DE2124252C3 - Solder for high temperature soldering of construction materials - Google Patents

Description

The invention relates to a solder for high- To lower the Lot ^ ™ P "^ ^r j-" j ⁿ _{ichender Eigcil} !

temperature soldering of construction materials, the a ^ flußrnIU * «^ LoU ^ e ^, ^ ^^

Particularly favorable is the use of the genai.n shafts, a '"" component antimony,

th solders in the manufacture of bulky steel condensate y ™ ^ ™ *** vTcntsp ° ozent) up to 3.5 " _a struc- tures made of carbon and low-alloy 30 in fi ^^^^ Many other components in the following SaT said solder, sic. ^ Also when soldering ^ quantities 0 "Ge.-ht%) ^ e _S en. 3";. Iron-nickel alloys, hard alloys with steel-manganese 1 "." 1. ₃ " _{/ o Aium;}

Apply lcn as well as metal-ceramic. zium, 0.1% ^ f J ^ " ¹ " ^ " _{0 06} » /. sulfur and

For high-temperature soldering of construction materials, a total of no more than υ, υο materials is largely the use of Lo-phosphorus, the rest bisen. ^. _{t des} ΐ ^, _{Γι / l (}

ten known ,, the manganese, silicon, carbon, boron Um e.ne min m ^ e -hmelz mpe ^

^ »RsÄÄ. SEJ: = - 3Ä 2Ϊ- »- -n, nod, u. So 'is from ^P d; _r British Patent 996 177 ^ u-

Ttsrrs ;: ^ ⁴⁵ ^ pf ^^^^^^ -

on the limits of constructions with great lengths. _z

of the connections (for example in trusses), the g "J ^

gladly) as well as in the mass production of various human melts of the components

(For example in the case of the butt joint 5 * ^ 8 ^^^^ / - ^; ^ ° ^ ^. (In the form of

of pipes). In the above-mentioned cases, you are in balance

Zwungcn, other less production-friendly connections Fohe ^^^^ _{Lots should} ensure

Process w ^ e the high temperature, whose Bcgjel ^ mpe »^^^^^^

(mechanical cleaning, pickling, etc.) as well as guarantee ^ '^ "^^ 3 _{aIl im Lol of} less than

S ¹ ES SIÄÄ ^ Ä ", ^{1! InCrlKilb dCr for} " - ^ = sSr melting temperature of the Lo. until

The purpose of the invention is the participation of the e ₅ at 1400 C ^ "", " _{in the L () t}

corresponds to its total content in solid solutions with iron, nickel and copper and guarantees a short melting interval. (1080 to 1120 C), which is one of the main requirements in soldering (short holding time at the soldering temperature).

Copper is used in the solder because of its high plastic characteristics as well as its ability introduced, the solder wetting according to the invention and to impart high capillary properties.

The reduction of the percentage of copper below 7%> increases the melting temperature of the solder, while an increase in this content above 15 ⁰ Zo leads to increase phenomena during soldering, so that subsequent processing of the product (plastering of the excess solder in the form of bulges) is necessary .

The copper content in the solder in an amount of 12% corresponds to the solid solution with manganese and silicon. This copper case is guaranteed in the Lot! guie capillary Properties of the solder and its wettability.

Nickel is used in the solder to improve the plastic properties of the soldered joint and to help Ensuring the corrosion resistance of the latter introduced.

The increase in the nickel content in the solder above 20 ^u υ increases its melting temperature.

The content of nickel in the solder below 11 ⁰ Zo worsens the corrosion properties of the solder.

The melting temperature of the binary nickel-manganese alloy is 1018 C for the manganese content in the alloy of 60 ° u, with the optimal content of nickel in the solder being 12.5 "0. The said Melting temperature of the binary alloy nickel-manganese is the lowest melting temperature for the given pair of metals.

Thanks to its egg-like properties, silicon increases strength the alloy and, being a good deoxidizer, ensures its introduction into the Solder a flux-free solder.

