DE202018102407U1 - Flexible optical component with structured surface - Google Patents

Abstract

Optical component (10) for a linear LED module (20) with a plurality of LED light sources (21), comprising:
- A transparent body (1) made of flexible material, preferably silicone, and
a micro- or nano-optical structure (2), which is formed on at least a first surface (1a) of the base body (1), wherein the base body (1) is designed so robust that this in a round, preferably in a semicircular shape is bendable.

Description

The invention relates to a flexible optical component for linear LED modules, which has a micro- or nano-optical surface structure.

Optical components for LED modules with multiple linearly aligned LED chips are well known in the art. Such an optical component can be embodied, for example, as a linear optical profile with scattering and / or bundling properties and can be produced, for example, by means of an injection molding process or an extrusion process.

Likewise, optical components are known which have a micro- or nano-optical surface structure. US 2014/349086 and US 2011/0039079 For example, disclose manufacturing processes for an optical device having such a surface structure. In this case, the surface structure is formed in a deformable matrix layer applied to a base body, for example with nanoparticles incorporated therein. The actual structuring can take place by means of a lithography process or an embossing process of the matrix layer. At the same time or subsequently, the matrix layer is cured by means of UV light.

The known from the prior art optical components have substantially rigid body. These have the disadvantage that, when optimizing the luminous efficacy of the LED module, they must be arranged at a certain minimum distance from the LED module and dimensioned in a relatively wide lateral extent.

A known alternative embodiment of such optical components is the production of a film having a surface structure, which is then applied to a rigid body such as an extruded polymer profile. However, this embodiment has the disadvantage of a more complex manufacturing process.

The present invention has for its object to provide an optical component with micro- or nano-optical structuring, which is simple and efficient to produce and allows optimized light emission for particular linear LED modules. The device should allow optimized protection of the LED module against environmental influences.

This object is achieved by the independent claims. Advantageous developments are the subject of the dependent claims.

The present invention relates, in a first aspect, to an optical component for a linear LED module having a plurality of LED light sources, comprising a transparent base body of flexible material, preferably silicone, and a micro- or nano-optical structure formed on at least a first surface of the base body , The base body is designed so robust that it is bendable in a round, preferably in a semicircular shape.

According to the present invention, the body is so robust, i. it has such mechanical properties that it can preferably be bent into the desired shape about a longitudinal or longitudinal axis of the base body. Preferably, the base body should be bendable without loss of stability and in particular without collapsing into the desired shape. This means that the body will not collapse, break or otherwise lose its integrity when it is bent. In particular, the main body is not a foil.

The main body preferably has a thickness t of 0.5 to 5 mm, more preferably 1 to 4 mm. The thickness of the base body is preferably constant. The base body can also have a varying thickness.

The main body preferably has a length of 2 to 90 cm, more preferably 5 to 50 cm. The main body can have a width of 1 to 10 cm, more preferably 2 to 6 cm.

The main body is preferably formed of silicone material. The main body can also consist of another flexible and transparent material.

The base body preferably has integrally formed connecting means, with the aid of which the optical component can be connected to or arranged on an LED module. The connecting means may comprise parallel notches and / or projections. The connecting means preferably extend on opposite sides in the longitudinal direction of the main body.

The transparent base body and / or the structure arranged thereon preferably has a refractive index of higher than 1.6, preferably higher than 1.7.

The micro- or nano-optical structure of the main body preferably has a height of between 10 nm and 150 μm, preferably between 20 nm and 50 μm.

The micro- or nano-optical structure preferably extends over the entire length of the main body. The structure preferably extends over at least 80%, more preferably over 90% of the width of the body.

The micro- or nano-optical structure is preferably formed periodically on the first surface. One of the first surface opposite surface of the body may have a similar or different micro or nano-optical structure.

The micro- or nano-optical structure is preferably designed such that it reflects a light emitted by the LED module scattering.

The micro- or nano-optical structure can preferably be produced by surface modification, such as, for example, a lithographic process or an embossing process of the main body or of a material matrix applied thereto. Such a material matrix may comprise nanoparticles contained therein, which preferably have a higher refractive index than the matrix.

By means of the optical component, a protection of the IP class 6x is preferably achievable without the need for additional sealing means.

In a further aspect, the present invention relates to an LED lighting unit comprising a linear LED module with a plurality of preferably linearly arranged on a support LED chips, and an optical device as described above.

The optical component is preferably arranged with respect to the linear LED module such that it is curved in a rounded, preferably semicircular shape around the linearly arranged LED chips of the LED module.

The optical component is preferably arranged with respect to the LED module such that the first surface with the micro- or nano-optical structure points in the direction of the LED chips of the module. This means that the structure is arranged on an inner side of the component.

In this case, the optical component is preferably arranged on the carrier of the LED module at a defined distance from the respective LED chips. The distance between the optical component and the respective LED chips is preferably constant or at least approximately constant as a result of the bending of the component.

