DE2115369A1 - Printed circuits with glass or ceramic platelets - printed with the conducting layer using a silicone rubber layered roller - Google Patents
Printed circuits with glass or ceramic platelets - printed with the conducting layer using a silicone rubber layered rollerInfo
- Publication number
- DE2115369A1 DE2115369A1 DE19712115369 DE2115369A DE2115369A1 DE 2115369 A1 DE2115369 A1 DE 2115369A1 DE 19712115369 DE19712115369 DE 19712115369 DE 2115369 A DE2115369 A DE 2115369A DE 2115369 A1 DE2115369 A1 DE 2115369A1
- Authority
- DE
- Germany
- Prior art keywords
- printed
- silicone rubber
- glass
- platelets
- conducting layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N10/00—Blankets or like coverings; Coverings for wipers for intaglio printing
- B41N10/02—Blanket structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/702—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
- H01L21/705—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thick-film circuits or parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N2210/00—Location or type of the layers in multi-layer blankets or like coverings
- B41N2210/02—Top layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N2210/00—Location or type of the layers in multi-layer blankets or like coverings
- B41N2210/14—Location or type of the layers in multi-layer blankets or like coverings characterised by macromolecular organic compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0534—Offset printing, i.e. transfer of a pattern from a carrier onto the substrate by using an intermediate member
Abstract
Description
Offset-Tiefdruckwalzo für elektrisch leitepde Schichtumuster Die Erfindung betrifft eine Offset-Tiefdruckwalze für elektrisch leitende Schichtumuster, insbesondere zur Hersiellung von dünnen Schichten für Dünnschicht-Schaltungen.Offset-Tiefdruckwalzo for electrically conductive layer pattern The invention relates to an offset gravure roller for electrically conductive layer patterns, in particular for the production of thin layers for thin-film circuits.
Das bekannte Offset-Druckverfahren ist für die Übertragung von clektrisch leitenden Schichten nicht ohne weiteres anwendbar, da die hiermit übertragenen Schichten zu dünn sind und die hohe Präzision, die bei Dünnschicht-Schaltungen erforderlich ist, nicht erreicht wird.The well-known offset printing process is clever for the transfer of conductive layers not readily applicable, as the layers transferred with them are too thin and the high precision required for thin-film circuits is not achieved.
Die französische Patentschrift 1.566.978 beschreibt ein Verfabsen zum Aufdrucken von elekirischen Schaltungen auf Trägorplatten, bei dem zum Ausgleich größerer Unebenheiten ein clastisches, konvexes Druckkissen verwendet wird. Die Übertragungsfäbigkeit der Druckpaste wird dabei durch Zugabe von zyklisehem Polymothylsiloxan verbessert. Dieses Verfahren kann beim Bedrucken dünner, ebener Glas- oder Keramikplättchan zum Zerbrechen der Plättchen führen.French patent 1,566,978 describes a method for printing electrical circuits on carrier plates, with which to compensate larger bumps a clastic, convex pressure pad is used. the The transferability of the printing paste is determined by adding cyclic polymothylsiloxane improved. This process can be used when printing on thin, flat glass or ceramic plates lead to breakage of the platelets.
Die Aufgabe, die unserer Erfindung zugrunde liegt, ist das Bedrucken dünner, ebener Glas- oder Keramikplättchen mit Edelmetail-Resinat-Paste in schneller Zeitfolg bei geringem Druck.The task on which our invention is based is printing thin, flat glass or ceramic plates with precious metal resinate paste in quicker Time sequence with little pressure.
Diese Aufgabe wird dadurch gcjöst, daß eine Druckvorrichtung zur Übertragung der Resinat-Paste von dem geätzten Klischee auf das Druckgut mit einer Walze ausgerüstet ist, daren zur Überteagung dienende elastische Schicht aus Silikonkautschuk bestekt.This object is achieved in that a printing device for transmission the resinate paste from the etched cliché onto the printing material with a roller is equipped with an elastic layer made of silicone rubber that is used for transmission.
