DE2010497A1 - Adhesive bonding of metal plates - Google Patents

Description

The invention relates generally to joining of metal plates to each other and adhesives. More particularly, the invention relates to an adhesive with the one very strong adhesive connection can be achieved in a very short time between two metal plates, namely by means of a organic glue,

The term "Metallplatteri" is intended to mean a very large one Scope, with iron and steel plates as important examples, Aluminum plates and also plates of other metals should be highlighted, which also have on their surfaces

009840/1884

other metals, such as zinc, tin, chromium and aluminum, or which can be chemically or Electrolytically treated with chromic acid or phosphoric acid, and also metal plates that are on their surfaces are coated with an organic paint coating.

Metal plates of this type can be securely and firmly connected to one another with an adhesive according to the invention This adhesive is obtained with a mixing process in which a crystalline, linear polyamide and a non-crystalline or amorphous polyamide or a semicrystalline polyamide directly or in a solution can be used with a suitable solvent, which will be described in more detail later.

Linear polyamides are compared because of their high strength and extremely great resilience to other strong materials and are therefore known alone or in combination with other substances as an adhesive for joining metal and other substances used. As an example of such combinations are

oomo / mt

Admixtures of linear polyamides with phenolic resins belonging to novolaks and the like (such an example is described in Known Japanese Patent Application No. SHO J6-20569), thermosetting adhesives are obtained by adding epoxy resins and other hardening accelerators to the linear polyamides, adhesives containing linear polyamides coated with epoxy resins or diisocyanates thermally cure during the gluing time (as described, for example, in the well-known Japanese application No. SHO 35-4-221 and SHO 36-15656), and copolymers can be produced in which, by adding other components to linear polyamides (e.g. in the published ei
described).

c
known Japanese Patent Application No. SHO 40-17662

au glue made by adding / the novolak

counting phenols into linear polyamides However, they are not fully suitable for quickly gluing metal plates together. This disadvantage occurs

BATH ORIGINAL 0G9840 / 1884

is even more apparent in adhesives that transform the properties of a polyamide into a thermosetting resin, because such resins take a long time to set and are therefore unsuitable for rapid bonding. In contrast, copolymers which are obtained by adding other components to linear polyamides P have high production costs and are therefore not yet applicable at the moment.

So for a quick gluing process, it's obvious It is necessary to have an adhesive on hand which has good adhesiveness as a property the objects that are glued together, having. As a result of the investigations made on the solidification that occurs when glue comes out of the when cooled in the molten state, it was found that in addition to the good adhesiveness a high temperature dependence of the viscosity of the melt of the adhesive occurred, and the fact that the Glue belongs to the crystalline high polymers and is an important condition for fast setting.

009840 / iflfU

The object of the invention is to address these and others To use findings to create new quick-setting adhesives with which a strong adhesive bond between metal plate surfaces is possible in an extremely short time, namely within approximately 50 to 200 ms, these adhesives being free from the aforementioned disadvantages inherent in linear polyamide adhesives.

The object is also to provide a method for producing such an adhesive Methods for its application.

According to the invention an adhesive composition is provided for the adhesive bonding of metal plates is what obtained by mixing a crystalline linear polyamide, which first has a relative viscosity of at least 1.5, when the polyamide in 1 # sodium concentration in 98 # sulfuric acid is contained, with an amorphous or semi-crystalline polyamide,

0Q9840 / 18 $ k

secondly, which differs from polyamide firstly,

the mixture being carried out in a weight ratio of 99: 1 to 90:10.

The invention provides a method of manufacture created this adhesive composition according to the invention.

According to a further aspect of the invention, the adhesive obtained by mixing a crystalline linear polyamide with an amorphous polyamide or a semi-crystalline polyamide is obtained immediately as Coating layer by thermocompression bonding or by melt compression bonding or in the form of a coating solution applied in a suitable solvent to the metal plate parts that are glued together These should be cleaned beforehand to remove dirt such as dust, oil, grease and adhering rust particles to remove, after which they are dried, creating an adhesive layer on each of the metal plate parts is formed.

