DE19931774A1 - Micro punching tools, micro punching device and method for manufacturing micro punching tools and hold-down devices - Google Patents

Description

The invention relates to a micro punching tool according to the preamble of Claim 1, a hold-down device according to the preamble of Claim 3, a micro punching device according to the preamble of Claim 8, as well as processes for the production of Micro punching tools and hold-down devices according to the generic terms of Claims 12, 14 and 18.

Stamping processes are used to manufacture a wide variety of small components Bridge widths of ≦ 0.2 mm used on a large scale, e.g. B. in the watch and electronics industry. Generally shows in many applications, such as. B. Small relays or lead frames have a clear tendency towards progressive Miniaturization.

In the case of webs of small width, stamping structures are usually used Sequential cutting tools manufactured in several stations. This allows Avoid deformation of the workpiece as far as possible. The production For example, lead frames require the cutting operations to be disassembled in many individual steps, so that the tool length and the demands on the Tool tolerances increase significantly. The tool has in present case a total length of 2.4 m. The lead frame must therefore be manufactured in succession on three punching machines. The currently at The high number of precision achievable punching structures is crucial  the positioning steps in the tool and the resulting uneven cut gap distribution limited.

When cutting sheet metal with a thickness of less than 1 mm In addition, so-called hold-down plates are used, which are used to fix the Stamping tape during the cutting process and as additional guidance of the Serve cutting punches. This will prevent unwanted deformations of the Stamped parts further reduced. The metal hold-down plate is usually led over the columns of the tool frame and over Coil springs supported on the upper tool.

The decisive factor for the dimensional accuracy of the punching structures is in addition to the Deformation of the punched tape the contour and shape accuracy of the active Cutting elements. Typically, inserts are made with simple Geometries by wire EDM with a shape and dimension deviation up to manufactured down to a 1 µm, with ground carbide inserts in the Insert are used to increase the service life of the tool. Cutting punches are also by means of EDM processes, but also by Contour grinding, can be manufactured with the same precision. One of The main disadvantage of conventional punching tools is that this only Cutting gaps in the range of 2 to 4 µm can be realized. At uneven cutting gaps caused by shape and size deviation can be caused, especially the stamp wear on one side stronger.

In addition, the precision of the cut part with the secondary cutting tool but also on the accuracy of the machine-controlled tape feed certainly. The most commonly used method for exact Belt positioning in the tool is the so-called catch pin method.  

Another major disadvantage of conventionally made Sequential cutting tools is their size. First, is the tool length often very large due to a large number of subsequent cutting stations. To the others, the height of the tools is essentially due to the metallic Hold-down determined. Due to these requirements, the tools are very good heavy, the mass to be moved during the cutting process is high and it must have a large stroke in relation to the height of the stamping structure to be punched. The punching machine requirements regarding Tool installation space and movement accuracy are very high.

The choice of materials for punching tools depends crucially on the Type and thickness of the materials to be cut and of the required Service life from. As tool materials for the active elements from Cutting tools are preferred cold work steels, hard metals and powder-metallurgically manufactured high-speed steels with hardnesses from 60 to 70 HRC or 1000 to 1800 HV used. Hard metals stand out against each other Cold work steels are characterized by less wear. The development of tougher hard metals also enabled the production of very fine Cutting elements. Therefore, especially in areas with high demand on components with ever smaller critical dimensions, such as in electronics, cutting parts often made of hard metals. Next ordinary tool steels and hard metals can also be found Tool steels produced using powder metallurgy. You own one very fine-grained structure with an extremely even distribution of Alloy components that allow very long tool life.

A coating of the active cutting elements increases the service life considerably and is widely used in industrial practice. With a hard material Coating, such as B. titanium nitride, titanium carbonitride or chromium nitride increases wear resistance and surface hardness. As Coating processes are processes from the group of the CVD (Chemical  Vapor Deposition) and the PVD process (Physical Vapor Deposition) applied, the PVD process due to the process-related lower substrate temperatures are suitable for a larger number of materials. With standard processes, all metallic materials with layer thicknesses of 1 to 4 µm coatable.

