DE20221182U1 - Integrated circuit support is made by injection molding a temperature resistant base that can be metallized, covered in selected areas by a polyolefin - Google Patents

Integrated circuit support is made by injection molding a temperature resistant base that can be metallized, covered in selected areas by a polyolefin Download PDF

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Publication number
DE20221182U1
DE20221182U1 DE20221182U DE20221182U DE20221182U1 DE 20221182 U1 DE20221182 U1 DE 20221182U1 DE 20221182 U DE20221182 U DE 20221182U DE 20221182 U DE20221182 U DE 20221182U DE 20221182 U1 DE20221182 U1 DE 20221182U1
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Germany
Prior art keywords
metallizable
metallized
carrier body
temperature resistant
component
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Expired - Lifetime
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DE20221182U
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German (de)
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Oechsler AG
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Oechsler AG
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Priority to DE20221182U priority Critical patent/DE20221182U1/en
Priority claimed from DE2002134760 external-priority patent/DE10234760A1/en
Publication of DE20221182U1 publication Critical patent/DE20221182U1/en
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Expired - Lifetime legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/16—Making multilayered or multicoloured articles
    • B29C2045/169—Making multilayered or multicoloured articles injecting electrical circuits, e.g. one layer being made of conductive material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C71/00—After-treatment of articles without altering their shape; Apparatus therefor
    • B29C71/04—After-treatment of articles without altering their shape; Apparatus therefor by wave energy or particle radiation, e.g. for curing or vulcanising preformed articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0012—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular thermal properties
    • B29K2995/0017—Heat stable
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3493—Moulded interconnect devices, i.e. moulded articles provided with integrated circuit traces
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate

Abstract

The support is made by two-component injection molding with the base consisting of a temperature-resistant material that can be metallized. Selected areas are then covered by an easily molded material that can not be metallized and is made temperature stable by irradiation crosslinking. The support is made by two-component injection molding with the base consisting of a temperature-resistant material that can be metallized. Selected areas are then covered by an easily molded material that can not be metallized and is made temperature stable by irradiation crosslinking. The exposed areas are then metallized to produce a fine structure of conductors that can withstand attaching of electrical components by soldering. A complete three-dimensional component substrate for semiconductor chips can be produced in this way.

Description

Die Erfindung betrifft ein MID-Bauteil mit integrierter Leiterbahnenstruktur.The The invention relates to an MID component with integrated strip conductor structure.

Ein Verfahren zum Erstellen eines derartigen Bauteiles ist etwa aus unserem Patent DE 100 48 680 C1 als MID (Moulded Interconnection Device) bekannt. Danach wird in die Oberflächenprofilierung eines aus einem Kunststoff aus nichtmetallisierbarem Material, also mit nicht-metallisierbarer Oberfläche, gespritzten Trägerkörpers im zweiten Schuß die gewünschte Leiterstruktur aus einem gegenüber dem Trägermaterial dünnerflüssig zu verarbeitenden, metallisierbaren Kunststoff eingespritzt, dessen freiliegenden Oberflächenbereiche durch galvanische Metallisierung die Geometrie der elektrisch leitenden Struktur auf dem Träger-Bauteil annehmen.A method for creating such a component is approximately from our patent DE 100 48 680 C1 known as MID (Molded Interconnection Device). Thereafter, in the surface profiling of a plastic of non-metallizable material, ie non-metallizable surface, sprayed carrier body in the second shot, the desired conductor structure of a thinner to be processed compared to the substrate to be processed, metallizable plastic whose exposed surface areas by galvanic metallization, the geometry of assume electrically conductive structure on the carrier component.