ÜOS84O / 18ftt

- Τ- ·

The metal plate parts coated in this way are then brought apart in an overlapping manner, and if so, then heated and maintained at a temperature above the melting point of the crystalline linear polyamide are in the adhesive, they are pressed together for a very short time of about JO to 200 ms, in which case they the metal plate parts Glue together extremely tightly.

The essence, as well as details and slots, of the invention will be apparent from the following detailed description even more clearly evident, which begins with general considerations and actually with specific examples Executed embodiments includes, the following statements in connection with the Drawing are to be read. Show it:

Pig * 1 a graphical representation of the melt ' Viscosity above the temperature of one according to the invention Glue, a crystalline linear polyamide, and polyethylene;

Fig. 2 is a graphical representation over the

Temperature the amount of heat absorbed during melting in the case of an adhesive according to the invention, a crystalline linear polyamide, an amorphous polyamide and a semi-crystalline

: shows linen polyamide; and

009-840 / iftfti

Pig. 5 is a graph showing the temperature as a function of the crystallization shows the amount of heat developed, namely in an adhesive according to the invention, a crystalline polyamide, an amorphous polyamide and a semi-crystalline polyamide.

The importance of the high temperature dependence of the melt viscosity, already mentioned earlier of the adhesive and the crystalline macromolecular property of the adhesive is clear from the following explanations in connection with an example of a gluing of two metal plates with an organic adhesive.

First, the adhesive is heated and melted at a temperature above its melting point and then applied to a metal surface to be glued. lis can also be the metal surface itself be heated to a temperature which is above the melting point of the adhesive, and then the adhesive be brought into contact in the solid state with this metal plate, so that it is heated and melted thereby and thereby adheres to the metal plate in the form of an adhesive coating.

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BAD ORiGSNAL

Then the part of the metal plate that is coated with the adhesive in the manner described is overlapping with the corresponding likewise coated part or not coated with an adhesive Part of the other metal plate brought into contact. the so overlapping metal plates on top of each other then heated to a temperature above the The melting point of the adhesive is so that the on both or the adhesive layer on a plate melts, whereupon the plates are then pressed together for a very short time and then cooled to a temperature below the crystallization temperature of the adhesive, whereby the two metal plates are then firmly connected to each other.

To a gluing of metal plates in a very, short time Time to be able to carry out one procedure in one Heating process, a gluing and a cooling phase contains, these individual process steps have to be in very high order short time, e.g. in about; 50 to 200 ms will. -

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Certain points which belong to the individual process steps and physical properties which the adhesive must have should now be considered. In the process stage of heating the adhesive to a temperature above its melting point in order to melt it and to form an adhesive bond with the metal surface, the viscosity of the melt of the adhesive should be low in order to be able to carry out this step particularly well and quickly. Since the viscosity of the melt decreases with increasing temperature, it is possible to reduce the viscosity of the adhesive by increasing the temperature. However, if the metal plate of high thermal conductivity heated to a high temperature, the cooling requires a considerable time, with the result that the entire Ψ bonding process takes a long time, which of course is a disadvantage Schnellklebung.

In order to carry out a rapid bond, it is therefore desirable that the viscosity of the melt of the adhesive Depending on the temperature, even with a slight temperature change above the melting point

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changes greatly. .

More specifically, it is desirable that, in the case of quick bonding, while the adhesive is melting, the Melt viscosity with a slight increase in temperature abruptly decreases, and that at the end of the gluing process the Melt viscosity increases abruptly when the temperature is reduced only a little. Using a Adhesive, which has such a characteristic of the viscosity of the melt, can be included in the bonding process relatively low energy consumption for heating and cooling can be carried out, so that a such glue lends itself to a quick gluing process very cheap.

If an adhesive does not reach the strength of the adhesive point immediately after cooling, the is above a certain limit value, so there is the possibility that the connected parts, even if they are once glued together, differ from each other in the subsequent Process can be separated again. If an amorphous or semi-crystalline, high-polymer adhesive is used,

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BAD ORiGfNAL

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so the adhesive remains after compression bonding and cooling in a semi-molten state and takes some time to solidify. This time is therefore required to achieve a strength in the bond that is sufficiently high, so that a Quick gluing is not possible.

