DE202018101571U1 - Silicon-containing composite structure - Google Patents

Abstract

A silicon-containing composite structure comprising a silicon layer (10), a hot melt adhesive layer (20), having a first layer (21) disposed below said silicon layer (10), said first layer (21) adhering to said silicon layer (10) by means of an adhesive, a second layer (22) adhered under the first layer (21), wherein the first layer (21) forms a hot melt adhesive at a first temperature and the second layer forms a hot melt adhesive at a second temperature, and wherein the second temperature is lower than the first temperature is.

Description

TECHNICAL AREA

The present invention relates to an application of silicon, in particular a silicon-containing composite structure and a method for producing the same.

BACKGROUND OF THE INVENTION

It is disadvantageous that prior art garments use plastic materials for the attachment of trademarks and other decorations. That is why the European Union, as well as emerging economies, have planned to ban plastic materials used to affix trademarks and other decorations to garments. Silicon is very stable and does not bend even at higher ambient temperatures below 150 ºC. Therefore, silicon proves to be a suitable material for adhering to garments as a substitute for plastics for adhering to garments.

In the prior art, liquid silicon is injected onto the fabric. Each time, only a small amount of silicon is sprayed on, so that the process of forming a complete decoration on a garment is overall time consuming. After spraying the silicon on the cloth, it is baked, and then the cloth is fastened to a garment by sewing or adhering (sticking). The disadvantage of this method is that it is not possible with a casting process, so this process is slow overall. When attaching silicon to garments, there is also the problem that silicon melts at a very high temperature, and the material from which the garments are made also melts or is destroyed at this very high temperature. Silicon can therefore not be adhered directly to a garment.

OBJECT OF THE INVENTION

In order to solve the above problems, the present invention is to provide a silicon-containing composite structure and a method for producing the same.

TECHNICAL SOLUTION

In order to achieve the above object, according to the present invention, a hot melt adhesive layer is attached by adhering under a silicon layer. The hot melt adhesive layer consists of a first layer and a second layer. With the first layer, the hotmelt adhesive layer can be bonded to the silicon layer, the composite structure thus obtained then being coated, by means of the second layer, with an article, such as e.g. a substance that can be connected. Silicon is also used as the material in the present invention. This can be made into various specific shapes by casting in the manufacturing process, after which the silicon layer thus formed can be adhered to the fabric. The process is faster overall feasible, the cost is lower. In addition, silicon is not deformed by heat, so it is less polluting than other materials conventionally used for this purpose.

list of figures

• 1 shows a schematic view of the layer combination of the present invention,
• 2 FIG. 12 is a schematic cross-sectional view of one embodiment of the present invention in which the silicon layer and the hot melt adhesive layer are integrally joined to an article. FIG.
• 3 shows a schematic plan view of an application of the present invention, in which the silicon layer and the hot melt adhesive layer are integrally connected to an object, and
• 4 shows another embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS OF THE INVENTION

• eine Siliziumschicht 10,
• eine Schmelzklebstoffschicht 20 (siehe 1), die die folgenden Komponenten umfasst:
  • eine erste Schicht 21, die unter der Siliziumschicht 10 angeordnet ist und mittels einem Haftmittel an der Siliziumschicht 10 angehaftet ist, und
  • eine zweite Schicht 22, die unter der ersten Schicht 21 angehaftet ist.

1 to 4 show the silicon-containing composite structure of the present invention. The silicon-containing composite structure according to the invention contains the following elements:

• a silicon layer 10 .
• a hot melt adhesive layer 20 (please refer 1 ) comprising the following components:
  • a first layer 21 that under the silicon layer 10 is arranged and by means of an adhesive to the silicon layer 10 is attached, and
  • a second layer 22 that under the first layer 21 is attached.

The first shift 21 is formed by heating the hot melt adhesive at a first temperature. The second layer 22 is formed by heating another hot melt adhesive at a second temperature. The second temperature is lower than the first temperature.

An adhesive area 40 is between the first layer 21 and the silicon layer 10 educated. The material of the gluing area 40 is generally a mixture of the material of the first layer 21 , the silicon layer 10 and the adhesive formed.

Preferably, polysiloxane is used as the material for the adhesive. Preferably, thermoplastic polyurethane is used as the material for the hot melt adhesive layer 20 used.

The first temperature is between 120 ° C and 200 ° C and the second temperature is between 60 ° C and 150 ° C. The first temperature is 10 ° C to 60 ° C higher than the second temperature.