In summary, further miniaturization of stamped components essentially stands in the way of the following disadvantages of the methods currently used for the production of stamping tools:

• - The lack of accuracy of the cutting tools due to Manufacturing tolerances of the processes used,
• The tolerances of the relative positioning of two stamps to one another,
• - the lack of accuracy of the relative positioning of cutting and stamp plate within a sequential cutting station, e.g. B. conditional by the compared to the height of the punching structure due to the Niederhalter's necessary large tool stroke and a large one Tool mass,
• - The lack of possibility to manufacture complex Cutting structures require a very large number of Follow-up cutting stations,
• - and the lack of accuracy of the relative positioning of the Cutting tools between successive cutting stations.

The object of the invention is to provide micro punching tools, the one higher accuracy and a higher integration density of cutting structures have, so that the number of cutting stations in one  Micro punch device can be reduced. As part of this task also a micro punching device can be provided which does not have the disadvantages of the prior art. It is also an object of the invention to To provide methods for producing such micro punching tools.

This task is solved with a micro punching tool, the stamp and stamp plate are made in one piece with microtechnical processes and the stamp micro-cutting structures in the submillimeter range exhibit.

The advantage of the one-piece is that on the one hand the Positioning accuracy of the stamp to each other and on the other hand the density of the Cutting structures is much higher than that of conventional ones Punching tools is the case. This is due to the fact that none Space consuming fasteners are required to place the stamp in to attach the stamp plate. This makes it possible to cut in structures to arrange the two spatial directions next to each other almost arbitrarily. In addition, the total weight of the stamp plate and stamp is the one-piece design less so that the energy expenditure for moving of the micro punching tool is lower, which in turn increases the accuracy of the relative positioning of cutting and stamping plate increased.

The micro-cutting structures can be manufactured with higher accuracy because microtechnical processes are used in which form and dimensional deviations are in the submicron range.

Preferably, at least some of the micro-cutting structures in the Stamp plate level on free-form surfaces and / or undercuts. Such complex structures have previously had to be in structures without Undercut or divided into simpler structures that again had to be distributed over several subsequent cutting stations. Also  this measure according to the invention contributes to a high density of Cutting structures and thus a reduction in the overall size Micro punch device at.

Micro cutting structures produced with microtechnical processes in the Due to the process, the submillimeter range is only a small height, which was previously considered a disadvantage. However, the low overall height at the same time the advantage that the masses to be moved are significantly smaller and that the stroke length is shorter, which in turn reduces the cutting accuracy elevated.

The low height of the stamp or micro-cutting structures requires special hold-down devices. Conventional hold-downs, for example made of Metal plates can not be used because they are one Must have minimum thickness and therefore the stamp does not hold down can penetrate.

According to the invention, the hold-down device has elastic polymer material. In In a preferred embodiment, the hold-down consists entirely of elastic polymer material.

The hold-down device preferably consists of one on the stamp plate applied elastic polymer layer. The elastic polymer layer can applied by various known methods, e.g. B. by Dip or spray on. In particular come as elastic polymers Elastomers in question.

According to a further embodiment, the hold-down consists of a elastic polymer plate, which can also be thicker than the height of the Stamp. When punching this polymer material is compressed, which  the cutting path specified by the height of the stamp is only slight is reduced.

The elastic polymer plate is preferably attached to the stamp plate. But there is also the possibility of attaching the polymer plate to other components attach the punching device, such as. B. on the stamp plate load-bearing base plate or on the guide columns. The polymer plate can glued, screwed or clamped. Other Fastening options are also conceivable.

The hold-down device can have the same micro openings as that Insert. In this case it is advantageous to use the elastic polymer plate by means of a stamp plate provided with stamps and a cutting plate to punch out.

According to a further embodiment, an elastic polymer can be used directly on the stamp plate by dipping, spraying or pouring be applied. The hold-down can in this case on the Stamp plate remain.

However, it is not absolutely necessary that the elastic polymer plate, which too breakthroughs belonging to the microcutting structures. It can simplified openings in the elastic polymer plate are also provided his.

The use of polymers for the hold-down is reduced advantageously the weight of the moving masses in one Micro punching device, so that the accuracy of the relative Positioning of cutting and stamping plate is increased. As preferred Materials come from thermoplastic elastomers, rubbers or soft elastic foams in question. To the thermoplastic elastomers  count z. B. styrene-butadiene copolymers, polyamides, polyetheramides, Polyetheresteramides or polyether block amides and polyurethanes.

Preferred rubbers are chloroprene rubber, natural rubber, Fluororubber, silicone rubber or polyurethane rubber.

As soft elastic foams such. B. foams with ingredients made of polyethylene (PE), polyvinyl chloride (PVC) or polyurethane (PU) be used.