A crystalline, high-polymer material, on the other hand, solidifies from the molten state and its crystallization proceeds instantaneously when the temperature is below the crystallization temperature, so that the adhesive then acquires mechanically high-strength properties. It is therefore necessary for quick bonding that the adhesive not only has a strong temperature dependency of its melt viscosity, but also that it is a crystalline high polymer which crystallizes and thus has high strength immediately after bonding and cooling is carried out.

Because of their properties, such as the excellent ones Adhesion to metals, high temperature dependence The melt viscosity and crystalline macromolecular structure make crystalline linear polyamides suitable

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EAD ORiGHNiAL

for use in quick gluing operations.

If only a crystalline linear polyamide is used for an adhesive, the proportion of the crystalline Partly (i.e. the degree of crystallization) a large one Influence on the quick gluing process. More precisely, the smaller the proportion of the crystalline polyamide part, the better the glue can do the steps in a short time heating the adhesive to a temperature above the Melting point until it assumes the molten state, carry out. A low degree of crystallization of the glue makes it possible to melt it in a short time Time to make.

If an amorphous or semi-crystalline polyamide

is used as an adhesive, this has advantages for the I.

Heating and melting in a short time, because no amount of heat is required to melt a piece of crystal. However, the post-bonding crystallization and cooling do not proceed quickly, and it becomes particularly long Time is needed until a sufficient adhesive force is achieved, so that a SchnellId.be with such polyamides not possible.

While it is of course possible, even with an adhesive with a high degree of crystallization, this to melt in a short time by supplying a correspondingly large amount of heat, the Metal plates are raised to a high temperature and then take a long time to cool, so that a long time is required for the entire gluing process.

That means, if quick bonding is to be carried out by the individual steps such as heating, Melting, bonding and cooling of the adhesive are carried out, then the adhesive must be a crystalline one Be highly polymeric so that it solidifies quickly when it cools, but it will take too long needed for heating and melting when the degree of crystallization is too high. It is therefore necessary To control the degree of crystallization of the glue, which is an important factor for the quick gluing process.

It has been found that it is possible to determine the degree of crystallization of a crystalline linear polyamide

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ÖG9840 / 188 &

201G497

to control by adding an amorphous or semicrystalline polyamide to the crystalline linear polyamide in a weight ratio of 99: 1 to 90:10, whereby an adhesive is obtained which has an excellent adhesive property with respect to metal plates and which is just suitable for Rapid bonding is optimally suited without losing its high temperature dependency with regard to its melt viscosity, which is an excellent feature of linear polyamides.

Various good properties of mixtures of crystalline linear polyamides with amorphous or semi-crystalline polyamides will now be described in connection with FIGS. 1, 2 and 5.

In Fig. 1, the ordinate is the viscosity (In poise), while the temperature in degrees Celsius is plotted on the abscissa «Curve 1 shows the change the melt viscosity as a function of the temperature of an adhesive according to the invention, and curves 2 and 5 show the same relationship for a

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crystalline linear polyamide and for a resin such as polyethylene.

From this Fig. 1 it can be seen that the temperature dependence of the viscosity of the melt of the adhesive according to the invention (curve 1) and the crystalline linear polyamide (curve 2) is noticeably higher than that of polyethylene (curve 3), which is also called here Example for other plastic materials is available. It can also be seen that the melt viscosity is dependent on temperature of the adhesive according to the invention is essentially the same as the temperature dependence of the crystalline Polyamide, but that the melt viscosity values of the adhesive are lower than those of the crystalline Polyamide.

Fig. 2 shows the relationship between heat absorption during melting and temperature, the Behavior in the melting of samples is applied, the first of which is an adhesive according to the invention (curve 1), whose second a crystalline linear polyamide (curve 2), whose

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third was an amorphous polyamide (curve 4) and the fourth was a semi-crystalline polyamide (curve 5), all of them were heated with a certain constant temperature increase.