Die erfindungsgemäße Vorrichtung bietet dadurch Vorteile, daß sich die Resinat-Paste beim Umdrucken vollständig von der Walze löst, ohne daß dazu dem Resinat Silikone suge setzt werden müssen, welche beim Einbrennen des Re.sinats störende Einflüsse auf die Schichteigenschaften ausüben können, und daß stets nur eb begrenzter Bereich des T gerplättchens zum bedrucken mit Resinat-Paste einem relativ geringen Druck ausgesetzt werden muß.The device according to the invention offers advantages in that the resinate paste completely dissolves from the roller during transfer printing without the Resinat silicones must be set carefully, which when firing the resin can exert disturbing influences on the layer properties, and always only eb limited area of the T ger plate for printing with resinate paste must be exposed to relatively low pressure.
Eine Beschleunigung des Druckvorganges wird dadurch erreicht, daß die Walze mit einer Heizung versehen ist und daß auch die Auflageflächen für die Trägerplättchen heizbar ausgebildet sind. Diese Ausführungen bieten Vorteile, da ein Verlaufen der Resinat-Paste verhindert und damit die Präzision des aufgedruckten Musters erhöht wird.An acceleration of the printing process is achieved in that the roller is provided with a heater and that the support surfaces for the Carrier plates are designed to be heatable. These designs offer advantages because The resinate paste does not run and thus the precision of the printed Pattern is increased.
Die Erfindung wird im folgenden anhand einer Zeichnung näher erläutert. Sie ist nicht auf das in der Figur gezeigte Beispiel beschränkt.The invention is explained in more detail below with reference to a drawing. It is not limited to the example shown in the figure.
Eipe Walze í besitzt eqne elastische Schicht aus Silikonkautschuk 2 und einen durch eine Heizung mit den Anschlüssen 3 und 4 heizbaren Walzenkern 5.Eipe roller í has an elastic layer made of silicone rubber 2 and a roller core that can be heated by a heater with connections 3 and 4 5.
1 Figur 3 Patentansprüche1 Figure 3 claims
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19712115369 DE2115369A1 (en) | 1971-03-30 | 1971-03-30 | Printed circuits with glass or ceramic platelets - printed with the conducting layer using a silicone rubber layered roller |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19712115369 DE2115369A1 (en) | 1971-03-30 | 1971-03-30 | Printed circuits with glass or ceramic platelets - printed with the conducting layer using a silicone rubber layered roller |
Publications (1)
Publication Number | Publication Date |
---|---|
DE2115369A1 true DE2115369A1 (en) | 1972-10-05 |
Family
ID=5803248
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19712115369 Pending DE2115369A1 (en) | 1971-03-30 | 1971-03-30 | Printed circuits with glass or ceramic platelets - printed with the conducting layer using a silicone rubber layered roller |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE2115369A1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3631058A1 (en) * | 1986-09-12 | 1988-03-24 | Preh Elektro Feinmechanik | METHOD FOR PRODUCING GUIDANCE AND / OR RESISTANCE TRACKS ON A SUBSTRATE AND POTENTIOMETER PRODUCED BY THIS METHOD |
DE19649116A1 (en) * | 1996-11-27 | 1998-05-28 | Gundokar Braumann | Housing or circuit board with conductive structure e.g. for computer housing |
WO2012092991A1 (en) * | 2011-01-04 | 2012-07-12 | Robert Bosch Gmbh | Method for producing an electronic circuit, printing roller and method for producing same |
-
1971
- 1971-03-30 DE DE19712115369 patent/DE2115369A1/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3631058A1 (en) * | 1986-09-12 | 1988-03-24 | Preh Elektro Feinmechanik | METHOD FOR PRODUCING GUIDANCE AND / OR RESISTANCE TRACKS ON A SUBSTRATE AND POTENTIOMETER PRODUCED BY THIS METHOD |
DE19649116A1 (en) * | 1996-11-27 | 1998-05-28 | Gundokar Braumann | Housing or circuit board with conductive structure e.g. for computer housing |
WO2012092991A1 (en) * | 2011-01-04 | 2012-07-12 | Robert Bosch Gmbh | Method for producing an electronic circuit, printing roller and method for producing same |
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