A micro punching device according to the invention is characterized in that both the stamp and stamp plate and the cutting plate are in one piece, where stamp, stamp plate and cutting plate according to microtechnical Processes are manufactured and the stamp micro-cutting structures and the Cutting insert have micro breakthroughs in the submillimeter range. With the one-piece cutting plate, the usual cutting inserts are not required.

The stamp / stamping plate and the cutting plate are preferably included same microtechnical process, which is the accuracy of two interacting punching tools increased. The width of the Cutting gap can be further reduced, which in turn Quality of punched structures improved.

A cutting station preferably has at least one stamp plate. It is possible, a modular system with micro cutting structures build up, with the stamp plates only in the desired arrangement must be put together. This is with regard to simple structures advantage of flexibility, but this modular structure is supported by a Impaired positioning accuracy bought.  

For highly complex structures, it is therefore advantageous if the Stamp plate several groups of stamps for several cutting stations wearing. The positioning accuracy is clear in this embodiment elevated.

The process for producing one-piece micro punching tools such as Cutting plate and stamp plate with stamps is according to a first one Alternative characterized in that by means of a Deep structuring process is a negative form of the micro punching tool with micro cutting structures or micro breakthroughs in the submillimeter range is made of resist material that the negative form galvanically Forming a positive shape is molded using a hard alloy and that the resist material from the positive form to form the stamping tool Will get removed. Shape and positioning of the micro cutting structures thus determined by the deep structuring process, in particular Depth lithography and laser structuring methods in question come.

After removing the resist material, it is advantageous to use the punch to undergo a grinding process, whereby excess material is removed can be. The main purpose of regrinding is, however, that Sharpen cutting edges on the punches or on the cutting plate.

Another alternative to making one piece Micro punching tools is that by means of a Deep structuring process with a positive form of the punch Micro cutting structures or micro breakthroughs in the submillimeter range Resist material is produced that this positive form for producing a Lowering electrode is galvanically molded and that by means of the lowering electrode erosion or recesses in a semi-finished product by means of EDM Formation of the punch are introduced.  

Although this process involves a further process step, there is thereby the possibility of producing the punching tool from materials that cannot be used for a galvanic impression. It will therefore preferably a semi-finished product made of hard metal or steel.

The positive mold is preferably used to produce the lowering electrode Copper electroplated.

Another process alternative for the production of a cutting insert exists in that a stamp plate with micro cutting structures in Submillimeter range is provided with at least one separation layer and then this coated stamp plate using a hard alloy is electroplated. Preferably, the stamp plate after a of the previously described methods.

The cutting gap can be adjusted via the thickness of the separating layer. The However, the cutting gap must not be so small that the stamp and Can no longer separate the insert. The advantage of this The method also consists in that a much higher precision of the complementary micro cutting structures or micro breakthroughs achieved can be.

If the micro-cutting structures have small aspect ratios, preferably to form the separating layer, the stamp plate with nickel anodized. This creates a separation layer in the nanometer range receive.

If the micro-cutting structures of the stamp have high aspect ratios have, which should preferably be understood to mean ratios greater than 5 separating layers made of wax or polymer material are advantageous. This Layers can be sprayed on, for example by means of immersion processes  or can also be applied in the form of shrink films. Preferably an applied wax film is solidified by evaporation.

Since these materials are not used as a starting layer for those to be connected Electroplating process are suitable, one is on this wax or polymer layer Metal layer applied as the starting layer for the electroplating process. This It can be applied by vapor deposition, sputtering or spraying. The Metal layer preferably consists of nickel, copper, silver or gold.

After electroplating, it is recommended to take the composite out Cutting plate and stamp for easier cutting to heat or with Treat solvents or ultrasound.

In the case of galvanic molding, a layer is preferably first made from a Hard alloy applied and then this layer by galvanic Deposition of a softer material, such as Cu and / or Ni, back-fed.

The preferred hard alloy is nickel-iron, nickel-tungsten, cobalt Tungsten or nickel-cobalt are used.

The punching tool or at least the micro-cutting structures can additionally be provided with a hard material coating to the To minimize wear of the cutting edges on the punch and cutting plate. Titanium nitrite (TiN), titanium carbonitrite (TiCN), chromium nitrite are suitable for this (CrN), titanium carbide (TiC), titanium aluminonitrite (TiAlN).