Like from Pig. 2 shows the curves of the adhesive according to the invention (curve 1) and of the crystalline one Polyamide (curve 2) has sharp peaks of heat absorption at a temperature at which the crystals melt, this melting temperature being determined by the type of crystalline polyamide. The term "melting point" means in this context the temperature at which the absorbed heat of fusion has its highest value. Since in. amorphous polyamide (curve 4) does not contain any crystalline fraction, there is also no absorption peak in this curve. The curve 5 * that of the semi-crystalline

a
Polymid shows only a slight increase in

the absorption of heat during melting at a temperature lower than that of the tips of the crystalline curves associated with linear polyamide and the adhesive according to the invention. These curves of Fig. 2 show

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0098 * 0/1 * 84

the differences in melting crystalline linear PolyWde amorphous polyamides and semi-crystalline polyamides.

From Flg. 2 it can also be seen that while there is no significant difference in the temperatures of the peaks of the heat of fusion, ie melting points, the peak of curve 1 for the adhesive of the invention is lower than the peak of the crystalline linear polyamide (curve 2). This indicates that the degree of crystallization of the adhesive according to the invention is lower than that of the crystalline linear polyamide, which is its base material, so that the amount of heat required for melting the crystals is smaller in the adhesive. In this respect, therefore, the adhesive of the invention advantages over the base material, the kristäs- W linen linear polyamide, provided it is used solely for rapid melting and bonding.

The crystallization behavior of the individual samples of the adhesive according to the invention (curve 1), a crystalline one linear polyamide (curve 2), a semi-crystalline polyamide (Curve 5) and an amorphous polyamide (curve 4)

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when these are cooled from the molten state, is shown in Fig. 3 «

It can be seen from FIG. 5 that the adhesive according to the invention (curve 1) and the crystalline linear polyamide (curve 2) have sharp points which indicate heat generation during the crystallization solidification. The amorphous polyamide (curve 4) does not develop any heat during crystallization, while some heat is released during the crystallization of a small amount in the semi-crystalline polyamide (curve 5), but no rapid solidification occurs. The essential differences between the crystallization of the adhesive according to the invention and the amorphous and semi-crystalline polyamide are thus clearly shown .

If an inventive adhesive once melted cooled and again, so the viscosity of the-melting, Tt with the cooling abruptly increases, whereby the adhesive is determined, and the crystallization proceeds at a specific temperature, rapidly advancing · characterized The adhesive bond receives a large resistance.

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In the case of heating, melting, with each other Bonding and cooling can be carried out one after the other and, moreover, rapid bonding can be achieved The important characteristics are that, first of all, the temperature dependence of the melt viscosity of the adhesive is high and secondly, the adhesive is a crystalline high polymer, as already stated. Additionally is it is necessary that the melting with a small amount of Heat can be carried out and that the crystallization occurs rapidly on cooling, ho that the control the degree of crystallization is a very important requirement.

With the adhesive according to the invention, all of these can Requirements are satisfied, and if metal plates are glued together with such an adhesive, the steps of heating, bonding and cooling can be performed in a short time of 50 to 200 ms creating a very strong adhesive bond between the metal plates.

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009840/1886

So it will be a film of a device of the invention Subjected to a quick bonding under pressure, e.g. of about 200 ms, with the metal plates at a temperature above the melting point of the Glue are heated, so it is possible to already glue-coated Metal plates on which the adhesive layer firmly hafljet. If then this Metal plates again brought to a temperature above the melting point of the adhesive and on top of each other pressed and the glued surfaces cooled down, something becomes occupies only a very short period of time of about 50 ms, the metal plates are very strong together glued.

The adhesive connections can therefore be made in a very short time Time to be produced when an adhesive according to the invention, is used, so that with this method the usual soldered connection to form the side seams of Cans or containers made of sheet metal can be replaced. Such a gluing process, in which an adhesive according to the "invention is used, can therefore be used with advantage for fast production, as occurs in automatic can production will. .