Silicon forms limited solid solutions with iron, manganese and nickel, which give the 1 increased plastic properties. However, causes the introduction of about 4.5 ⁰ O silicon in the solder is the loss of these properties, while the reduction of its content below 0.5 ⁰ O down considerably lowers the fluxless brazing enabling characteristics.

Its optimal content in an amount of 2.5 ⁰ O in the solder ensures full solubility of silicon and gives the solder the properties necessary for flux-free soldering.

Carbon is introduced into the solder for lowering the Schrdztemperatur, however, the maximum content thereof is limited in the solder with 0.5 ⁿ "due to the occurrence of Lolsprödigkeit. This can be explained by the fact that at the ratio Mn / C> 10 the notched impact strength of the solder alloy falls, so that the solder becomes sensitive to cracking.

It has been proven that if the carbon content ^{in the solder exceeds 0.5 0} zo, a pin zone is formed as a result of the diffusion of the alloy components (boron, aluminum, silicon), which is accompanied by a sharp disturbance of the even distribution of carbon.

The presence of the pearl zone leads to a reduction in the strength of the soldered joint.

De. optimal carbon content (0.1 ^u / 'o) corresponds to its complete solution in the solder.

Boron, which is a surface active element, spreads on the surface of the grains of the base metal and slows down the phase conversions in the solder joint.

Boron considerably lowers the melting temperature of the alloy and ensures that it is flux-free Soldering, however, its content in the solder above 0.5% increases the brittleness of the latter.

The boron content below 0.05 ⁰ Zo brings about no wetting effect without flux.

The boron content in an amount of 0.07% gives the solder good suitability for flux-free soldering and lowers its melting temperature, which also influences the plastic behavior of the soldered joint will.

Aluminum is introduced into the solder to increase the viscosity when soldering products with large To ensure gaps; at the same time it lowers the melting temperature.

However, with an aluminum content of over 10.5 ⁰ Zo the alloy due to the formation of nitrides is aherungsanfällig.

In addition, an aluminum content above 10.5 ⁰ Zo leads to grain growth at temperatures above 1000 ⁰ C, as a result of which the strength of the soldered connection decreases.

The aluminum content below 0.03%> in the solder does not guarantee the required viscosity and allows consequently not to solder constructions with gaps exceeding 0.2 mm.

Aluminum, which is contained in the solder in an amount of 0.05 "Zo, ensures sufficient viscosity and holds the melt in the gaps up to 1.5 mm.

Since the raw materials used in technology (iron, manganese, etc.) are admixtures contain sulfur and phosphorus, their presence in the solder is inevitable.

However, increasing the total content of these elements over 0.08 ° 0 causes a severe deterioration the soldering properties (cracking when deformed, heat resistance, toxicity, etc.).

A dilatometric analysis of the solder, which consists of 32 ⁰ zo manganese, 12.5 ⁰ zo nickel, 12.0 ⁰ zo copper, 2.5 «0 silicon, 1.0 ⁰ zo carbon, 0.07 ⁰ zo boron, 0.03 ⁰ O aluminum, sulfur and phosphorus in total not more than 0.06 ° O, the remainder being iron, showed that in the temperature range between 20 and 950 ° C no conversions accompanied by changes in volume were recorded. This shows that there are no phase changes and no internal stresses arise, which is why cracking is impossible.

Antimony in the solder improves the suitability for flux-free soldering and lowers the melting temperature of the solder, but its content in the solder above 3.5 "Z ₀ causes the strength values of the soldered joints to drop.

In addition to the advantages mentioned, the solder is the the proposed composition is inexpensive compared to the solders used for the same purposes, because instead of expensive and scarce components (silver, palladium, tin) and components, which are used in large quantities (copper, nickel), less expensive and weaker components like manganese and others come to use.