Exemplary embodiments of the invention are described below the drawings explained in more detail.  

Show it:

Fig. 1a-c, a micro-punching device in cross-section at different stages of the punching operation,

Fig. 2 is a punched part in the electronics sector,

Fig. 3a shows the bottom view of a punch plate having punches for three cutting stations in a perspective view;

FIG. 3b is a representation of the cutting sequence with that shown in Fig. 3a shown stamp plate,

Fig. 4 is a representation of the cutting sequence with a stamp plate according to the prior art,

FIGS. 5a-c is a representation of the entire cutting sequence with conventional tool technology for the production of the component from Fig. 2,

Fig. 6, the entire cutting sequence with an inventive micro-punching device for producing the component of Fig. 2,

Fig. 7 shows a die plate and a hold-down device in a perspective view;

Fig. 8 is a schematic representation of a method for producing a cutting plate according to a first embodiment,

Fig. 9 is a schematic representation of a method for producing a stamp plate according to another embodiment,

Fig. 10 is a schematic representation of a method for producing a stamp plate according to another embodiment,

Fig. 11 is a schematic representation of a method for producing a cutting plate according to another embodiment,

Fig. 12 is a perspective bottom view of a stamp plate to a further embodiment of producing a cutting insert is shaped according to, and

FIG. 13 shows a schematic illustration of the method steps for explaining the method shown in FIG. 12.

In FIG. 1, a micro-punching device is shown in vertical section. The micro punching device has an upper tool 9 a and a lower tool 9 b, which are connected to one another via guide columns 3 . The band 10 to be punched out is located between the two tools 9 a, 9 b.

The upper tool 9 a has an upper adapter plate 1 and an upper base plate 2 , in which the guide columns 3 are attached. The guide columns 3 are guided in ball guides 4 .

Arranged on the underside of the upper base plate 2 is a one-piece stamp plate 40 with stamps 41 which have micro-cutting structures in the submillimeter range. Furthermore, a hold-down 20 made of an elastic polymer material is glued to the stamp plate 40 . The thickness of the hold-down device 20 can be greater than the height of the stamp structures 41 because the hold-down device is compressed during the punching process.

The lower tool 9 b of the micro-punching device is constructed in accordance with the upper tool 9 a and has a lower adapter plate 8 and a lower base plate 7 , which is fastened on the lower adapter plate. The base plate 7 carries a cutting plate receptacle 31 on which the cutting plate 30 is fastened. The stamp plate and cutting plate are fastened using upper and lower fastening screws 5 and 6 .

The cutting plate 30 has micro breakthroughs 32 . The insert holder 31 , the lower base plate 7 and the lower adapter plate 8 also have conically shaped or enlarged openings in order to be able to remove the slug, that is to say the part cut out from the band 10 .

In Fig. 1b, the micro-punching device can be seen in the lowered position at the beginning of the stamping process. The hold-down device 20 is already slightly compressed. In FIG. 1 c, the punches 41 are immersed in the band 10 for cutting out.

In FIG. 2 a punched member 11 is shown as it is used for example in the electronics field. In order to achieve the structure shown, a plurality of punches 41 are necessary, which have so far been distributed over a total of 18 cutting stations according to FIGS. 5a-c using conventional tool technology and only 6 cutting stations according to the inventive tool technology according to FIG . The first three cutting stations of the tool technology according to the invention for producing the first three cutting sequences in FIG. 6 are shown in FIG. 3a, and FIG. 3b shows the cutting sequence punched herewith. In FIG. 3a, the stamps are 41 to a total of three die arrays 42 a, b and c corresponding to the three envisaged cutting stations summarized. In FIG. 3b, the faces 43, 43 ', 43 "of the respective stamp of the groups 42 a, b and c shown hatched and the punched out by the respective preceding cutting station faces 11' are shown without hatching. It is clear to see, that the micro-cutting structures can also have undercuts 72 formed perpendicular to the cutting direction, and the micro-cutting structures can also be designed as free-form surfaces.

The stamp density is significantly higher compared to a conventional arrangement of stamps shown in FIG. 4. The areas corresponding to the stamps are also hatched.