QQ98AQ / 1884 " ²² "

The compositions of the adhesives as they can be used for use in accordance with the invention will now be considered in detail. Crystalline linear polyamides which are a component of the adhesive according to the invention are, for example, nylon 66, nylon 6, nylon 610, nylon 11 and nylon 12, all of which are available on the market.

Examples of semi-crystalline polyamides, which form a further component of the adhesive, are the following, which have proven to be suitable: Copolyamides of substances such as alkylene (e.g. C ^ -Cj ^), diamines such as hexamethylene diamine, alkylene dicarboxylic acid (e.g. Ch- C. h \ such as adipic acid, sebacic acid, aminocarboxylic acid (eg Ch-C ₁ h) such as 6-amino-caproic acid, 11-amino-undecanone acid or 12-amino-lauric acid, Examples of suitable amorphous polyamides are amorphous Polyamide resins which are established during the condensation polymerization of an amino component I which consists of one or more of the following parts: (i) polyalkylene polyamides such as diethylenetriamine, triethylenetetramine and tetraethylenepentamine; and (2) alkylenediamines such as ethylenediamine,

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009840/1836

1,2- (or 1,3-) diaminopropane, and 1,2-, 1,3-, and 1,4-diaminobutane; with an acid component II, consisting of one or more consists of the following parts: - (3) polymers that are obtained by drying or Halbtrooknen of oils, aliphatic acids, (for example, dimer, trimer, etc. of cq- ^c ₂ 4 unsaturated Monocaboxylsäuren as Leinulsäure and Oleic acid obtained from soybean oil, linseed oil, cottonseed oil or the like); and (4) aliphatic acids, such as C ^ -C ₁₀ Diearboxylsäuren such as adipic acid, azelaic acid, sebacic acid, and Aminoglutareäure.

Oopolyaau.de (nylon), the semi-crystalline polyamides are on the market under the names Amllan CM 4000 and GM 4001 from Toyo Rayon Company, Japan and Elvamide from E.I. Du Pont de Nemours 4 Company, Inc., USA sold Amorphous polyamide resins are on the market e.g. under the name Polymide from Sanyo Kasei K.K., Japan, Luckamide by Dai Nippon Ink K.K., Japan, and Versamide and Versalon by General Mills Ine, USA, sold,

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00 984 0./188 4 _Λ ,

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While a crystalline linear polyamide, which forms part of the adhesive, which is a relative Viscosity in 98 # Lger sulfuric acid has less than 1.5 (1 # concentration) to be used for gluing can, however, no firm adhesive bond can be achieved because the crystalline linear polyamide itself 'is crumbly.

The crystalline linear polyamide and the amorphous or semi-crystalline polyamide can be used to form the present invention Glue can be mixed together by any method. One possible method is that solutions are mixed together using a solvent in which both substances are used are easily soluble, or the mixing can be done by kneading with the help of a * heated roller in a Nitrogen stream or in a hot kneading process, in using a screw extruder, the latter method using a screw extruder is particularly economical. Test results showing the composition and degree of crystallization that Melt viscosity, the melting point, the crystallization temperature and the strength of the adhesive bond at a

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009840/1884 _BAD

Show rapid bonding are summarized in Tables 1 and 3. In preparing the samples of the adhesive for these tests, the crystalline linear polyamide was used and the amorphous or semi-crystalline polyamide in solid State mixed with each other in different proportions and heated and kneaded with the help of an extruder, which had a nylon screw 40mm in diameter and 1120mm in effective length. The essential heating and kneading conditions were a temperature of 200 to 230 ° C in the vicinity of the press die and one Screw speed of 30 revolutions per minute.

The resulting pellets of the adhesive were formed into a film of 50 microns thick by means of a film forming machine having an extruder with a nylon screw of 25 mm in diameter and 600 mm in effective length and a T-shaped piece with an extrusion opening of 0 , 3 mm wide and 10 mm long. The principal data were a temperature of the molded piece of 200 to 23O ⁰ C and a screw speed of 40 revolutions per minute.

