DE20311625U1 - Mobile transportable elektrostatische Substrathalter - Google Patents
Mobile transportable elektrostatische SubstrathalterInfo
- Publication number
- DE20311625U1 DE20311625U1 DE20311625U DE20311625U DE20311625U1 DE 20311625 U1 DE20311625 U1 DE 20311625U1 DE 20311625 U DE20311625 U DE 20311625U DE 20311625 U DE20311625 U DE 20311625U DE 20311625 U1 DE20311625 U1 DE 20311625U1
- Authority
- DE
- Germany
- Prior art keywords
- holder
- mobile
- substrate
- wafer
- portable electrostatic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Fittings On The Vehicle Exterior For Carrying Loads, And Devices For Holding Or Mounting Articles (AREA)
Description
Claims (23)
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE20311625U DE20311625U1 (de) | 2003-03-13 | 2003-07-29 | Mobile transportable elektrostatische Substrathalter |
EP04005376A EP1458019A3 (de) | 2003-03-13 | 2004-03-06 | Mobiler transportabler elektrostatischer Substrathalter |
TW093106273A TWI240351B (en) | 2003-03-13 | 2004-03-10 | Mobile/transportable electrostatic substrate holder |
US10/798,239 US20040187791A1 (en) | 2003-03-13 | 2004-03-10 | Mobile transportable electrostatic substrate holder |
JP2004068621A JP2005101505A (ja) | 2003-03-13 | 2004-03-11 | 可動可搬型静電式基板保持器 |
CNA2004100399573A CN1531054A (zh) | 2003-03-13 | 2004-03-12 | 移动便携式静电基片夹 |
KR1020040017193A KR100583562B1 (ko) | 2003-03-13 | 2004-03-13 | 가동 이송가능한 정전 기판 홀더 |
US11/496,668 US20060267294A1 (en) | 2003-03-13 | 2006-07-31 | Mobile transportable electrostatic substrate holder |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE20304124 | 2003-03-13 | ||
DE20311625U DE20311625U1 (de) | 2003-03-13 | 2003-07-29 | Mobile transportable elektrostatische Substrathalter |
Publications (1)
Publication Number | Publication Date |
---|---|
DE20311625U1 true DE20311625U1 (de) | 2003-10-23 |
Family
ID=29285825
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE20311625U Expired - Lifetime DE20311625U1 (de) | 2003-03-13 | 2003-07-29 | Mobile transportable elektrostatische Substrathalter |
Country Status (4)
Country | Link |
---|---|
AT (1) | AT6926U1 (de) |
DE (1) | DE20311625U1 (de) |
FR (1) | FR2852444B3 (de) |
IT (1) | ITMI20030204U1 (de) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1458019A2 (de) * | 2003-03-13 | 2004-09-15 | VenTec Gesellschaft für Venturekapital und Unternehmensberatung | Mobiler transportabler elektrostatischer Substrathalter |
DE102004019231A1 (de) * | 2004-04-16 | 2005-11-17 | PROTEC Gesellschaft für Werkstoff- und Oberflächentechnik mbH | Übergabe- und Ladestation für mobile, elektrostatische Substrathalter |
DE102004045447A1 (de) * | 2004-09-18 | 2006-03-30 | VenTec Gesellschaft für Venturekapital und Unternehmensberatung mbH | Mobiler, elektrostatischer Substrathalter und Verfahren zu seiner Herstellung |
US7564672B2 (en) | 2005-07-18 | 2009-07-21 | Udo Heinz Retzlaff | Transfer-ESC based on a wafer |
US7652867B2 (en) | 2006-05-03 | 2010-01-26 | Udo Heinz Retzlaff | Mobile, transportable, electrostatic chuck for wafers made of semiconductor material |
DE102009051567A1 (de) * | 2009-10-22 | 2011-04-28 | Alexander Borowski | Bernoulli-Düse, Greifervorrichtung mit Bernoulli-Düse und Verfahren zur Herstellung |
DE102010031364A1 (de) * | 2010-07-15 | 2012-01-19 | Gebr. Schmid Gmbh & Co. | Träger für einen Siliziumblock, Trägeranordnung mit einem solchen Träger und Verfahren zur Herstellung einer solchen Trägeranordnung |
DE102010054483A1 (de) | 2010-12-14 | 2012-06-14 | Manz Automation Ag | Mobile, transportable elektrostatische Substrathalteanordnung |
US10304714B2 (en) | 2015-06-11 | 2019-05-28 | Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. | Device comprising film for electrostatic coupling of a substrate to a substrate carrier |
-
2003
- 2003-04-22 AT AT0027703U patent/AT6926U1/de not_active IP Right Cessation
- 2003-04-30 IT ITMI20030204 patent/ITMI20030204U1/it unknown
- 2003-06-18 FR FR0307336A patent/FR2852444B3/fr not_active Expired - Fee Related
- 2003-07-29 DE DE20311625U patent/DE20311625U1/de not_active Expired - Lifetime
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1458019A2 (de) * | 2003-03-13 | 2004-09-15 | VenTec Gesellschaft für Venturekapital und Unternehmensberatung | Mobiler transportabler elektrostatischer Substrathalter |
EP1458019A3 (de) * | 2003-03-13 | 2005-12-28 | VenTec Gesellschaft für Venturekapital und Unternehmensberatung | Mobiler transportabler elektrostatischer Substrathalter |
DE102004019231A1 (de) * | 2004-04-16 | 2005-11-17 | PROTEC Gesellschaft für Werkstoff- und Oberflächentechnik mbH | Übergabe- und Ladestation für mobile, elektrostatische Substrathalter |