Wenn dieses Bauteil auch als Schaltungsträger dienen soll, auf dessen Leiterstruktur etwa im Durchlaufverfahren elektrische Komponenten aufzulöten sind, müssen – zur Sicherstellung der Formbeständigkeit unter dem Lötvorgang – teure hochtemperaturbeständige Thermoplaste im Zweikomponenten-Spritzguß miteinander verarbeitet werden, beispielsweise Flüssigpolymere (LCPs) oder Polyetherimide (PEIs). Aber es hat sich gezeigt, daß selbst das vergleichsweise sehr leichtflüssige LCP sich nicht im zweiten Schuß für extrem feine Strukturen verwenden läßt, weil die dafür erforderlichen hohen Spritz-Drücke und -Temperaturen die Profilierung des im ersten Schuß erstellten Trägerkörpers lokal erweichen oder direkt beschädigen. Daraus resultieren dann Überspritzungen und andere Formfehler in der feingliedrig leitenden Struktur und später entsprechendes Fehlverhalten der elektrischen Schaltung.If this component should also serve as a circuit carrier, on whose Ladder structure about in the continuous process electrical components to solder are, must - to ensure the dimensional stability under the soldering process - expensive high temperature resistant Thermoplastics are processed together in two-component injection molding, for example, liquid polymers (LCPs) or polyetherimides (PEIs). But it has been shown that itself the comparatively very liquid LCP is not in the second Shot for extreme use fine structures, because the one for that required high spray pressures and temperatures profiling the created in the first shot Soften the carrier body locally or damage directly. This then results in overspraying and other shape defects in the finely-conducting structure and later corresponding malfunction of the electrical circuit.

Man könnte daran denken, die billigeren und wegen höherer Viskosität bei geringen Massetemperaturen leichter zu verarbeitenden Polyolefine, etwa Polypropylen (PP) oder Polyethylen (PE), für den zweiten Schuß einzusetzen. Das ist aber nur für reine Leiterstrukturen angängig, nicht für zu bestückende Schaltungsträger, da diese mangels Temperaturstabilität den Lötvorgang bei der Applikation von Schaltungskomponenten nicht vertragen würden.you could Remember, the cheaper and because of higher viscosity at low Melt temperatures easier to process polyolefins, such as polypropylene (PP) or polyethylene (PE), for to use the second shot. That's only for pure ladder structures accessible, not for to be equipped circuit carrier, there this lack of temperature stability the soldering process would not be tolerated in the application of circuit components.

In Erkenntnis dieser Gegebenheiten liegt vorliegender Erfindung die technische Problemstellung zugrunde, eine feingliedrige aber doch für Lötvorgänge hinreichend temperaturfeste Leiterstruktur als Schaltungsträger im Mehrkomponenten-Spritzguß zu ermöglichen.In Recognition of these facts is the present invention based on technical problem, a delicate but yet sufficient for soldering operations temperature-resistant conductor structure to enable as a circuit carrier in multi-component injection molding.

Diese Aufgabe ist erfindungsgemäß dadurch gelöst, daß die im jeweiligen Hauptanspruch angegebenen wesentlichen Merkmale verwirklicht sind, wonach die Trägerstruktur nicht mehr wie üblich aus nichtmetallisierbarem sondern statt dessen aus hoch-temperaturfestem metallisierbarem Thermoplast (wie den erwähnten LCPs oder PEIs) gespritzt wird. Diese plattenförmig ebene oder dreidimensional verwölbte Trägerstruktur wird sodann bereichsweise, nämlich unter Freisparen der später leitenden Linienzüge, dünn mit einem der leichtfließenden nichtmetallisierbaren Kunststoffe umspritzt. Daraufhin werden die in dieser Umhüllung freigebliebenen feingliedrigen Spuren auf der Oberfläche der temperaturfesten Trägerstruktur metallisiert, um so den Schaltungsträger mit feingliedrigem Leiterbahnenverlauf zu ergeben. Damit dieser trotz der an sich empfindlichen dünnwandigen Umspritzung lötwärmeresistent ist, wird schließlich noch von der als solchen bekannten Bestrahlungsvernetzung von Thermoplasten Gebrauch gemacht, wie sie, erforderlichenfalls unter Vernetzungsmaterialbeigabe, durch radioaktive oder durch Elektronen-Bestrahlung schon etwa auf Stranggußteile wie Kunststoffrohre für Fußbodenheizungen angewandt wird.These The object is achieved in that the im respective main claim specified essential features realized are, according to which the support structure not as usual non-metallizable but instead of high-temperature resistant metallizable thermoplastic (such as the mentioned LCPs or PEIs) is injected. This plate-shaped flat or three-dimensional cambered support structure is then partially, namely under saving the later conductive lines, thin with one of the easily flowing non-metallizable Molded plastic. Thereupon the delicate ones left in this wrapping become Traces on the surface the temperature-resistant support structure metallized, so as the circuit carrier with delicate conductor track to surrender. So that this despite the intrinsically sensitive thin-walled Encapsulation is heat-resistant is, will eventually nor of the known as such irradiation crosslinking of thermoplastics Use, as required, with the addition of by radioactive or by electron irradiation already on about Stranggußteile like plastic pipes for underfloor heating is applied.