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The metal plates used in these tests were rolled up with a coating of phenolic resin to a film thickness of 5 microns and were themselves electrolytically chromium plated steel plates made by Toyo Kohan Company, Japan. The lacquer layer was then baked on in an oven ^{at 210 ° C. for ten minutes.}

The thus-coated metal plates were then provided with an adhesive layer by the parts that should obtain the adhesive layer, was heated to a temperature of about 230 to 250 ⁰ C, pieces of 50 micron thick adhesive film then pressed and cooled for 200 ms. The surfaces of the metal plates coated in this way were then ^{heated to a temperature of 250 to 250 °} C. and then pressed onto one another and cooled for 50 ras. In this way, the test samples were prepared.

009840/1884 " ²⁷ "

TABEL

crystalline
polyamide

amorphous ♦ melting point crystalline polyamide (C) tion temperature

rature ( ^D C) Enamel - viscosity (pois) +4

Degree d. Crystallization (number) +5

Zerreiß * strengthens Ikg / omf +6

_o nylon 12.
ο only +1
to nylon 12
α »nylon 12
* - nylon 12
° nylon 12
] j nylon 12
O ₀ nylon 11
oo only +2
■ * * * nylon 11
Nylon 610
only +5
Nylon 610

Versalon 1165 versalon 1175 Assembly 940 Amilan CM 4001 Elvamlde

Versalon 1165

Amilan CM 4001

184

183 182 182 182 183 193

192 225

225

154

154

153 152 158 152 165

165 196

195 15,500

400

12,500 160 15,000 180 14,000 140 14,000 200 13,500 23O 18,000 450 17,000 170 3,900 430

4,000

160

230

320 310 290 330 300 210

28O 190

275

CO

To table 1 :

+1. Relative viscosity in 98 # HgSO ^: 2.45 W concentration) +2. Relative viscosity in 98 # H ₂ SO ^: 2.6 (1 # concentration) +3. Relative viscosity in 98 # HgSO ^: 2.7 (1 # concentration)

+4. Viscosity that occurs when using a flow tester (nylon 12, Njton 11 measurements at 220 ° C., nylon 610 measurements at 240 ° C).

+ 5 * number of reflections during one second at an angle of incidence for maximum diffracted X-ray strength at 30-KV tube voltage and 30-mA tube current using an X-ray diffraction instrument from Manufacturing company Rigaku Denki Company, Japan. Test sample was a 50 micron film and sample diffraction area Jmm times 20 mm.

+ 6. Adhesive surface 3mm by 20mm converted to kg / cm according to the
Tensile strength measurement (cross head speed 100mm / min.).

ND: The mixing ratio in parts by weight of the crystalline polyamide and the amorphous or semi-crystalline polyamide was 95 * 5 in each of the mixtures

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TABLE 2

Crystalline polyamide

(Parts)

amorphous polyamide (parts)

€ 3 V.

* ~ Nylon

^ Nylon

_, Nylon go nylon α> Nylon ** nylon nylon nylon nylon nylon Nyiibn

Melting point Kristallisa Melt- rc) tion temperature viscosity
(poise) 184 154 15,500 183 154 15,500 182 154. 15.200 182 153 15,000 181 152 15,000 180 152 13,000 183 154 15,500 182 154 15,000 182 153 15,000 180 153 14,500 18O 153 14,000

Degree d. Tear Kristalli firm sation ability ₂ (Number) (kg / cm) 400 230 _u 290 270 p 240 290 180 310 120 300 90 200 280 290 240 3OO 190 32O 150 290 110 210

Td. C.
12th >nx;
99 12th 97 12th 95 12th QO 12th Q / "\
Ow 12th 99 12th 97 12th 95

12 12

Versalon 1175 (1 Versalon 1175 (3 Versalon 1175 (5 Versalon 1175 (10 Versalon 1175 (20 Amilan CM4000 (1 Amilan CM4000 (3 Amilan CM4000 (5th Amilan CM4000 (10 Amilan CM4OOO (2O

From Table 1, the melting points, the Krlstalllsationsteraperajituren and Schmelzevlskosltäten can be read, which had by mixing a crystalline linear polyamide and an amorphous or semi-crystalline polyamide, it being understood that these values do not significantly differ from the values of the crystalline polyamide chen ψ However, the degree of crystallization of the adhesive is lower and the strength of the bond is considerably higher.