In FIGS. 5a-c, this is shown again in full using the specific example of FIG. 2. In FIGS. 5a-c, the entire cutting sequence is to be seen with a conventional tool, the free areas represent the already punched surfaces and the shaded areas indicate the punch faces of the respective subsequent cutting stations. During the cutting sequence comprises mm according to FIG. 5, a length of 508, the cutting sequence with an inventive micro-punching device according to the Fig. 6 significantly reduced and amounts to only 172 mm. This is due to the increased stamp density that can be achieved due to the one-piece design of the stamp plate and stamp. Only two punching operations with the stamp plate shown in FIG. 3a are required.

In FIG. 7, a die plate 40 with the punches 41 and the corresponding micro-cutting structures 70 is shown in perspective bottom view. The associated hold-down 20 in the form of an elastomer plate 22 has openings 21 which correspond to the micro openings 32 of the associated insert. Such an elastomer plate 22 can, for. B. by punching by means of the stamp plate 40 with the stamps 41 and the cutting plate.

In FIG. 8, a first embodiment of the manufacturing method is illustrated a micro punching tool in form of a cutting plate 30. Resist material 52 is located on a substrate 53 , over which a mask 51 with microstructures 57 is arranged. The resist material 52 is irradiated from above by means of X-ray radiation or UV radiation, which is identified by the arrows 50 . Due to the microstructures 57 of the mask 51 , curing takes place only in certain areas, so that the remaining material can be removed. A negative mold 54 of the punching tool is thereby produced. This negative mold 54 is then electroplated, whereby an electroplating body 55 or 56 is formed when the remaining resist material 52 and the substrate 53 have been removed. In a further processing step, excess material is removed, as a result of which the micro openings 32 are completely exposed and the corresponding cut edges 34 are sharpened.

FIG. 9 shows a further production method that is used to produce a stamp plate 40 with stamps 41 . A substrate 53 with resist material 52 is also assumed, over which a mask 51 'with microstructures 57 ' is positioned. Irradiation by means of X-ray or UV radiation 50 , removal of the resist structures and electroplating are also carried out here to produce a galvanic body 55 ', from which the stamp plate 40 with the dies 41 is finally produced after the remaining resist material 52 has been removed and the substrate 53 has been removed becomes. The stamps are then ground for sharpening.

Another method is shown in FIG. 10, in which a lowering electrode 60 is first produced in an intermediate step. Starting from a substrate 53 with resist material 52 and a mask 51 arranged above it and the irradiation by X-ray or UV radiation 50 , a positive mold 59 of the stamp plate is first produced, which is electroplated to produce a galvanic body 60 . After the resist material 52 has been removed, a lowering electrode 60 is obtained , by means of which the stamp plate 40 with the stamps 41 is produced from a semifinished product 62 by EDM. The spark gap is identified by the reference number 61 .

FIG. 11 shows a further production method with which a cutting insert 30 is produced by means of die sinking and a sinking electrode 60 '. The method corresponds to the method according to FIG. 10.

In Figs. 12 and 13, another manufacturing method is shown. First, a stamp plate with stamps 41 is produced in accordance with one of the previously described methods, to which a separating layer 33 is subsequently applied. An electroplating body 55 is in turn produced by means of galvanic molding, which then leads through further processing to a cutting plate 30 with openings 32 , as can be seen in FIG. 13.

It can also be seen from the methods already described that the Stamp plate also by galvanic molding from the cutting plate can be manufactured.  

Reference list

1

upper adapter plate

2nd

upper base plate

3rd

Guide pillar

4th

Ball bearing

5

upper fastening screw

6

lower fastening screw

7

lower base plate

8th

lower adapter plate

9

a upper tool

9

b lower tool

10th

tape

11

punched component

11

'' punched out areas

20th

Hold-down

21

Breakthroughs

22

Elastomer sheet

30th

Insert

31

Insert holder

32

Micro breakthrough

33

Interface

34

Cutting edge

40

Stamp plate

41

stamp
42a, b, c stamp group

43

Area of the stamp of the respective subsequent cutting station

43

',

43

"Area of the stamp of the respective subsequent cutting station

50

UV or X-rays

51

,

51

'Mask

52

Resist material

53

Substrate

54

negative form

55

,

55

'' Electroplating body

56

Positive form

57

,

57

'' Microstructure

59

Positive form

60

,

60

'' Lowering electrode

61

Spark gap

62

Workpiece

70

Micro punch structure

72

Undercut

Claims (26)