Dieser vorbekannten Vernetzungsbestrahlung von Einkomponenten-Kunststoffgußteilen aus Polyolefinen oder aus Polyamiden gegenüber weist die erfindungsgemäße Anwendung auf den nichtmetallisierbaren Überzug eines hochtemperaturbeständigen Kernmaterials den zusätzlichen Vorteil auf, infolge dessen thermischer Stabilität für das Bauteil insgesamt noch eine erhöhte Dauerstandfestigkeit bei auch höheren Umgebungstemperaturen zu erzielen. Dabei kann die Bestrahlung der regional isolierenden Beschichtung vor oder nach der Metallisierung der auf dem Trägerkörper freigesparten Leiterbahnenstruktur erfolgen, und sogar noch später durch deren Verpackung hindurch auch gleich auf eine Mehrzahl von Bauteilen angewandt werden, was den herstellungstechnischen Aufwand gegenüber einer Einzelbestrahlung im Zuge des Fertigungsvorganges spürbar mindert.This previously known crosslinking irradiation of one-component plastic castings from polyolefins or from polyamides opposite to the inventive application the non-metallizable coating a high temperature resistant Nuclear material the additional Advantage on, as a result of which thermal stability for the component in total yet an increased Creep resistance at higher levels To achieve ambient temperatures. The irradiation of the regionally insulating coating before or after metallization the freed on the carrier body Track structure done, and even later by their packaging Through also be applied to a plurality of components, which the manufacturing effort compared to a single irradiation noticeably reduced in the course of the manufacturing process.

Mit anderen Worten dient die temperaturfeste Trägerstruktur nun nicht mehr der Aufnahme von metallisierbarem Material, sondern gewissermaßen unmittelbar als metallisierbarer Kern, dessen aber nur bereichsweise zur feingliedrigen Leiterbahnenstruktur zu metallisierende Oberfläche in einer als Isolation dienenden da nichtmetallisierbaren Haut freigespart bleibt, die vor dem Metallisieren im zweiten Schuß auf den Kern aufgebracht und durch Bestrahlungsvernetzung für den Durchlauf des mit Schaltungskomponenten bestückten Bauteiles durch eine Lötanlage wärmeresistent gemacht wird.With In other words, the temperature-resistant support structure no longer serves the inclusion of metallizable material, but in a sense immediate as a metallizable core, but only partially to the delicate Conductor structure to be metallized surface in one as insulation serving as nonmetallisierbaren skin remains free, the applied to the core in the second shot before metallizing and by irradiation crosslinking for the passage of the with circuit components stocked Components by a soldering system heat-resistant is done.

Aufgrund des leichtfließenden und nach dem lokalen Aufbringen durch Bestrahlung wärmeresistent vernetzten Bedeckungsmaterials des metallisierbaren Grundkörpers lassen sich also im Zweikomponenten-Spritzgußverfahren sehr feine elektrisch leitende MID-Strukturen auch als dreidimensional ausgestaltete Bondsubstrate für direkt (also gehäuselos) zu montierende Halbleiterchips verwirklichen. Dabei ergeben sich erhebliche Kostenvorteile gegenüber der Verwendung von teuren hochtemperaturfesten Thermoplasten für beide Schüsse, weil nun für den zweiten Schuß ein sehr preiswerter, durch anschließende Bestrahlung temperaturstabil im Sinne von hitzeresistent vernetzter Werkstoff zur regionalen Isolierung der im übrigen zu metallisierenden Oberfläche des Trägerkörpers einsetzbar ist.Due to the easily flowing and after the local application by irradiation heat-resistant cross-linked covering material of the metallizable base body can thus be in two-component injection molding very fine electrically conductive MID structures as three-dimensionally configured Bondsubstrate for directly (ie caseless) realize semiconductor chips to be mounted. This results in significant cost advantages over the use of expensive high temperature resistant thermoplastics for both shots, because now for the second shot a very inexpensive, temperature stable by subsequent irradiation in the sense of heat-resistant cross-linked material for regional isolation of the otherwise metallizing surface of the support body is used.

