after two publication steps (3rd publication)
8339 Ceased/non-payment of the annual fee