DE20215637U1 - Electronic component used as a Hall sensor has a system support with a platform for the electronic component, and a housing surrounding the component and the platform - Google Patents

Electronic component used as a Hall sensor has a system support with a platform for the electronic component, and a housing surrounding the component and the platform

Info

Publication number
DE20215637U1
DE20215637U1 DE20215637U DE20215637U DE20215637U1 DE 20215637 U1 DE20215637 U1 DE 20215637U1 DE 20215637 U DE20215637 U DE 20215637U DE 20215637 U DE20215637 U DE 20215637U DE 20215637 U1 DE20215637 U1 DE 20215637U1
Authority
DE
Germany
Prior art keywords
platform
electronic component
component according
housing
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE20215637U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Micronas GmbH
Original Assignee
TDK Micronas GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TDK Micronas GmbH filed Critical TDK Micronas GmbH
Priority to DE20215637U priority Critical patent/DE20215637U1/en
Publication of DE20215637U1 publication Critical patent/DE20215637U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05599—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/85399—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Abstract

Electronic component (1) has a system support (2) with a platform (5) for the electronic component; and a housing (4) surrounding the component and the platform. A supporting region (7) for supporting the platform is provided on the platform during the production of the housing. A part of the supporting region protrudes from the housing. Preferred Features: Catch elements are molded to the platform. A connecting piece (6') is molded to the platform. The system support is made from a metal or metal alloy with a coating made from an alloy containing zinc or zinc-lead. A thin corrosion protection film extends onto the catch elements.

Description

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßtThe description text was not recorded electronically

Claims (11)

1. Elektronisches Bauelement (1) mit einem Systemträger (2), mit einer Plattform (5) auf der ein elektronisches Bauteil (3) angeordnet ist und mit einem Gehäuse (4), welches das elektronische Bauteil (3) und die Plattform (5) umgibt, dadurch gekennzeichnet, dass an der Plattform (5) zumindest ein Anlagebereich (7) zum Abstützen der Plattform (5) während des Herstellungs­ prozesses des Gehäuses vorgesehen ist, und dass der zumin­ dest eine Anlagebereich (7) zumindest abschnittweise aus dem Gehäuse (4) ragt.1. Electronic component ( 1 ) with a system carrier ( 2 ), with a platform ( 5 ) on which an electronic component ( 3 ) is arranged and with a housing ( 4 ) which contains the electronic component ( 3 ) and the platform ( 5 ) surrounds characterized in that on the platform (5) at least one contact portion (7) for supporting the platform (5) during the manufacturing process of the housing is provided, and that the at least one contact portion (7) at least partially out of the housing ( 4 ) protrudes. 2. Elektronisches Bauelement nach Anspruch 1, dadurch gekennzeichnet, dass der zumindest eine Anlagebereich (7) als an die Plattform (5) angeformtes Nasenelement (7) ausgebildet ist.2. The electronic component according to claim 1, characterized in that a contact portion (7) is formed at least as the platform (5) integrally molded nose element (7). 3. Elektronisches Bauelement nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass an der Plattform (5) zwei Nasenelemente (7) angeformt sind.3. Electronic component according to claim 1 or 2, characterized in that two nose elements ( 7 ) are integrally formed on the platform ( 5 ). 4. Elektronisches Bauelement nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass zumindest ein Nasenelement (7) einstückig an die Plattform (5) angeformt ist. 4. Electronic component according to one of claims 1 to 3, characterized in that at least one nose element ( 7 ) is integrally formed on the platform ( 5 ). 5. Elektronisches Bauelement nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, dass entlang des Übergangsbereichs von Anlagebereich bzw. Nasenelement (7) zur Plattform (5) zumindest eine kerben­ förmige Vertiefung (10) vorgesehen ist.5. Electronic component according to one of claims 1 to 4, characterized in that at least one notch-shaped depression ( 10 ) is provided along the transition region from the contact region or nose element ( 7 ) to the platform ( 5 ). 6. Elektronisches Bauelement nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, dass an der Plattform (5) ein Anschlussstück (6') angeformt ist.6. Electronic component according to one of claims 1 to 5, characterized in that a connecting piece ( 6 ') is integrally formed on the platform ( 5 ). 7. Elektronisches Bauelement nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, dass das zumindest eine Anschlussstück (6') einstückig an die Plattform (5) angeformt ist.7. Electronic component according to one of claims 1 to 6, characterized in that the at least one connector ( 6 ') is integrally formed on the platform ( 5 ). 8. Elektronisches Bauelement nach einem der Ansprüche 1 bis 7, dadurch gekennzeichnet, dass zumindest drei Anschlusstücke (6',6") vorgesehen sind, welche parallel verlaufen und auf einer Seite des Gehäuses (4) aus diesem geführt werden.8. Electronic component according to one of claims 1 to 7, characterized in that at least three connecting pieces ( 6 ', 6 ") are provided which run parallel and are guided out of the housing ( 4 ) on one side thereof. 9. Elektronisches Bauelement nach einem der Ansprüche 1 bis 8, dadurch gekennzeichnet, dass der Systemträger (2) aus einem Metall oder einer Me­ talllegierung gefertigt ist. 9. Electronic component according to one of claims 1 to 8, characterized in that the system carrier ( 2 ) is made of a metal or a metal alloy. 10. Elektronisches Bauelement nach einem der Ansprüche 1 bis 9, dadurch gekennzeichnet, dass sich auf dem Nasenelement (7) zumindest abschnittwei­ se ein dünner Korrosionsschutzfilm erstreckt.10. Electronic component according to one of claims 1 to 9, characterized in that a thin anticorrosive film extends on the nose element ( 7 ) at least in sections. 11. Elektronisches Bauelement nach einem der Ansprüche 1 bis 10, dadurch gekennzeichnet, dass die Oberfläche des Systemträgers (2) zumindest ab­ schnittweise beschichtet ist, insbesondere mit einer Le­ gierung, die Zn oder Zn-Pb enthält, beschichtet ist.11. Electronic component according to one of claims 1 to 10, characterized in that the surface of the system carrier ( 2 ) is coated at least in sections, in particular coated with an alloy containing Zn or Zn-Pb.
DE20215637U 2002-10-11 2002-10-11 Electronic component used as a Hall sensor has a system support with a platform for the electronic component, and a housing surrounding the component and the platform Expired - Lifetime DE20215637U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE20215637U DE20215637U1 (en) 2002-10-11 2002-10-11 Electronic component used as a Hall sensor has a system support with a platform for the electronic component, and a housing surrounding the component and the platform

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE20215637U DE20215637U1 (en) 2002-10-11 2002-10-11 Electronic component used as a Hall sensor has a system support with a platform for the electronic component, and a housing surrounding the component and the platform

Publications (1)

Publication Number Publication Date
DE20215637U1 true DE20215637U1 (en) 2003-02-13

Family

ID=7975881

Family Applications (1)

Application Number Title Priority Date Filing Date
DE20215637U Expired - Lifetime DE20215637U1 (en) 2002-10-11 2002-10-11 Electronic component used as a Hall sensor has a system support with a platform for the electronic component, and a housing surrounding the component and the platform

Country Status (1)

Country Link
DE (1) DE20215637U1 (en)

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R207 Utility model specification

Effective date: 20030320

R150 Utility model maintained after payment of first maintenance fee after three years

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R151 Utility model maintained after payment of second maintenance fee after six years

Effective date: 20081110

R152 Utility model maintained after payment of third maintenance fee after eight years

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R071 Expiry of right
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