DE20022805U1 - Circuit board assembly - Google Patents

Circuit board assembly

Info

Publication number
DE20022805U1
DE20022805U1 DE20022805U DE20022805U DE20022805U1 DE 20022805 U1 DE20022805 U1 DE 20022805U1 DE 20022805 U DE20022805 U DE 20022805U DE 20022805 U DE20022805 U DE 20022805U DE 20022805 U1 DE20022805 U1 DE 20022805U1
Authority
DE
Germany
Prior art keywords
circuit board
cam
insulating substrate
board assembly
substrate plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE20022805U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Wiring Systems Ltd
Original Assignee
Sumitomo Wiring Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP11046194A external-priority patent/JP2000245034A/en
Application filed by Sumitomo Wiring Systems Ltd filed Critical Sumitomo Wiring Systems Ltd
Publication of DE20022805U1 publication Critical patent/DE20022805U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H01R9/22—Bases, e.g. strip, block, panel
    • H01R9/24—Terminal blocks
    • H01R9/2458—Electrical interconnections between terminal blocks
    • H01R9/2466—Electrical interconnections between terminal blocks using a planar conductive structure, e.g. printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/091—Locally and permanently deformed areas including dielectric material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2072—Anchoring, i.e. one structure gripping into another

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Description

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically  

Der Beschreibungstext wurde nicht elektronisch erfaßtThe description text was not recorded electronically

Claims (9)

1. Schaltungsplattenanordnung (11) umfassend eine isolierende Substratplatte (12) und eine Sammelschiene (13, 14, 15), die auf einer oberen Fläche davon angeordnet ist, zumindest einen Nocken (18), der von der isolierenden Substratplatte hervorsteht, wo­ bei der Nocken einen erweiterten Abschnitt (19) aufweist, der an die isolierende Sub­ stratplatte angrenzt, zumindest eine Einsetzöffnung (21) in der Sammelschiene, wobei sich der Nocken durch die Einsetzöffnung erstreckt und der Nocken so angepasst ist, um zu dem erweiterten Abschnitt gedrückt zu werden, so dass er einen Teil der Sub­ stratplatte bedeckt, wodurch die Sammelschiene an der isolierenden Substratplatte be­ festigt wird, dadurch gekennzeichnet, dass der Nocken (18) von einem Hohlraum (17) in der isolierenden Substratplatte (12) umgeben ist.A circuit board assembly ( 11 ) comprising an insulating substrate board ( 12 ) and a busbar ( 13 , 14 , 15 ) disposed on an upper surface thereof, at least one cam ( 18 ) protruding from the insulating substrate board, where at Cam has an extended portion ( 19 ) adjacent to the insulating substrate plate, at least one insertion opening ( 21 ) in the busbar, the cam extending through the insertion opening and the cam being adapted to be pressed to the expanded portion , so that it covers part of the substrate plate, whereby the busbar is fastened to the insulating substrate plate, characterized in that the cam ( 18 ) is surrounded by a cavity ( 17 ) in the insulating substrate plate ( 12 ). 2. Schaltungsplattenanordnung nach Anspruch 1, bei der ein oberes Ende des erweiterten Abschnitts (19) koplanar mit der oberen Fläche der isolierenden Substratplatte (12) ist.2. The circuit board assembly of claim 1, wherein an upper end of the extended portion ( 19 ) is coplanar with the upper surface of the insulating substrate plate ( 12 ). 3. Schaltungsplattenanordnung nach Anspruch 1, bei der sich der erweiterte Abschnitt (19) innerhalb des Hohlraums (17) befindet.3. The circuit board assembly of claim 1, wherein the expanded portion ( 19 ) is within the cavity ( 17 ). 4. Schaltungsplattenanordnung nach Anspruch 1, bei der sich der erweiterte Abschnitt (19) in einer der Unterseite des Hohlraums (17) abgewandten Richtung verjüngt.4. The circuit board arrangement as claimed in claim 1, in which the expanded section ( 19 ) tapers in a direction facing away from the underside of the cavity ( 17 ). 5. Schaltungsplattenanordnung nach Anspruch 4, bei der es einen kegelförmigen Ab­ schnitt des Nockens angrenzend an das körperferne Ende des Nockens (18) von dem erweiterten Abschnitt (19) entfernt gibt, wobei sich der kegelförmige Abschnitt zu dem körperfernen Ende hin verjüngt.5. The circuit board assembly of claim 4, wherein there is a tapered portion of the cam adjacent the distal end of the cam ( 18 ) from the expanded portion ( 19 ), the tapered portion tapering toward the distal end. 6. Schaltungsplattenanordnung nach Anspruch 5, bei welcher der Vorsprung (18) einen zentralen Abschnitt zwischen dem kegelförmigen und dem erweiterten Abschnitt (19) aufweist, wobei der zentrale Abschnitt einen mittleren Durchmesser (L1) hat, die Einsetzöffnung (21) einen Einsetzdurchmesser (L4) hat, der im wesentlichen dem mittle­ ren Durchmesser entspricht.The circuit board assembly of claim 5, wherein the protrusion ( 18 ) has a central portion between the tapered and enlarged portions ( 19 ), the central portion having an average diameter (L1), the insertion opening ( 21 ) an insertion diameter (L4 ) which essentially corresponds to the mean diameter. 7. Schaltungsplattenanordnung nach Anspruch 6, bei der zwischen dem mittleren Durch­ messer (L1) und dem Einsetzdurchmesser (L4) ein mittlerer Spalt vorhanden ist, wobei der mittlere Spalt ausgefüllt ist, wenn der Nocken (18) zu dem erweiterten Abschnitt (19) hin gedrückt wird.7. A circuit board assembly according to claim 6, wherein there is a central gap between the average diameter (L1) and the insertion diameter (L4), the central gap being filled when the cam ( 18 ) towards the expanded portion ( 19 ) is pressed. 8. Schaltungsplattenanordnung nach Anspruch 7 mit mehreren nach oben stehenden Rip­ pen (16) auf der oberen Fläche der isolierenden Substratplatte (12) angrenzend an einen Teil eines Umfangs der isolierenden Substratplatte, einen Umfangsspalt zwischen dem Umfang der Sammelschiene (13, 14, 15) und den Rippen (16), der im wesentlichen dem mittleren Spalt entspricht.8. The circuit board arrangement according to claim 7 with a plurality of upstanding rips ( 16 ) on the upper surface of the insulating substrate plate ( 12 ) adjacent to a part of a circumference of the insulating substrate plate, a circumferential gap between the circumference of the busbar ( 13 , 14 , 15 ) and the ribs ( 16 ) which substantially corresponds to the central gap. 9. Schaltungsplattenanordnung nach Anspruch 8, bei der die Rippen (16) sich über die Sammelschiene (13, 14, 15) hinaus erstrecken und der verjüngte Abschnitt sich über die Rippen hinaus erstreckt.9. The circuit board assembly of claim 8, wherein the ribs ( 16 ) extend beyond the busbar ( 13 , 14 , 15 ) and the tapered portion extends beyond the ribs.
DE20022805U 1999-02-24 2000-02-24 Circuit board assembly Expired - Lifetime DE20022805U1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP11046194A JP2000245034A (en) 1999-02-24 1999-02-24 Assembly of wiring board
EP00103890A EP1039581A3 (en) 1999-02-24 2000-02-24 Circuit board assembly