DE102004045447A1 (de) * | 2004-09-18 | 2006-03-30 | VenTec Gesellschaft für Venturekapital und Unternehmensberatung mbH | Mobiler, elektrostatischer Substrathalter und Verfahren zu seiner Herstellung |
DE102004045447B4 (de) * | 2004-09-18 | 2010-02-11 | Technologiezentrum Siegen Gmbh | Mobiler, elektrostatischer Substrathalter und Verfahren zur Halterung eines Substrates auf einem mobilen, elektrostatischen Substrathalter |
US7564672B2 (en) | 2005-07-18 | 2009-07-21 | Udo Heinz Retzlaff | Transfer-ESC based on a wafer |
US7652867B2 (en) | 2006-05-03 | 2010-01-26 | Udo Heinz Retzlaff | Mobile, transportable, electrostatic chuck for wafers made of semiconductor material |
DE102009051567A1 (de) * | 2009-10-22 | 2011-04-28 | Alexander Borowski | Bernoulli-Düse, Greifervorrichtung mit Bernoulli-Düse und Verfahren zur Herstellung |
DE102010031364A1 (de) * | 2010-07-15 | 2012-01-19 | Gebr. Schmid Gmbh & Co. | Träger für einen Siliziumblock, Trägeranordnung mit einem solchen Träger und Verfahren zur Herstellung einer solchen Trägeranordnung |
DE102010054483A1 (de) | 2010-12-14 | 2012-06-14 | Manz Automation Ag | Mobile, transportable elektrostatische Substrathalteanordnung |
US10304714B2 (en) | 2015-06-11 | 2019-05-28 | Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V. | Device comprising film for electrostatic coupling of a substrate to a substrate carrier |
Also Published As
Publication number | Publication date |
---|---|
FR2852444B3 (fr) | 2005-02-18 |
FR2852444A3 (fr) | 2004-09-17 |
ITMI20030204U1 (it) | 2004-09-14 |
AT6926U1 (de) | 2004-05-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI240351B (en) | Mobile/transportable electrostatic substrate holder | |
Sihag et al. | Analysis of surface finish improvement during ultrasonic assisted magnetic abrasive finishing on chemically treated tungsten substrate | |
CN104707832B (zh) | 静电卡盘清洁固定器 | |
JP5258873B2 (ja) | 電極組立体から表面の金属汚染を洗浄する方法 | |
DE20311625U1 (de) | Mobile transportable elektrostatische Substrathalter | |
JP6775450B2 (ja) | ステージクリーニング方法およびステージクリーニング部材、ならびに検査システム | |
CN108884546A (zh) | 具有耐氯和氟等离子体侵蚀性的涂覆的半导体加工构件及其复合氧化物涂层 | |
EP2024108B1 (de) | Reinigung elektrostatischer spannfutter unter verwendung von ultraschall-bewegung und angelegte elektrische felder | |
WO2014080536A1 (ja) | 金属-セラミックス接合基板およびその製造方法 | |
US7125324B2 (en) | Insulated pad conditioner and method of using same | |
JP2014506737A (ja) | 非導電性基板の表面上に連続導電性回路を作製するための無害技法 | |
US20140145390A1 (en) | High-pressure container, substrate processing apparatus, and method for manufacturing high-pressure container | |
US20060263552A1 (en) | Tray for heat treatment and method of manufacturing ceramic product using the tray | |
JP6304923B2 (ja) | 金属−セラミックス接合基板およびその製造方法 | |
JPH11243135A (ja) | 真空吸着盤 | |
EP0901152A1 (de) | Träger für einen Halbleiterwafer mit einer CVD Siliziumkarbiden Filmbeschichtung | |
JP2009055017A (ja) | 保持用治具およびそれを用いた吸着装置 | |
Mizobuchi et al. | Miniature drilling of chemically strengthened glass plate using electroplated diamond tool | |
TWI284158B (en) | Sealable surface method and device | |
KR20140095205A (ko) | 이종 연마 입자를 포함하는 와이어 절삭 공구 및 그 제조 방법 | |
TWI725792B (zh) | 靜電吸盤 | |
EP0336352A2 (de) | Mikrobauelement | |
PIOTROWSKI et al. | Metallography of the precious metals | |
Farah Liyana Binti Ab Ghani | Uniformity of Plating Thickness of IC Packages at Various Locations on its Lead Frame | |
Mishra et al. | Array microchannels formation in glass workpiece using multi-pass electrochemical discharge milling technique |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R207 | Utility model specification |
Effective date: 20031127 |
|
R163 | Identified publications notified |
Effective date: 20040317 |
|
R079 | Amendment of ipc main class |
Free format text: PREVIOUS MAIN CLASS: H01L0021680000 Ipc: H01L0021670000 |
|
R150 | Term of protection extended to 6 years |
Effective date: 20060817 |
|
R081 | Change of applicant/patentee |
Owner name: PROTEC CARRIER SYSTEMS GMBH, DE Free format text: FORMER OWNER: VENTEC GESELLSCHAFT FUER VENTUREKAPITAL UND UNTERNEHMENSBERATUNG MBH, 57078 SIEGEN, DE Effective date: 20070622 |
|
R165 | Request for cancellation or ruling filed | ||
R151 | Term of protection extended to 8 years |
Effective date: 20090814 |
|
R081 | Change of applicant/patentee |
Owner name: PROTEC CARRIER SYSTEMS GMBH, DE Free format text: FORMER OWNER: TECHNOLOGIEZENTRUM SIEGEN GMBH, 57078 SIEGEN, DE Effective date: 20100319 |
|
R152 | Term of protection extended to 10 years | ||
R152 | Term of protection extended to 10 years |
Effective date: 20111130 |
|
R071 | Expiry of right | ||
R071 | Expiry of right |