For a better understanding of the invention, a specific embodiment of the same is given below . • introduced.

example

The soldering of low-carbon steel is carried out by means of a solder consisting of 32 ⁰ zo manganese, 12.5% nikkei, 12.0% copper, 2.5 ⁰ zo silicon, 0.1 ⁰ zo carbon, 0.07 ⁰ zo Boron, 0.03 ⁰ Zo aluminum, a total of at most 0.06 ⁰ Zo sulfur and phosphorus, the remainder being iron, is carried out at a temperature of 1150 ^c C in a protective atmosphere.

Tensile specimens of the overlapped shocks revealed that in a temperature range from ⁰ C to +400 -SO strength of the soldered joint according 3Ü to 27 kg / mm ² is secured.

Tests of the butt joints with gaps of 0.2 to 1.2 mm showed that the strength of the soldered joint corresponds to that of the base metal.

Notched bar impact tests with soldered connections at an angle of 45 gave 7.4 kpZcm-, which makes up 80 ⁰ Zo of the values of the notched impact strength of the base metal.

ίο Tensile tests of the overlapped joints showed that the strength increases to 25 to 32 kpZmm ² with the enlargement of the soldering gap from 0.2 to 0.6 mm.

Tensile tests of the overlapped joints showed the greatest strength when brazing hot rolled Steel without prior preparation Jer Surfaces is achieved.

Claims (3)

u cc r, u / plrhes thanks to its composites ^ .sc5, affetn ;. *; ICSPr with the patent claims to be soldered: setting d; e making patent claims: setting the j ^^ ^ ^^ 1. Solder for high-temperature soldering of con-base metal giei _isses guaranteed and tion constructive materials, such as iron-nickel Legie- ^lem P ^{e, ra 'ur'} _"e F ^ enschaft possesses portion of column stanchions, hard alloys, steels, metal ^{ceramics 5 ™ βεΓαε: η} . ° ' ^ε _ρη ^ _zu ! _m m without preparing the and especially carbon and leather alloyed ^ ' ^lsc L; ^e . ⁿ . ^{to connect in} " ^{c for} _oiling , and wel- Steels, characterized in that surfaces turcL the solder (in percent by weight) from 27 to 40% ^che _n ^s . ^cost " ^g " ⁿ _e ^Stl f _ufRa b _e is determined by a plumb bob Manganese, 11 to 20 · /. Nickel, 7 to 15 · /. Copper, the gestelte Auig _construct in _o nswerkstoffen. 0.5 to 4.5 Vo silicon, 0.02 to 0.5 · /. Carbon io ^{high temperature} .P "X? _E t exercises, hard alloys. fabric, 0.05 to 0.5 · /. Boron 0.03 to 10.5% aluminum, such as ^e ^ ";. ^^ ^B _as particularly carbon hh 008 / Shfl and Stahle MeWllkerami ^ ^ _fid nium, in total not more than Ό.08% sulfur and steels,. ^Me f "^ ™ ä _nle solved what invention Phosphorus, the remainder being iron. and n'edngeg. rte Stan g ^ ^ ^ _{4 {)} , ^ 2. Lot according to claim 1, characterized _{gekennze.ch- according to bes en ■ from u "Nicke] 7 to 15} o _{/ o Kupicri} net that it (in percent by weight) from 32.0% 15 ManganH to -" _{050 / o Kohlenslutii} Manganese, 12.5% nickel, 12.0% copper, 2.5% 0.5 ms 4 5 .-. Sihziun ^ υ _{Aluminum,; Ils} silicon, 0.1 · /. Carbon, 0.07% boron, 0.03 »/ 0 0.05 to 0.5 /. Boron U £> ° ^ _{ph (j} aluminum, in total not more than 0.06% Schwegesanit not more than etc. fei and phosphorus, the remainder being iron. Remainder iron. . j _{solder to} use. 3. Lot according to claim ^{2, characterized marked- *, Α} ™. ™ ^ Α ^ $ from 32.0% manganese, net that there is additionally the (in Gewi clvtspro ^^ ^ ₅ ^ ^. ^ ^ Nor ^{Antimony in an amount of up to 3.5% contains 1} A3, Tf 07% boron 0 03% aluminum, all in all camouflaged the highest; 0.06% sulfur and phosphorus, R *.