The optical component is preferably arranged on the LED module by means of integrally formed connecting means. These are preferably such that they hold the optical component in predefined curved shape with respect to the LED module. The connecting means are preferably engaged with longitudinally extending connecting means of the LED module and / or with longitudinal edges of the LED module. The optical component may alternatively be connected via connecting means separate from the LED module, such as one or more additional holders or clamps.

• - Bereitstellen eines robusten Grundkörpers aus flexiblen Material, vorzugsweise aus Silikon,
• - Ausbildung einer mikro- oder nanooptischen Struktur wenigstens auf einer ersten Oberfläche des Grundkörpers zur Bereitstellung eines optischen Bauelements,
• - Biegen des optischen Bauelements in eine rundliche, vorzugsweise halbrunde Form um ein lineares LED Modul,
• - Verbinden des optischen Bauelements mit dem LED Modul.

In a further aspect, the present invention relates to an LED lighting unit that can be produced using the following steps:

• Providing a robust body of flexible material, preferably of silicone,
• Forming a micro- or nano-optical structure at least on a first surface of the base body to provide an optical component,
• Bending the optical component into a rounded, preferably semicircular, shape around a linear LED module,
• - Connecting the optical component with the LED module.

• 1a zeigt ein bekanntes Herstellungsverfahren eines starren optischen Bauelements mit einer Mikrostruktur aus dem Stand der Technik in seitlicher Schnittansicht.
• 1b zeigt die Anwendung des optischen Bauelements gemäß 1a für ein LED Modul in seitlicher Schnittansicht.
• 2 zeigt eine alternative, folienartige Ausgestaltung eines bekannten optischen Bauelements mit einer Mikrostruktur aus dem Stand der Technik in seitlicher Schnittansicht.
• 3a-3c zeigen Herstellungsschritte für ein bevorzugtes Ausführungsbeispiel des erfindungsgemäßen optischen Bauelements in seitlicher Schnittansicht.
• 4 zeigt ein bevorzugtes Ausführungsbeispiel einer erfindungsgemäßen LED Leuchteinheit aufweisend ein lineares LED Modul und ein bevorzugtes Ausführungsbeispiel des optischen Bauelements gemäß der vorliegenden Erfindung in seitlicher Schnittansicht.

The invention will be described by way of example with reference to the drawings, in which advantageous embodiments of the invention are shown. In the drawings show:

• 1a shows a known manufacturing method of a rigid optical device with a microstructure of the prior art in a side sectional view.
• 1b shows the application of the optical device according to 1a for a LED module in lateral sectional view.
• 2 shows an alternative, sheet-like configuration of a known optical component with a microstructure of the prior art in a side sectional view.
• 3a-3c show manufacturing steps for a preferred embodiment of the optical device according to the invention in a side sectional view.
• 4 shows a preferred embodiment of an LED lighting unit according to the invention comprising a linear LED module and a preferred embodiment of the optical device according to the present invention in a side sectional view.

1a and 1b show first an example of an optical device 40 with structured surface 41 from the prior art. As in 1a Shown is the structuring 41 as an integral part of the device 40 shaped. This is done by known manufacturing methods such as embossing, printing or lithography. This can be done by means of a stamp 42 a surface of the device to be deformed. The surface can be cured during or subsequently with UV light. Due to the manufacturing process shown, the device must be flat. When applying the element 40 as optic for a LED module 20 with several LED chips 21 is the element 40 at a predefined distance to the LED chips 21 to arrange which corresponds to the optical focal length of the LED module. Also, the look should be 40 extend as far as possible in the lateral direction to maximize the efficiency of light extraction from the LED module.

2 shows an alternative embodiment of an optical element 50 from the prior art. The element 50 is a transparent, rigid profile rail, for example of polymer material, on which a flexible film of PET material 51 having a structured surface is applied. The optical element 50 with applied foil 51 can on an LED module 20 to be ordered.

3c shows an inventive optical component 10 comprising a transparent base body 1 made of flexible material, preferably of silicone.

The main body 1 preferably has a thickness t of 0.5 to 5mm, more preferably 1 to 4mm. The thickness t is preferably constant. A length of the main body (perpendicular to the plane of the drawing) is preferably between 2 and 90 cm, more preferably between 5 and 50 cm. A width of the main body is preferably between 1 and 10 cm, more preferably between 2 and 6 cm.

The two lateral ends or flanks of the body 1 preferably have integrally formed connecting means 3 for connection to an LED module 20 on. The connecting means 3 are preferably on a first surface 1a of the basic body 1 arranged and can parallel notches and / or projections 3a , 3b. A width of the notches may be on a support thickness of the LED module 20 be adjusted. The connecting means preferably extend in the longitudinal direction of the base body (perpendicular to the plane of the drawing).

The first surface 1a of the main body has a micro- or nano-optical structure 2 on. This is preferably formed integrally in the surface of the base body. The structure 2 is preferably periodically formed and / or includes periodic elevations and depressions. The structure 2 However, it can also have other deviating shapes to allow a predefined light extraction from an LED module. In particular, the structure may extend from a central region of the first surface 1a to the two side areas towards the connection means 3 in their form and / or their periodicity.

