DE202005017671U1 - Heat removal device for cooling central processing device, has reflux arranged in container such that cooling medium is liquefied in container and conducted to cooling channel, where medium is again liquefied and lead back to container - Google Patents
Heat removal device for cooling central processing device, has reflux arranged in container such that cooling medium is liquefied in container and conducted to cooling channel, where medium is again liquefied and lead back to container Download PDFInfo
- Publication number
- DE202005017671U1 DE202005017671U1 DE200520017671 DE202005017671U DE202005017671U1 DE 202005017671 U1 DE202005017671 U1 DE 202005017671U1 DE 200520017671 DE200520017671 DE 200520017671 DE 202005017671 U DE202005017671 U DE 202005017671U DE 202005017671 U1 DE202005017671 U1 DE 202005017671U1
- Authority
- DE
- Germany
- Prior art keywords
- container
- cooling
- heat
- liquefied
- refrigerant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
Abstract
Description
[Technisches Gebiet][Technical area]
Die Erfindung betrifft ein Wärmeabfuhrgerät zur Zwangskühlung einer ZPE(Zentralprozessoreinheit).The The invention relates to a heat dissipation device for forced cooling a ZPE (central processing unit).
[Stand der Technik][State of the art]
Heute wird die Behandlungsgeschwindigkeit von ZPE immer schneller entwickelt. Eine schnellere Geschwindigkeit bedeutet eine höhere Taktfrequenz, und damit eine hiermit verbundene höhere Wärmebildung. Deshalb wird eine entsprechende immer größere Anforderung an die Wärmeableitleistung für ZPE gestellt.today the speed of treatment of ZPE is developed faster and faster. A faster speed means a higher clock frequency, and thus a related higher Heat generation. Therefore, a correspondingly greater and greater demand is placed on the heat dissipation performance for ZPE posed.
Dabei
hängt die
Wirksamkeit des Wärmeabfuhrs
stark von der wärmeleitenden
Geschwindigkeit von der ZPE
Hier will die Erfindung Abhilfe schaffen. Der Erfindung liegt die Aufgabe zugrunde, ein Wärmeabfuhrgerät zur Zwangskühlung einer ZPE bereitzustellen, mit dem der vorbeschriebene Nachteil vermieden wird.Here The invention aims to remedy this. The invention is the task underlying, a heat dissipation device for forced cooling a To provide ZPE, avoided with the above-described disadvantage becomes.
Die
Aufgabe wird erfindungsgemäß dadurch gelöst, daß der Wärmeabfuhrkörper als
Kältemittel eine
flüchtige
Kühlflüssigkeit
enthält,
die im Kreislauf über
eine Umlaufleitung durch die Wärmeabfuhrrippen
gebracht wird, wobei das Kältemittel
in einem mit der ZPE im Kontakt stehenden Behälter unter Wärmeaufnahme
verdämpft
und über
einen Vorlauf der Umlaufleitung durch die Wärmeabfuhrrippen geleitet und
unter Wärmeabgabe
wieder verflüssigt
und über einen
Rücklauf
in den Behälter
zurückgeleitet
wird. Da das Kältemittel
nimmt beim Übergang
vom flüssigem
zum dämpfförmigen Zustand
als Verdämpfungswärme eine
große
Wärmemenge
auf, ohne dabei eine wesentliche Erhöhung in seiner Temperatur zu erhalten,
bleibt die Temperaturdifferenz zwischen der ZPE und dem Wärmeabfuhrkörper ausreichend hoch,
bis die ZPE aureichend abgekühlt
wird. Anderseits wird wegen der großen Wärmeabgabe des Kältemittels
beim Durchfluß der
Wärmeabfuhrrippen
die Temperatur der letzteren trotz des Abtrags der großen Wärmemenge
durch die Luft nahezu kaum abgesenkt. Deshalb bleibt die wärmeabtragende
Fähigkeit des
durch den Ventilator
Die Erfindung wird nachfolgend anhand einer in der Zeichnung dargestellten bevorzugten Ausführungsform näher erläutert. Es zeigen:The Invention will now be described with reference to a drawing preferred embodiment explained in more detail. It demonstrate:
[Zeichnung][Drawing]
[Erläuterung der bevorzugten Ausführungsform][Explanation of the Preferred Embodiment]
Das
in
Im
Einsatz wird zuerst durch einen durch einen Forsatz des Vorlaufs
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200520017671 DE202005017671U1 (en) | 2005-11-11 | 2005-11-11 | Heat removal device for cooling central processing device, has reflux arranged in container such that cooling medium is liquefied in container and conducted to cooling channel, where medium is again liquefied and lead back to container |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE200520017671 DE202005017671U1 (en) | 2005-11-11 | 2005-11-11 | Heat removal device for cooling central processing device, has reflux arranged in container such that cooling medium is liquefied in container and conducted to cooling channel, where medium is again liquefied and lead back to container |
Publications (1)
Publication Number | Publication Date |
---|---|
DE202005017671U1 true DE202005017671U1 (en) | 2006-01-19 |
Family
ID=35722073
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE200520017671 Expired - Lifetime DE202005017671U1 (en) | 2005-11-11 | 2005-11-11 | Heat removal device for cooling central processing device, has reflux arranged in container such that cooling medium is liquefied in container and conducted to cooling channel, where medium is again liquefied and lead back to container |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE202005017671U1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019082273A (en) * | 2017-10-30 | 2019-05-30 | 下田 一喜 | Cooling system |
-
2005
- 2005-11-11 DE DE200520017671 patent/DE202005017671U1/en not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019082273A (en) * | 2017-10-30 | 2019-05-30 | 下田 一喜 | Cooling system |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R207 | Utility model specification |
Effective date: 20060223 |
|
R150 | Term of protection extended to 6 years |
Effective date: 20090128 |
|
R157 | Lapse of ip right after 6 years |
Effective date: 20120601 |