DE2156699B2 - - Google Patents
Info
- Publication number
- DE2156699B2 DE2156699B2 DE19712156699 DE2156699A DE2156699B2 DE 2156699 B2 DE2156699 B2 DE 2156699B2 DE 19712156699 DE19712156699 DE 19712156699 DE 2156699 A DE2156699 A DE 2156699A DE 2156699 B2 DE2156699 B2 DE 2156699B2
- Authority
- DE
- Germany
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/46—Regeneration of etching compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19712156699 DE2156699C3 (de) | 1971-11-15 | 1971-11-15 | Verfahren und Vorrichtung zum automatischen Regenerieren von KupferchloridÄtzmittellösungen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19712156699 DE2156699C3 (de) | 1971-11-15 | 1971-11-15 | Verfahren und Vorrichtung zum automatischen Regenerieren von KupferchloridÄtzmittellösungen |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| DE2156699A1 DE2156699A1 (de) | 1973-05-24 |
| DE2156699B2 true DE2156699B2 (enExample) | 1974-11-14 |
| DE2156699C3 DE2156699C3 (de) | 1975-07-03 |
Family
ID=5825185
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19712156699 Expired DE2156699C3 (de) | 1971-11-15 | 1971-11-15 | Verfahren und Vorrichtung zum automatischen Regenerieren von KupferchloridÄtzmittellösungen |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE2156699C3 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3473891D1 (en) * | 1984-10-19 | 1988-10-13 | Ibm Deutschland | Process for automatically regenerating cupric chloride etching solutions |
-
1971
- 1971-11-15 DE DE19712156699 patent/DE2156699C3/de not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE2156699C3 (de) | 1975-07-03 |
| DE2156699A1 (de) | 1973-05-24 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C3 | Grant after two publication steps (3rd publication) | ||
| E77 | Valid patent as to the heymanns-index 1977 | ||
| 8339 | Ceased/non-payment of the annual fee |