DE202005020830U1 - Scalable link interface adapter card for use on mother board, has memory module connector comprising contact rows that are soldered with two bus, where dimensions of card and gold contact of card match dimensions of connector - Google Patents
Scalable link interface adapter card for use on mother board, has memory module connector comprising contact rows that are soldered with two bus, where dimensions of card and gold contact of card match dimensions of connector Download PDFInfo
- Publication number
- DE202005020830U1 DE202005020830U1 DE202005020830U DE202005020830U DE202005020830U1 DE 202005020830 U1 DE202005020830 U1 DE 202005020830U1 DE 202005020830 U DE202005020830 U DE 202005020830U DE 202005020830 U DE202005020830 U DE 202005020830U DE 202005020830 U1 DE202005020830 U1 DE 202005020830U1
- Authority
- DE
- Germany
- Prior art keywords
- sli
- card
- memory module
- adapter card
- bus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/02—Disposition of storage elements, e.g. in the form of a matrix array
- G11C5/04—Supports for storage elements, e.g. memory modules; Mounting or fixing of storage elements on such supports
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/184—Mounting of motherboards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/185—Mounting of expansion boards
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
- G06F1/186—Securing of expansion boards in correspondence to slots provided at the computer enclosure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/721—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures cooperating directly with the edge of the rigid printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2213/00—Indexing scheme relating to interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F2213/0038—System on Chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10159—Memory
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
Diese Erfindung betrifft allgemein eine SLI-Adapterkarte, die auf einem Motherboard installiert ist, insbesondere um einen SO-DIMM DDR2-Speichermodulanschluss zu verwenden, um eine SLI-Adapterkarte an das Motherboard anzuschließen.These The invention relates generally to an SLI adapter card that is mounted on a Motherboard is installed, especially around a SO-DIMM DDR2 memory module connector to connect an SLI adapter card to the motherboard.
Schon 1997 wurde die SLI (Scalable Link Interface)-Technologie verwendet, um die Bildanzeigegeschwindigkeit eines Computers zu beschleunigen, indem eine Grafikkarte verwendet wird, um die ungeraden Bildschirmzeilen darzustellen, und eine andere Grafikkarte verwendet wird, um die geraden Bildschirmzeilen darzustellen und die Darstellungen dann zu kombinieren. Kürzlich hat das Unternehmen nVIDIA eine Technologie entwickelt, bei der zwei Grafikkarten verwendet werden. Eine der beiden Grafikkarten stellt die obere Hälfte eines Bildes dar, und eine andere Grafikkarte stellt die untere Hälfte des Bildes dar. Alle Darstellungen werden in einer der Grafikkarten kombiniert. Die SLI-Technologie ist insbesondere für die PCI-Express-Schnittstelle vorgesehen. Nachdem Intel Chipsätze entwickelt hat, die PCI Express unterstützen, folgen viele Hersteller von Motherboards und Grafikkarten-Chipsätzen der PCI-Express-Spezifikation.Nice In 1997, the SLI (Scalable Link Interface) technology was used, to speed up the image display speed of a computer by: A video card is used to display the odd screen lines and another graphics card is used to display the to display straight screen lines and the presentations then to combine. Recently nVIDIA has developed a technology in which two graphics cards are used. One of the two graphics cards represents the upper half one image, and another video card represents the bottom one Half of the All representations are in one of the graphics cards combined. The SLI technology is especially intended for the PCI Express interface. After Intel chipsets has developed that support PCI Express, many manufacturers follow motherboards and video card chipsets of the PCI Express specification.
Unter
Bezugnahme auf die
Der
Stand der Technik bietet jedoch keine zusätzliche Vorrichtung, um die
SLI-Adapterkarte
Es ist daher eine Aufgabe der vorliegenden Erfindung, eine SLI-Adapterkarte bereitzustellen, die fest auf einem Motherboard installiert ist, und ein Motherboard mit einem SO-DIMM DDR2-Speichermodulanschluss bereitzustellen, in dem eine SLI-Adapterkarte fest installiert werden kann.It It is therefore an object of the present invention to provide an SLI adapter card, which is firmly installed on a motherboard, and a motherboard with a SO-DIMM DDR2 memory module connector in which an SLI adapter card is permanently installed can.