While the degree of crystallization is usually determined by measuring the specific gravity, one is such determination of the mixtures of two substances of different specific weights used in the tests not possible. The strength of the diffraction of X-rays was therefore used to determine the direct one Relationship with the degree of crystallization. A higher one X-ray diffraction value shows a higher degree of crystallization on, but this is only a relative indication. The Eftallsnkel that the greatest amount of X-ray diffraction was 10.7 ° for nylon 12 and 10.6 ° for nylon 11.

BATH

009840/1884

Various adhesives were made by mixing crystalline linear polyamides and amorphous or semi-crystalline ones Polyamides produced in various proportions and the physical properties and the The strength of the bond of this adhesive is then measured. The results are given in Table 2.

These results show that the strength of the Bonding at a weight ratio of the crystalline linear polyamide to amorphous or semi-crystalline polyamide of about 95 * 5 µm and the range * in which high values for the strength of the glue point increase are in the range between 99J1 and 90:10. While the melt viscosity and the degree of crystallization decrease as the weight fraction of the crystalline linear polyamide becomes less than 8o #, the adhesive may crystallize during cooling after the rapid » Bonding does not progress, so that the bonding obtained thereby becomes poor.

To the essence and the usefulness of the invention yet To make this stand out more clearly, some practical examples will be described, which include both the production

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40/1884

BATHROOM QRiQlNAL

of the adhesive, its use in quick bonding and Describe the strength of the bond, the preferred exemplary embodiments mentioned being merely exemplary are to be understood and not to limit the scope of the invention.

example 1
} 95 parts of nylon 610 (relative viscosity 2.8

at a concentration of 1% in 98 # iger more concentrated Sulfuric acid) forms as a crystalline linear polyamide with 5 parts Versalon 1165, which is the amorphous polyamide, the glue in which the parts are mixed together in a solid state and then placed in an extruder Heat can be kneaded, which has a nylon screw of 40mm diameter and 1120mm effective length. During this hot kneading, the temperature is 257 ° C. with a screw speed of 50 revolutions per minute.

The pellets obtained in this Wejae were in a 50 micron thick film using a film former converted, which has an extruder with a nylon screw of 50 mm diameter and 600 mm effective length and a T-shaped fitting with a width of 0.5 mm

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and 10 mm in length. The temperature is on the fitting ° C at a screw speed of 40 revolutions / min.

The adhesive surfaces of the metal plates, the high-gloss panels were, which were coated with a Phänolharz, were heated to about 250 ⁰ C, and pieces of the film, the width was now cut into a strip of 5 were pressed onto the hot adhesive surface and then during 200 ms cooled. The Kleto surfaces of the metal plates, which were coated in this way with the adhesive, were then heated again to about 250 ° C., then pressed together and cooled for 50 ms. The shear strength obtained with this bond was 330 kg / cm. The physical properties of the adhesive used are a boiling point of 225 ° C, a crystallization temperature of 195 ° C, a melt viscosity at 240 ° C of 5000 poise and an X-ray diffraction strength of 170 counts per second.

Example 2

94 parts of nylon 12 (relative viscosity 265 at a 1 # concentration in 98 # sulfuric acid) the crystalline linear polyamide, which with 6 parts

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Amilan CM 4000 , an amorphous polyamide, is mixed in the solid state of both, whereby the substances are then hot kneaded with the same extruder as in Example 1 under the kneading conditions of 200 C press component and '} ö revolutions per minute screw speed »

The se-en ei'iialte P ^ J.eis of the adhesive are zuv using the same extruder to form a film to a 50 micron thick FIIA as in Example 1 at a · press temperature of 200 "C and a: · '3ohraubendrehzahl of 40 revolutions converted per minute »

Next, the surfaces of various steel plates * !, which are to be connected to one another (see Table 5), are ^{heated to about 2JO 0} C and covered with strips of 5 mm width of the adhesive film, whereupon this film is pressed on and cooled for 200 ms.

