DE20307014U1 - Cooling body has heat distribution plate, symmetrical through holes on 2 sides, vertical ribs on plate surface, inverted L-shaped frame, fan on vertical frame side and on surface of round hole - Google Patents

Cooling body has heat distribution plate, symmetrical through holes on 2 sides, vertical ribs on plate surface, inverted L-shaped frame, fan on vertical frame side and on surface of round hole

Info

Publication number
DE20307014U1
DE20307014U1 DE20307014U DE20307014U DE20307014U1 DE 20307014 U1 DE20307014 U1 DE 20307014U1 DE 20307014 U DE20307014 U DE 20307014U DE 20307014 U DE20307014 U DE 20307014U DE 20307014 U1 DE20307014 U1 DE 20307014U1
Authority
DE
Germany
Prior art keywords
heat sink
vertical
holes
fan
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE20307014U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE20307014U priority Critical patent/DE20307014U1/en
Publication of DE20307014U1 publication Critical patent/DE20307014U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The device has an improved design with a cooling body forming a heat distribution plate (11), symmetrical through holes (111) on both sides and vertical ribs on the plate surface, a frame (2) in the form of an inverted L and a fan (3) mounted on the vertical side of the frame and on the surface of a round hole. The assembled cooling body is attached to the surface of a CPU to achieve heat distribution.

Description

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßtThe description text was not recorded electronically

Claims (2)

1. Ein verbesserter Aufbau eines Kühlkörpers, bestehend aus:
einem Kühlkörper (1), der als Hitzeverteilplatte (11) ausgeführt und mit einer Anzahl symmetrischen durchgehenden Löchern (111) auf beiden Seiten versehen ist, während nebeneinander auf der Oberfläche dieser Hitzeverteilplatte (11) vertikale Rippen (12) vorgesehen sind;
einem Rahmen (2), der in Form eines umgekehrten L's ausgeführt ist und mehrere runde Löcher (211) auf der vertikalen Fläche (21) der Hitzeverteilplatte (11) aufweist, wobei diese runden Löcher (211) nebeneinander angeordnet sind; und der ein symmetrisches Schraubloch (212) auf der Peripherie des runden Loches (211) aufweist, so daß nach dem Einwärtsbiegen beider Seiten der vertikalen Fläche (21) eine Rille (221) auf der Unterseite dieses einwärts gebogenen Teils (22) gebildet wird, und sich eine nach unten gebogene feste Platte (24) an der horizontalen Fläche des Rahmens (2) befindet; die feste Platte (24) mit einem Schraubloch versehen ist; und
einem Lüfter (3), der nebeneinander mit Hilfe des Schraubloches (212) auf der vertikalen Seite (21) des Rahmens (2) und der auf der Oberfläche des runden Loches (211) monitert ist;
beim Zusammenbauen der obengenannten Bauteile der Rahmen (2) auf den Kühlkörper (1) montiert wird, um so eine Kühlkörpervorrichtung (100) zu erhalten, die dann auf die Oberfläche des CPU's (8) befestigt wird, um die Hitzeverteilwirkung zu erzielen; die Montagehöhe dieser Kühlkörpervorrichtung (100) verringert wird, da der Lüfter (3) vor der Hitzeverteilplatte (11) montiert wird, was ein Einbauen in Rechnersysteme mit schlankem Design erleichtert.1. An improved structure of a heat sink, consisting of:
a heat sink (1), which is designed as Hitzeverteilplatte (11) and with a number of symmetrical through-holes (111) on both sides provided while are provided side by side on the surface of these Hitzeverteilplatte (11) vertical ribs (12);
a frame ( 2 ) which is in the form of an inverted L and has a plurality of round holes ( 211 ) on the vertical surface ( 21 ) of the heat distribution plate ( 11 ), these round holes ( 211 ) being arranged side by side; and having a symmetrical screw hole ( 212 ) on the periphery of the round hole ( 211 ) so that after both sides of the vertical surface ( 21 ) are bent inwards, a groove ( 221 ) is formed on the underside of this inwardly bent part ( 22 ), and there is a downwardly bent fixed plate ( 24 ) on the horizontal surface of the frame ( 2 ); the fixed plate ( 24 ) is provided with a screw hole; and
a fan ( 3 ) mounted side by side by means of the screw hole ( 212 ) on the vertical side (21) of the frame ( 2 ) and on the surface of the round hole ( 211 );
when assembling the above-mentioned components, the frame ( 2 ) is mounted on the heat sink ( 1 ) so as to obtain a heat sink device ( 100 ) which is then attached to the surface of the CPU ( 8 ) to achieve the heat dissipation effect; the mounting height of this heat sink device ( 100 ) is reduced because the fan ( 3 ) is mounted in front of the heat distribution plate ( 11 ), which facilitates installation in computer systems with a slim design. 2. Der verbesserte Aufbau eines Kühlkörpers, dadurch gekennzeichnet, daß die Lage der Kühlkörpervorrichtung (100) der von mehreren Lüftungslöchern (73) entspricht, die sich an geeigneten Stellen auf der Rückseite des Rechnersystems befinden.2. The improved structure of a heat sink, characterized in that the position of the heat sink device ( 100 ) corresponds to that of several ventilation holes ( 73 ), which are located at suitable locations on the back of the computer system.
DE20307014U 2003-05-06 2003-05-06 Cooling body has heat distribution plate, symmetrical through holes on 2 sides, vertical ribs on plate surface, inverted L-shaped frame, fan on vertical frame side and on surface of round hole Expired - Lifetime DE20307014U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE20307014U DE20307014U1 (en) 2003-05-06 2003-05-06 Cooling body has heat distribution plate, symmetrical through holes on 2 sides, vertical ribs on plate surface, inverted L-shaped frame, fan on vertical frame side and on surface of round hole

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE20307014U DE20307014U1 (en) 2003-05-06 2003-05-06 Cooling body has heat distribution plate, symmetrical through holes on 2 sides, vertical ribs on plate surface, inverted L-shaped frame, fan on vertical frame side and on surface of round hole

Publications (1)

Publication Number Publication Date
DE20307014U1 true DE20307014U1 (en) 2003-07-17

Family

ID=27619060

Family Applications (1)

Application Number Title Priority Date Filing Date
DE20307014U Expired - Lifetime DE20307014U1 (en) 2003-05-06 2003-05-06 Cooling body has heat distribution plate, symmetrical through holes on 2 sides, vertical ribs on plate surface, inverted L-shaped frame, fan on vertical frame side and on surface of round hole

Country Status (1)

Country Link
DE (1) DE20307014U1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102278325A (en) * 2010-06-08 2011-12-14 鸿富锦精密工业（深圳）有限公司 Fan combination and electronic device using same
CN114233693A (en) * 2022-01-28 2022-03-25 京东方科技集团股份有限公司 Fan assembly for reducing fan noise and display device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102278325A (en) * 2010-06-08 2011-12-14 鸿富锦精密工业（深圳）有限公司 Fan combination and electronic device using same
CN114233693A (en) * 2022-01-28 2022-03-25 京东方科技集团股份有限公司 Fan assembly for reducing fan noise and display device
CN114233693B (en) * 2022-01-28 2023-12-05 京东方科技集团股份有限公司 Fan assembly for reducing noise of fan and display device

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 20030821

R156 Lapse of ip right after 3 years

Effective date: 20061201

R082 Change of representative

Representative=s name: KANDLBINDER, MARKUS, DIPL.-PHYS., DE