Kurz zusammengefasst offenbart die vorliegende Erfindung in einer Ausführungsform eine SLI-Adapterkarte mit einer Mehrzahl von Goldkontakten auf einem Motherboard sowie ein Motherboard, auf dem eine SLI-Adapterkarte fest installiert werden kann, wobei: (1) ein erster Bus auf dem Motherboard ausgebildet ist, um die Verbindung zwischen einem Chipsatz und einem SO-DIMM DDR2-Speichermodulanschluss herzustellen, wobei der SO-DIMM DDR2-Speichermodulanschluss eine erste und eine zweite Kontaktreihe hat; (2) ein zweiter Bus auf dem Motherboard ausgebildet ist, um die Verbindung zwischen dem SO-DIMM DDR2-Speichermodulanschluss und den zwei PCI-Express-Steckplätzen herzustellen; (3) die erste und die zweite Kontaktreihe mit dem ersten bzw. zweiten Bus zusammengelötet ist, wobei die Abmessung der SLI-Adapterkarte und die Goldkontakte der SLI-Adapterkarte mit dem SO-DIMM DDR2-Speichermodulanschluss zusammenpassen. Das Motherboard verfügt über einen Chipsatz und eine SLI-Adaptereinheit. Der Chipsatz unterstützt eine PCI-Express-Schnittstelle, und die SLI-Adaptereinheit weist hauptsächlich einen SO-DIMM DDR2-Speichermodulanschluss, zwei PCI-Express-Steckplätzen, einen ersten und einen zweiten Bus auf. Der SO-DIMM DDR2-Speichermodulanschluss dient zum Anschließen einer SLI-Adapterkarte. Jeder der zwei PCI-Express-Steckplätze dient zum Anschließen einer Grafikkarte. Mit dem ersten Bus werden der Chipsatz und der SO-DIMM DDR2-Speichermodulanschluss verbunden, und mit dem zweiten Bus werden der SO-DIMM DDR2-Speichermodulanschluss und die beiden PCI-Express-Steckplätze verbunden.Short In summary, the present invention discloses in one embodiment an SLI adapter card with a plurality of gold contacts on one Motherboard as well as a motherboard on which a SLI adapter card can be permanently installed, where: (1) a first bus on the Motherboard is designed to connect between a chipset and a SO-DIMM DDR2 memory module connector, wherein the SO-DIMM DDR2 memory module connector A first and a second contact row Has; (2) a second bus is formed on the motherboard to the connection between the SO-DIMM DDR2 memory module connector and the two PCI Express slots; (3) the first and second rows of contacts with the first and second, respectively Bus soldered together is where the dimension of the SLI adapter card and the gold contacts the SLI adapter card with the SO-DIMM DDR2 memory module connector match. The motherboard has a chipset and a SLI adapter unit. The chipset supports a PCI Express interface, and the SLI adapter unit points mainly a SO-DIMM DDR2 memory module connector, two PCI Express slots, a first and a second bus. The SO-DIMM DDR2 memory module connector serves for connection an SLI adapter card. Each of the two PCI Express slots serves to connect a graphics card. With the first bus, the chipset and the SO-DIMM DDR2 memory module connector connected, and with the second Bus will be the SO-DIMM DDR2 memory module connector and the two PCI Express slots connected.
Im Folgenden werden die Erfindung und ihre Vorteile anhand einer ausführlichen Beschreibung unter Zuhilfenahme der Zeichnungen dargestellt:in the Below, the invention and its advantages will be described in detail Description with the aid of the drawings:
Unter
Bezugnahme auf
Unter
Bezugnahme auf die
Unter
Bezugnahme auf
Die
SLI-Adapterkarte
Die
Arme
In der vorangehenden Beschreibung wurden zahlreiche Eigenschaften und Vorteile der Erfindung sowie der detaillierte Aufbau und die Funktionsweise der Erfindung aufgeführt, und die anhängenden Ansprüche enthalten die neuen Merkmale. Die Offenbarung ist beispielhaft dargestellt, Änderungen können im Sinn der Erfindung im Detail vorgenommen werden, insbesondere in der Form, Größe und in der Anordnung der Teile, Materialien und der Kombination derselben. Der gesamte Umfang wird durch die allgemeine Bedeutung der Begriffe angedeutet, mit denen die Ansprüche ausgedrückt werden.In In the foregoing description, numerous features and Advantages of the invention and the detailed structure and operation of the Invention, and the attached ones claims contain the new features. The disclosure is exemplary, changes can in Sense of the invention be made in detail, in particular in the shape, size and in the arrangement of parts, materials and their combination. The entire scope is determined by the general meaning of the terms indicated with which the claims expressed become.