Claims (5)

Bauteil mit einer elektrischen Leiterbahnenstruktur in Form einer Metallisierung der freiliegenden Oberflächen eines durch Mehrkomponenten-Spritzguß in eine elektrisch isolierende Umhüllung aus nichtmetallisierbarem Material teilweise eingebetteten Materials, dadurch gekennzeichnet, daß ein Trägerkörper aus hochtemperaturfestem metallisierbarem Kunststoff mit einer geometrischen Struktur aus nicht metallisierbarem, leicht fließendem Werkstoff umspritzt ist, welcher durch Bestrahlung temperaturstabil vernetzt ist, wohingegen die von der aufgespritzten Struktur freigesparten feingliedrigen Oberflächenbereiche des Trägerkörpers zu Leiterbahnen eines lötresistenten Schaltungsträgers metallisiert sind.Component having an electrical strip conductor structure in the form of a metallization of the exposed surfaces of a material partially embedded by multi-component injection molding in an electrically insulating sheath of non-metallizable material, characterized in that a carrier body made of high temperature resistant metallizable plastic having a geometric structure of non-metallizable, easily flowing material is overmolded, which is thermally stable crosslinked by irradiation, whereas the freigpariedrige of the sprayed-structure delicate surface areas of the carrier body are metallized into tracks of a solder-resistant circuit substrate. Bauteil nach Anspruch 1, dadurch gekennzeichnet, daß der Trägerkörper im Zweikomponenten-Spritzgußverfahren aus einem hochtemperaturbeständigen oberflächenmetallisierbaren Thermoplast gespritzt und bereichsweise mit einem niedrigviskosen Polyolefin umspritzt ist.Component according to claim 1, characterized that the Carrier body in Two-component injection molding process from a high temperature resistant oberflächenmetallisierbaren Thermoplastic sprayed and partially with a low-viscosity Polyolefin is encapsulated. Bauteil mit elektrischer Leiterbahnenstruktur als löttemperaturresistentem Schaltungsträger auf Basis eines aus hochtemperaturfestem metallisierbarem Kunststoff erstellten Trägerkörpers, der mit einer geometrischen Struktur aus nicht metallisierbarem, temperaturstabil strahlungsvernetztem Kunststoff umgeben und in der davon freigelassenen Oberfläche des Trägerkörpers zu feingliedrigen Leiterbahnen metallisiert ist.Component with electrical conductor track structure as löttemperaturresistentem circuit support Based on a high temperature resistant metallizable plastic created carrier body, the with a geometric structure of non-metallizable, temperature-stable surrounded by radiation-crosslinked plastic and released in the surface of the carrier body metallized with fine-line tracks. Bauteil nach Anspruch 3, dadurch gekennzeichnet, daß der Trägerkörper aus einem hochtemperaturbeständigen oberflächenmetallisierbaren Thermoplast und seine Umhüllung aus einem niedrigviskosen nichtmetallisierbaren Polyolefin besteht.Component according to claim 3, characterized that the Carrier body a high temperature resistant surface metallizable thermoplastic and his serving consists of a low viscosity non-metallizable polyolefin. Bauteil nach Anspruch 3 oder 4, dadurch gekennzeichnet, daß es ein dreidimensional ausgestaltetes Bond-Substrat für das Verschalten von Halbleiterchips ist.Component according to claim 3 or 4, characterized that it a three-dimensional designed Bond substrate for interconnection of semiconductor chips.
DE20221182U 2002-07-30 2002-07-30 Integrated circuit support is made by injection molding a temperature resistant base that can be metallized, covered in selected areas by a polyolefin Expired - Lifetime DE20221182U1 (en)

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DE20221182U DE20221182U1 (en) 2002-07-30 2002-07-30 Integrated circuit support is made by injection molding a temperature resistant base that can be metallized, covered in selected areas by a polyolefin

Applications Claiming Priority (2)

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DE2002134760 DE10234760A1 (en) 2002-07-30 2002-07-30 Integrated circuit support is made by injection molding a temperature resistant base that can be metallized, covered in selected areas by a polyolefin
DE20221182U DE20221182U1 (en) 2002-07-30 2002-07-30 Integrated circuit support is made by injection molding a temperature resistant base that can be metallized, covered in selected areas by a polyolefin

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7759135B2 (en) 2008-09-30 2010-07-20 Infineon Technologies Ag Method of forming a sensor node module

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7759135B2 (en) 2008-09-30 2010-07-20 Infineon Technologies Ag Method of forming a sensor node module

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