2 shows that according to the invention further an object layer 3 is provided under the second layer 22 is arranged. The object layer 3 is not melted and has no undesirable deformation at the second temperature. The procedure for connecting the layers is that first the silicon layer 10 with the at least partially melted hot melt adhesive layer 20 and the composite structure is subsequently adhered to the object layer 3 is attached, in which case the material of the silicon-containing composite structure, which is the silicon layer 10 and the hot melt adhesive layer 20 is heated to a second temperature, so that the second layer 22 melts and then with the object layer 3 can be connected.

3 shows that the silicon-containing composite structure with the silicon layer 10 and the hot melt adhesive layer 20 in a specific form 301 is then cut into a specific shape 301 brought silicon-containing composite structure by adhering to the object layer 3 is attached. The specific form 301 may be a texture, a trademark, an advertisement, a warning, etc.

4 shows that the silicon-containing composite structure 4 with the silicon layer 10 and the hot melt adhesive layer 20 on an object layer 3 may be attached by adhesion such that the composite structure 4 can be used to achieve waterproofness or skid resistance.

Preferably, the material is the object layer used 3 a fabric, rubber, metal, plastic or the like. In particular, it is preferred that a substance as object layer 3 serves, which is a part of a garment (see 4 ).

In summary, the present invention thus relates to a silicon-containing composite structure and a method of manufacturing the same, wherein the silicon-containing composite structure is a hot melt adhesive layer 20 includes that under a silicon layer 10 attached to this. The hot melt adhesive layer 20 consists of a first layer 21 and a second layer 22 , With the first shift 21 can the hot melt adhesive layer 20 at the silicon layer 10 be attached while with the second layer 22 the composite structure 4 on an object, such as a fabric, can be attached. Further, in the present invention, silicon is used as the material. It can be made by casting into various specific shapes during manufacture 301 can be brought, wherein the silicon-containing layer can then be attached to a fabric. The whole process can be carried out quickly and the cost is low. In addition, the silicon is not deformed when exposed to heat, so it is therefore less polluting than other conventionally used materials.

From the description of the present invention, it will be obvious that these may be embodied differently. However, such various embodiments are not to be regarded as a departure from the technical teaching of the present invention, if they fall within the scope of the protection claims. Therefore, all such modifications as would be obvious to one skilled in the art and within the scope of the appended claims are also included in the present invention.

Claims (11)

Silicon-containing composite structure comprising a silicon layer (10), a hot melt adhesive layer (20), with a first layer (21) disposed below the silicon layer (10), the first layer (21) adhering to the silicon layer (10) by means of an adhesive, a second layer (22) adhered under the first layer (21), wherein the first layer (21) forms a hot melt adhesive at a first temperature and the second layer forms a hot melt adhesive at a second temperature, and wherein the second temperature is lower than the first temperature. Composite structure after Claim 1 in which an adhesive region (40) is formed between the first layer (21) and the silicon layer (10), the material of the adhesive region (40) being a mixture of the materials of the first layer (21), the silicon layer (10) and the Adhesive is. Composite structure after Claim 1 in which the material of the adhesive is polysiloxane. Composite structure after Claim 1 in which the material of the hotmelt adhesive layer (20) is thermoplastic polyurethane. Composite structure after Claim 1 in which the first layer (21) forms a hot melt adhesive at a first temperature between 120 ° C and 200 ° C and the second layer forms a hot melt adhesive at a second temperature between 60 ° C and 150 ° C, the first temperature being between 10 ° C and 60 ° C higher than the second temperature. Composite structure comprising the silicon-containing composite structure according to Claim 1 which further comprises an object layer (3) provided under the second layer, wherein the object layer (3) does not melt at the second temperature and has no deformation, and wherein the individual layers therein are heated respectively by the high melting temperature hot melt adhesive and wherein the composite structure is fused to the silicon layer (10) with the hotmelt adhesive layer (20) and then adhered to the object layer (3), the silicon layer fused to the hotmelt adhesive layer (20) ( 10) is connected to the object layer (3) by melting the second layer (22) at a second temperature. Composite structure after Claim 1 wherein the composite structure comprising the silicon layer (10) and the hot melt adhesive layer (20) is cut into a specific shape (301), wherein the composite structure having the specific shape (301) is adhered to an object layer (3). Composite structure after Claim 7 in which the specific shape (301) is a texture, a trademark, an advertisement or a warning. Composite structure after Claim 7 in which the composite structure ensures watertightness or skid resistance. Composite structure after Claim 7 in which the material of the object layer (3) is a cloth, rubber, metal or plastic. Composite structure after Claim 7 in which the object layer (3) is a part of a garment.

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