SLI-Adapterkarte auf einem Motherboard mit einem SO-DIMM DDR2-Speichermodulanschluss, an den eine SLI-Adapterkarte sicher und fest angeschlossen werden kann. Das Motherboard verfügt über einen Chipsatz, der eine PCI-Express-Schnittstelle unterstützt und eine SLI-Adaptereinheit hat, die im wesentlichen über einen SO-DIMM DDR2-Speichermodulanschluss, zwei PCI-Express-Steckplätze, einen ersten und einen zweiten Bus verfügt. Der SO-DIMM DDR2-Speichermodulanschluss ist für den Anschluss einer SLI-Adapterkarte vorgesehen. Jeder der beiden PCI-Express-Steckplätze ist für den Anschluss einer Grafikkarte vorgesehen. Der erste und der zweite Bus sollen den Chipsatz, den SO-DIMM DDR2-Speichermodulanschluss und die zwei PCI-Express-Steckplätze miteinander verbinden. Auf dem Motherboard ist ein erster Bus ausgebildet, der einen Chipsatz und den SO-DIMM DDR2-Speichermodulanschluss miteinander verbindet, wobei der SO-DIMM DDR2-Speichermodulanschluss eine erste und eine zweite Kontaktreihe hat; auf dem Motherboard ist ein zweiter Bus ausgebildet, der den SO-DIMM DDR2-Speichermodulanschluss und zwei PCI-Express-Steckplätze miteinander verbindet; die erste und die zweite Kontaktreihe ist mit dem ersten bzw. zweiten Bus zusammengelötet.SLI adapter card on a motherboard with a SO-DIMM DDR2 memory module connector, to one SLI adapter card can be connected securely and firmly. The Motherboard has one Chipset that supports a PCI Express interface and an SLI adapter unit that has essentially over a SO-DIMM DDR2 memory module connector, two PCI Express slots, one first and a second bus has. The SO-DIMM DDR2 memory module connector is for the Connection of an SLI adapter card provided. Each of the two PCI Express slots is for the connection a graphics card provided. The first and the second bus should the chipset, the SO-DIMM DDR2 memory module connector and the two PCI Express slots connect with each other. There is a first bus on the motherboard one chipset and the SO-DIMM DDR2 memory module connector connects, with the SO-DIMM DDR2 memory module connector a first and a second contact row; on the motherboard is a second Bus formed the SO-DIMM DDR2 memory module connector and two PCI Express slots together links; the first and second rows of contacts are with the first or second bus soldered together.
- 11
- Motherboardmotherboard
- 22
- Chipsatzchipset
- 33
- SO-DIMM DDR2-SpeichermodulanschlussSO-DIMM DDR2 memory module connector
- 3030
- BasisBase
- 300300
- Steckplatzslot
- 301301
- Armepoor
- 302302
- Haltevorrichtungholder
- 3131
- Erste KontaktreiheFirst Contact number
- 3232
- Zweite KontaktreiheSecond Contact number
- 44
- Erster Busfirst bus
- 55
- PCI-Express-SteckplatzPCI Express slot
- 66
- Zweiter Bussecond bus
- 77
- SLI-AdapterkarteSLI adapter card
- 7070
- Goldkontaktegold contacts
- 7171
- Aussparungrecess
- 88th
- Grafikkartegraphic card
- 99
- Motherboardmotherboard
- 9090
- SLI-AdapterkarteSLI adapter card
- 9191
- SLI-AnschlussSLI connector
- 910910
- Kontaktecontacts
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE202005020830U DE202005020830U1 (en) | 2005-06-16 | 2005-06-16 | Scalable link interface adapter card for use on mother board, has memory module connector comprising contact rows that are soldered with two bus, where dimensions of card and gold contact of card match dimensions of connector |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102005027933 | 2005-06-16 | ||
DE202005020830U DE202005020830U1 (en) | 2005-06-16 | 2005-06-16 | Scalable link interface adapter card for use on mother board, has memory module connector comprising contact rows that are soldered with two bus, where dimensions of card and gold contact of card match dimensions of connector |
Publications (1)
Publication Number | Publication Date |
---|---|
DE202005020830U1 true DE202005020830U1 (en) | 2006-09-07 |
Family
ID=37026682
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE202005020830U Expired - Lifetime DE202005020830U1 (en) | 2005-06-16 | 2005-06-16 | Scalable link interface adapter card for use on mother board, has memory module connector comprising contact rows that are soldered with two bus, where dimensions of card and gold contact of card match dimensions of connector |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE202005020830U1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106909205A (en) * | 2015-12-23 | 2017-06-30 | 联想企业解决方案(新加坡)有限公司 | Filler for computing device |
-
2005
- 2005-06-16 DE DE202005020830U patent/DE202005020830U1/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106909205A (en) * | 2015-12-23 | 2017-06-30 | 联想企业解决方案(新加坡)有限公司 | Filler for computing device |
CN106909205B (en) * | 2015-12-23 | 2020-11-03 | 联想企业解决方案(新加坡)有限公司 | Filler for computing device |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R207 | Utility model specification |
Effective date: 20061012 |
|
R150 | Utility model maintained after payment of first maintenance fee after three years |
Effective date: 20080723 |
|
R151 | Utility model maintained after payment of second maintenance fee after six years |
Effective date: 20111117 |
|
R082 | Change of representative |
Representative=s name: SCHWERBROCK, FLORIAN, DE |
|
R152 | Utility model maintained after payment of third maintenance fee after eight years | ||
R152 | Utility model maintained after payment of third maintenance fee after eight years |
Effective date: 20131209 |
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R071 | Expiry of right |