Each thus provided with an adhesive film bonding surface is again heated to 220 ⁰ C and then overlapped with the corresponding counter-face pressed together and cooled for about 70 ms. The strength of the

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Bonding (shear strength in Kg / cm) and adhesive joints, which are made with only nylon 12 as an adhesive on the same metal plates are listed in table j5.

The essential physical properties of the adhesive prepared as described were
a melting point of 182 ⁰ C, a crystallization temperature of 152 ° C, a melt viscosity at 220 ⁰ C of
18,000 poise, and an X-ray diffraction strength of 175 counts per second.

00984.0 / 188

BLACKBOARD

Bonded metal plates

Steel plate tin-plated plate

tin-plated plate with phenolic lacquer coating

Aluminum plate

chromic acid treated plate

Treated with chromic acid

and coated with phenolic varnish

plate

Shear strength

Inventiveness
moderate glue
(ice cream 2) Nylon 12
alone & fs *
O 230 I85 CD 180 105 CO 28O 200 150 100 260 210 330 230

Claims (1)

.PATENT CLAIMS 1. Glue for gluing metal plates together, characterized in that 1) a crystalline linear polyamide with relative Viscosity of at least 1.5 at 1 concentration in 98% sulfuric acid and 2) an amorphous or semi-crystalline polyamide, the type of which is different from that mentioned under 1) Polyamide distinguishes mixed together in a weight ratio of 99: 1 to 90 * 10 will. 2. Adhesive composition according to claim 1, characterized in that the linear polyamide (1) is a member of the group of nylon 6, nylon 11, nylon 12, nylon 66 and nylon 610 and the amorphous polyamide (2) is a member of the group consists of (2-1) resins which are obtained from the condensation polymerization of an amino component with at least one member of the group consisting of polyalkylene · polyamides and alkylene diamides with an acid component, the -58 QG9840 / 1884 at least one member from the group consisting of polymer aliphatic acids, which arise from the drying or semi-drying of oils, and aliphatic acids, and that the semi-crystalline polyamide (2) is a member from the group consisting of Gopoi! amides, (2 « <:) is that / isation from the Ko ndensationspolynier a oopoliiuerisierbaren mono- ψ merisahen mixture with members arises which of the group of hexamethylenediamine, adipic acid, "sebacic acid, 6-amino-caproic acid, ii-AnrUiounclecanon- · acid and 12" A mi no laur in acid belong to. J. A method for producing an adhesive according to a of claims 1 or 2, characterized in that a crystalline linear polyamide with a relative viscosity of at least 1.5 in a state of imager concentration k in 98 $ sulfuric acid and an amorphous or semi-crystalline Polyamide, which differs in type from the crystalline polyamide, in a weight ratio of 99: 1 mixed together until 90:10. 4. The method according to claim J, characterized in that that the crystalline and amorphous or semicrystalline polyamide are mixed together in that the - 39 00984 0/1884 Polyamides are dissolved in a solvent in which both polyamides are easily soluble by kneading both polyamides between heated rollers in a stream of nitrogen or by hot kneading both polyamides using a screw press. 5 · Process for the production of an adhesive connection of a first surface of a first metal plate with a second surface of a further metal plate by the following steps: cleaning the first and second Surface; Coating at least one of the surfaces with a coating of the adhesive, which by mixing 1) a crystalline linear polyamide with a relative viscosity of at least 1.5 at 1 # Lger concentration in 98 # iger sulfuric acid and one Polyamide is obtained, which is selected from a group of amorphous or semi-crystalline polyamides, which are of their type to differ from the crystalline polyamide, the mixture in a weight ratio between 99: 1 and 90:10 is made; overlapping of the surfaces with the interposition of the adhesive layer, heating of the layer and the surfaces to a temperature above the melting point the crystalline linear polyamide; and after the temperature has been reached, the surfaces are pressed together during a Time span from 30 to 200 msec, making the panels firmly together are glued. 0 0984 0/1 8 8