The structure preferably has a height of between 10 nm and 150 μm, preferably between 20 nm and 50 μm. The micro- or nano-optical structure 2 is preferably configured to be one of an LED module 20 emitted light scattering reflected.

The transparent body 1 and / or the structure arranged thereon 2 preferably has a refractive index of greater than 1.6, preferably greater than 1.7.

One of the first surface 1a the body opposite surface 1b is preferably designed plan.

The described surface structure 2 can be prepared by known methods such as by a lithography method, an embossing method or a printing method. As in 3a and 3b shown, here is a stamp 4 with structure formed thereon 4a on the surface 1a of the basic body 1 pressed, whereby its surface is deformed (see 3b) , The surface may be previously softened or made of softened or deformable material, such as a matrix with nanoparticles incorporated therein. The surface can be cured during or subsequently with UV light.

The resulting device 10 made of flexible material has such mechanical properties that this is bendable in a round, preferably in a semicircular shape. In this case, the component should not lose its integrity or be affected, ie neither break or cracked, coincide or otherwise impaired in its structure.

4 shows an LED light unit 30 have a linear LED module 20 with a variety of LED chips 21 which are on a support 22 are arranged. The LED chips 21 are preferably linear on the support, ie in a row arranged (perpendicular to the drawing plane). The LED chips 21 are on a first surface 22a arranged the carrier. These, as well as one of these opposite second surface 22b are preferably executed essentially plan.

The LED light unit 30 further includes a flexible optical device according to the invention 10 on, as previously described. The optical component 10 is like in 4 shown about an axis in the longitudinal direction (perpendicular to the plane of the drawing) of the device 10 bent. The component 10 is thus the linearly arranged LED chips 21 bent in a round or substantially semi-circular shape. Here are the connecting means 3 of the optical component 10 with the carrier 22 of the LED module 20 in engagement, preferably such that the curved shape of the component 10 is held.

The optical component 10 is preferably arranged such that the first surface 1a of the component 10 with the micro- or nano-optic structure 2 in the direction of the LED chips 21 is directed.

By the inventive robust optical component 10 is a raised IP class protection of IP6x of the lighting element 30 achievable, without further sealing measures.

The present invention is not limited to the described embodiments and can be implemented in many different ways. In particular, further embodiments or alternative embodiments of the invention are possible without departing from the basic idea of the invention.

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• US 2014349086 [0003]
• US 2011/0039079 [0003]

Claims (14)

Optical component (10) for a linear LED module (20) with a plurality of LED light sources (21), comprising: - A transparent body (1) made of flexible material, preferably silicone, and a micro- or nano-optical structure (2), which is formed on at least a first surface (1a) of the base body (1), wherein the base body (1) is designed so robust that this in a round, preferably in a half-round shape is bendable. The optical component according to Claim 1 , wherein the base body (1) is bendable without loss of stability, in particular without collapsing in the round shape. The optical component according to Claim 1 or 2 , wherein the base body has a preferably constant thickness (t) of 0.5 to 5mm, preferably from 1 to 4mm. The optical component according to one of the preceding claims, wherein the base body (1) preferably has integrally formed connecting means (3) by means of which the optical component (10) can be connected to the LED module (20). The optical component according to Claim 4 wherein the connecting means (3) have parallel notches and / or projections (3a, 3b). The optical component according to one of the preceding claims, wherein the micro- or nano-optical structure (2) has a height of between 10 nm and 150 μm, preferably between 20 nm and 50 μm. The optical component according to one of the preceding claims, wherein the micro- or nano-optical structure (2) is formed periodically on the surface (1a). The optical component according to one of the preceding claims, wherein the micro- or nano-optical structure (2) is designed such that it reflects a light emitted by the LED module (20) scattering. The optical component according to one of the preceding claims, wherein the micro- or nano-optical structure (2) can be produced by surface modification, such as lithographic process or an embossing process of the base body (1). The optical component according to one of the preceding claims, wherein the transparent base body (1) and / or the structure (2) arranged thereon have a refractive index of higher than 1.6, preferably higher than 1.7. An LED lighting unit (30) comprising a linear LED module (20) with a plurality of on a support (22) preferably linearly arranged LED chips (21), and an optical component (10) according to one of the preceding Claims 1 to 11 , The LED light unit after Claim 11 , wherein the optical component (10) is arranged such that it is curved in a round, preferably semi-circular shape around the linearly arranged LED chips (21) of the LED module (20). The LED light unit after Claim 11 or 12 wherein the optical component (10) is arranged with respect to the LED chips (21) such that the first surface (1a) with the micro- or nano-optical structure (2) points in the direction of the LED chips (21). LED light unit (30) that can be manufactured using the following steps: Providing a robust basic body (1) of flexible material, preferably of silicone, - Formation of a micro- or nano-optical structure (2) at least on a first surface (1a) of the base body for providing an optical component (10), Bending the optical component (10) into a rounded, preferably semicircular shape around a linear LED module (20), - Connecting the optical device (10) with the LED module (20).

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