1. Micro punching tool with stamping stamp plate, characterized in that stamp ( 41 ) and stamp plate ( 40 ) are made in one piece with microtechnical processes and that the stamp ( 41 ) have micro-cutting structures ( 70 ) in the submillimeter range. 2. Micro punching tool according to claim 1, characterized in that at least some of the micro-cutting structures ( 70 ) in the stamp plate plane have free-form surfaces and / or undercuts ( 72 ). 3. hold-down device for a punching device with a stamp plate, characterized in that it has elastic polymer material. 4. hold-down device according to claim 3, characterized by one on the Stamp plate applied polymer layer. 5. hold-down device according to claim 3, characterized in that the hold-down device ( 20 ) is an elastic polymer plate ( 22 ). 6. hold-down device according to claim 5, characterized in that the polymer plate ( 22 ) on the stamp plate ( 40 ) is attached. 7. hold-down device according to one of claims 3 to 6, characterized characterized in that it is made of thermoplastic elastomers, Rubbers or flexible foams.   8. Micro punching device with at least one cutting station, which has a stamping plate, stamp, cutting plate and optionally hold-down device, characterized in that
that both stamp ( 41 ) and stamp plate ( 40 ) and the cutting plate ( 30 ) are in one piece, stamp ( 41 ), stamp plate ( 40 ) and cutting plate ( 30 ) being produced by a microtechnical method, and
that the punches ( 41 ) have micro cutting structures ( 70 ) and the cutting plate ( 30 ) have micro openings ( 71 ) in the submillimeter range. 9. The device according to claim 8, characterized in that a cutting station has at least one stamp plate ( 40 ). 10. The device according to claim 8, characterized in that a stamp plate ( 40 ) carries several groups ( 42 a, b, c) of stamps ( 41 ) for several cutting stations. 11. Device according to one of claims 8 to 10, characterized in that the hold-down device ( 20 ) comprises elastic polymer material. 12. A method for producing one-piece micro-punching tools, such as cutting plate and stamping plate with stamps, characterized in that
that a negative form of the micro punching tool with micro cutting structures or micro breakthroughs in the submillimeter range is produced from resist material by means of a deep structuring process,
that the negative form is electroplated to form a positive form by means of a hard alloy and
that the resist material is removed from the positive mold to form the punch. 13. The method claim 12, characterized in that according to the Remove the resist material at least in the area the cutting edge is ground. 14. A method for producing one-piece micro-punching tools, such as cutting plate and stamping plate with stamps, characterized in that
that a positive form of the punching tool with micro-cutting structures or micro-openings in the submillimeter range is produced from resist material by means of a deep structuring process,
that the positive mold is galvanically molded to produce a lowering electrode,
that openings or recesses for forming the punching tool are introduced into a semifinished product by means of the erosion electrode. 15. The method according to any one of claims 12 or 14, characterized characterized that as a deep structuring process Depth lithography is used.   16. The method according to claim 14, characterized in that a Semi-finished products made of hard metal or steel are used. 17. The method according to any one of claims 12 to 16, characterized characterized that stamp and stamp plate and / or cutting plate be made in one piece. 18. A method for producing a cutting insert, characterized in that
that a stamp plate with stamps which have micro-cutting structures in the submillimeter range,
is provided with a separating layer, and
that the stamp plate is electroplated using a hard alloy. 19. The method according to claim 18, characterized in that for Formation of the separating layer on the surface of the stamp plate anodic oxidation is coated with NiO. 20. The method according to claim 18, characterized in that for Forming the separation layer on a wax or a polymer layer the stamp plate is applied, and that a metal layer as the starting layer for the galvanic impression is applied to the wax or polymer layer.   21. The method according to any one of claims 18 to 20, characterized characterized in that after galvanic molding for separation the cutting plate and stamp / stamp plate of the composite are heated, or treated with solvent or ultrasound. 22. The method according to any one of claims 18 to 21, characterized characterized in that when electroplating first a layer is applied from a hard alloy and then this Layer by electrodeposition of a softer material is back-fed. 23. The method according to any one of claims 12 to 22, characterized characterized in that as hard alloy NiFe, NiW, CoW or NiCo is used. 24. The method according to any one of claims 12 to 23, characterized characterized in that at least the micro-cutting structures with a Hard material layer. 25. A method for producing a hold-down device, thereby characterized in that an elastic polymer by means of a stamp plate with stamps with micro-cutting structures in the submillimeter range is punched out. 26. A process for producing the hold-down device, characterized in that that an elastic polymer by means of immersion, spraying or Pouring is applied directly to the stamp plate.