Publications (1)

Publication Number Publication Date
DE20022805U1 true DE20022805U1 (en) 2002-07-18

Family

ID=26070592

Family Applications (1)

Application Number Title Priority Date Filing Date
DE20022805U Expired - Lifetime DE20022805U1 (en) 1999-02-24 2000-02-24 Circuit board assembly

Country Status (1)

Country Link
DE (1) DE20022805U1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10246113A1 (en) * 2002-10-02 2004-04-22 Siemens Ag cover
DE102006019428B4 (en) * 2005-09-28 2010-04-15 Mitsubishi Denki K.K. Intake air control device for an internal combustion engine
WO2024125710A1 (en) * 2022-12-15 2024-06-20 Schaeffler Technologies AG & Co. KG Connector module comprising a lead frame, actuator, and method for assembling the connector module

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10246113A1 (en) * 2002-10-02 2004-04-22 Siemens Ag cover
US7782044B2 (en) 2002-10-02 2010-08-24 Siemens Aktiengesellschaft Cover
DE102006019428B4 (en) * 2005-09-28 2010-04-15 Mitsubishi Denki K.K. Intake air control device for an internal combustion engine
DE102006019428C5 (en) * 2005-09-28 2014-12-11 Mitsubishi Denki K.K. Intake air control device for an internal combustion engine
WO2024125710A1 (en) * 2022-12-15 2024-06-20 Schaeffler Technologies AG & Co. KG Connector module comprising a lead frame, actuator, and method for assembling the connector module

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 20020822

R150 Term of protection extended to 6 years

Effective date: 20030320

R151 Term of protection extended to 8 years

Effective date: 20060224

R152 Term of protection extended to 10 years

Effective date: 20080313

R071 Expiry of right