DE202007003680U1 - Cooling module`s stand for electronic device, has connecting unit provided at side of ridges turned towards fitting aperture to fasten cooling plate at aperture, where plate has feed-through corresponding to connecting unit - Google Patents
Cooling module`s stand for electronic device, has connecting unit provided at side of ridges turned towards fitting aperture to fasten cooling plate at aperture, where plate has feed-through corresponding to connecting unit Download PDFInfo
- Publication number
- DE202007003680U1 DE202007003680U1 DE200720003680 DE202007003680U DE202007003680U1 DE 202007003680 U1 DE202007003680 U1 DE 202007003680U1 DE 200720003680 DE200720003680 DE 200720003680 DE 202007003680 U DE202007003680 U DE 202007003680U DE 202007003680 U1 DE202007003680 U1 DE 202007003680U1
- Authority
- DE
- Germany
- Prior art keywords
- frame
- connecting unit
- aperture
- plate
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Technisches Gebiettechnical area
Die Erfindung betrifft ein Gestell für Kühlmodul, insbesondere ein Kühlmodul für elektronsiches Gerät.The The invention relates to a frame for Cooling module, in particular a cooling module for electronic device.
Stand der TechnikState of technology
Die
Die
der Grundplatte
Wie
aus
Mindestens
ein Befestigungselement
Die
Die
obengenannten zwei Gestelle sind beim Einsatz nachteilig. Da der
Rahmen
Durch
die Galvanisationsschicht für
das Lötmittel
Wenn die Größe der Kühlplatte verkleinert werden kann, können die Herstellungskosten wesentlich reduziert werden.If the size of the cooling plate can be downsized the production costs are significantly reduced.
Aus diesem Grund hat der Erfinder in Anbetracht der Nachteile herkömmlicher Lösungen, basierend auf langjähriger Erfahrung in diesem Bereich, nach langem Studium, zahlreichen Versuchen und unentwegten Verbesserungen die vorliegende Erfindung entwickelt.Out For this reason, in view of the disadvantages of the present inventor Solutions, based on longtime Experience in this area, after a long study, numerous experiments and unceasing improvements to the present invention.
Aufgabe der ErfindungTask of invention
Der Erfindung liegt die Aufgabe zugrunde, ein Gestell für Kühlmodul zu schaffen, das für die Kühlplatte keine Lötverbindung benötigt, so dass die Herstellung vereinfacht wird und die Dicke der Kühlplatte reduziert wird.Of the Invention is based on the object, a frame for cooling module to create that for the cooling plate no solder connection needed so that the manufacture is simplified and the thickness of the cooling plate is reduced.
Diese Aufgabe wird durch das erfindungsgemäße Gestell für Kühlmodul gelöst, bestehend aus einem Rahmen, der in der Mitte eine Montageöffnung und an der Rückseite zwei gegenüberliegende Erhöhungen aufweist, die an den beiden Seiten der Montageöfffnung liegen, wobei auf der der Montageöffnung zugewandten Seite der Erhöhungen mindestens ein Verbindungselement vorgesehen ist; einer Kühlplatte, die durch das Verbindungselement in der Montageöffnung befestigt ist und entsprechend dem Verbindungselement mindestens ein Durchgangsloch aufweist; und einer Vielzahl von Armen, die sich aus dem Rahmen erstrecken.These The object is achieved by the frame according to the invention for cooling module solved, consisting of a frame that has a mounting hole in the middle and at the back two opposite ones increases which lie on the two sides of the Montageöfffnung, wherein on the the mounting hole facing side of the elevations at least one connecting element is provided; a cooling plate, which is secured by the connecting element in the mounting hole and accordingly the connecting element has at least one through hole; and a variety of arms that extend from the frame.
Weitere Einzelheiten, Merkmale und Vorteile der Erfindung ergeben sich aus der nachfolgenden detaillierten Beschreibung in Verbindung mit den anliegenden Zeichnungen.Further Details, features and advantages of the invention will become apparent the following detailed description in conjunction with the adjacent drawings.
Kurze Beschreibung der ZeichnungenShort description the drawings
Wege zur Ausführung der ErfindungWays to execute the invention
Wie
aus den
Die
Kühlplatte
Die
Arme
Die
Der Rahmen und die Arme können einteilig ausgebildet sein. Die Kühlplatte ist durch Steck- oder Nietverbindung an dem Rahmen befestigt. Dadurch ist eine Galvanisation wie bei den herkömmlichen Lösungen nicht erforderlich, so dass die Kühlplatte dünner ist und die Herstellungskosten niedriger sind.Of the Frame and arms can be formed in one piece. The cooling plate is by plug or rivet connection attached to the frame. This is a galvanization as in the conventional one solutions not required, so that the cooling plate is thinner and the manufacturing cost are lower.
Aufgrund der obengenannten Tatsachen entspricht die Erfindung in ihrer Verfügbarkeit, Fortschrittlichkeit und Neuheit vollauf den Anforderungen für ein Gebrauchsmuster.by virtue of the above facts, the invention corresponds in its availability, Progressiveness and novelty fully on the requirements for a utility model.
Die vorstehende Beschreibung stellt nur die bevorzugten Ausführungsbeispiele der Erfindung dar und soll nicht als Definition der Grenzen und des Bereiches der Erfindung dienen. Alle gleichwertige Änderungen und Modifikationen gehören zum Schutzbereich dieser Erfindung.The The above description represents only the preferred embodiments of the invention and should not be used as a definition of boundaries and serve the scope of the invention. All equivalent changes and modifications are included to the scope of this invention.
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200720003680 DE202007003680U1 (en) | 2007-03-09 | 2007-03-09 | Cooling module`s stand for electronic device, has connecting unit provided at side of ridges turned towards fitting aperture to fasten cooling plate at aperture, where plate has feed-through corresponding to connecting unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200720003680 DE202007003680U1 (en) | 2007-03-09 | 2007-03-09 | Cooling module`s stand for electronic device, has connecting unit provided at side of ridges turned towards fitting aperture to fasten cooling plate at aperture, where plate has feed-through corresponding to connecting unit |
Publications (1)
Publication Number | Publication Date |
---|---|
DE202007003680U1 true DE202007003680U1 (en) | 2007-08-02 |
Family
ID=38329723
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE200720003680 Expired - Lifetime DE202007003680U1 (en) | 2007-03-09 | 2007-03-09 | Cooling module`s stand for electronic device, has connecting unit provided at side of ridges turned towards fitting aperture to fasten cooling plate at aperture, where plate has feed-through corresponding to connecting unit |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE202007003680U1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20230371208A1 (en) * | 2022-05-12 | 2023-11-16 | Ciena Corporation | Backing Plate Assembly with Jack Screw for Bare Die Device Heat Sink Applications to Ensure Uniform Loading |
-
2007
- 2007-03-09 DE DE200720003680 patent/DE202007003680U1/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20230371208A1 (en) * | 2022-05-12 | 2023-11-16 | Ciena Corporation | Backing Plate Assembly with Jack Screw for Bare Die Device Heat Sink Applications to Ensure Uniform Loading |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R207 | Utility model specification |
Effective date: 20070906 |
|
R150 | Term of protection extended to 6 years |
Effective date: 20100615 |
|
R157 | Lapse of ip right after 6 years |
Effective date: 20131001 |