DE1988678U - ELECTRICAL COMPONENT WITH A LACQUER COVERING PRODUCED BY DIPPING. - Google Patents
ELECTRICAL COMPONENT WITH A LACQUER COVERING PRODUCED BY DIPPING.Info
- Publication number
- DE1988678U DE1988678U DE1968S0064612 DES0064612U DE1988678U DE 1988678 U DE1988678 U DE 1988678U DE 1968S0064612 DE1968S0064612 DE 1968S0064612 DE S0064612 U DES0064612 U DE S0064612U DE 1988678 U DE1988678 U DE 1988678U
- Authority
- DE
- Germany
- Prior art keywords
- electrical component
- dipping
- covering produced
- lacquer
- lacquer covering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004922 lacquer Substances 0.000 title description 5
- 238000007598 dipping method Methods 0.000 title description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 239000004408 titanium dioxide Substances 0.000 claims description 2
- 238000010276 construction Methods 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 229920000058 polyacrylate Polymers 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000001035 drying Methods 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 238000006748 scratching Methods 0.000 description 2
- 230000002393 scratching effect Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 206010018498 Goitre Diseases 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000009189 diving Effects 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 201000003872 goiter Diseases 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000643 oven drying Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000009958 sewing Methods 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Paints Or Removers (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Formation Of Insulating Films (AREA)
Description
SIEMENS AKTIENGESELLSCHAFT Berlin und MünchenSIEMENS AKTIENGESELLSCHAFT Berlin and Munich
ί E APR. 1968.ί E APR. 1968.
PM 68/0036 ölPM 68/0036 oil
Elektrisches Bau element mit -einer durch. Tauchen hergestellt enElectrical component with one through. Diving made
Die vorliegende Heuerung bezieht sich auf ein elektrisches Bauelement, insbesondere einen Halbleiter-Gleichrichter, mit einer durch Tauchen hergestellten Lackurnhüllung. Sie ist dadurch gekennzeichnet, daß die Umhüllung aus 25 bis 75 Gewichtsprozent eines oder mehrerer Polyaminoamide und im übrigen aus einem oder mehreren Epoxydharzen besteht. Die Umhüllung kann ■ ferner anorganische Füllstoffe, 2,B. Quarzmehl, Glimmer, vorzugsweise jedoch Titandioxyd in Pulverform enthalten.The present hiring relates to an electrical component, in particular a semiconductor rectifier a coating produced by dipping. It is characterized in that the envelope consists of 25 to 75 percent by weight one or more polyaminoamides and otherwise of one or more epoxy resins. The envelope can ■ also inorganic fillers, 2, B. Quartz flour, mica, preferably but contain titanium dioxide in powder form.
~-.1 -~ . -"χ ■'. '■ fsg/Iie~ -.1 - ~. - "χ ■ '.' ■ fsg / Iie
,68/ÖÖ3S: CK \.- :<: , 68 / ÖÖ3S : CK \ .- : < :
laokunMllung der angegebenen Zusammensetzung hat eine hohe Haftfestigkeit und stellt einen guten Feuchtigkeit«-" schutz dar. legen ihrer Härte ist sie unempfindlich'gegen. Zerkratzen und Abschaben der Kanten. Die mit der UisMllung versehenen Bauelemente sind "bereits nach einer Öfeütrocksosg τοπ einer Stunde schilttfähig. Ds der lack keine oxydativ -trocknenden Bindemittel enthält, ist die fisMlliing we it gehend beständig gegen theriaisehen Abbau und gegen Chemikalien- und lassereinwirkung. - - '.■'■'■.'LaokunMllung the specified composition has a high adhesive strength and provides good moisture «-" protection. It is insensitive to its hardness. Scratching and scraping the edges. The one with the UisMllung provided components are "already after an oven drying τοπ one hour switchable. The paint is not oxidative - Contains drying binders, the fisMlliing is going far resistant to thermal degradation and to chemicals and lassing action. - - '. ■' ■ '■.'
Im folgenden wird ein Bahrcenrezept für einen'lack zur Herstellung der Otahüllung angegeben:The following is a recipe for a Bahrcen'lack for production stated on the ota wrapping:
5 bis 15 Sew.-feile Polys&inossiide, vorzugsweise-.mit ■- einer Äiinsahl von 90 bis 406.5 to 15 sewing files Polys & inossiide, preferably with ■ - a number from 90 to 406.
15 bis 5 ßew.-feile Epoxydharze, vorwiegend auf der15 to 5 ßew.-file epoxy resins, mainly on the
Basis von Bispkenol A und Ipiclilorhydriit, ait einem "-■, - IpöXjd-lfuivalentgewicht von 175 bis. 1100.. . v,Basis of Bispkenol A and Ipiclilorhydriit, a with an "- ■, - IpöXjd-lfuivalent weight of 175 to. 1100 ... V ,
0,65 öew.-feile ferlaufmittelkombinaMoii, vor-0.65 öew. -Feile ferlaufmittelkombinaMoii, pre-
eugsweiae auf basis.eugsweiae on Base.
30 G-ew,-feile fitandioxyc 2,4 Sew.-feile \ organische farbpigieiite, E .B.30 G-ew, -feile fitandioxyc 2 , 4 Sew. -feile \ organic color pigments, E .B.
PJithalocjamißblau.Pjithalocjamis blue.
5 bis 45 '(Jew.-feile Lösungsmittel. 5 to 45 '(Jew. File solvent.
- 2- 2nd
V WiA 68/0036 GMV WiA 68/0036 GM
Als weiteres Verlaufmittel kann ein geringer Zusatz (0,01 CJewichtsteilö) Silicösol verwendet werde»., ils Lösungsmittel sind aromatische Kohlenwasserstoffe, Jlkotiole und · Sly ο ο litt her geeignet.A small addition can be used as an additional leveling agent (0.01 part by weight) Silica sol is used as a solvent are aromatic hydrocarbons, alcohols and sly ο ο suffered her suitable.
Die Schichtdicke der Lackierung kann durch entsprechende Wahl der Polyaiinosiiide, der Epoxydharze und. des Anteiles 'm anorganischen Füllstoffen in weiten Grenzen. variiert werden. The layer thickness of the coating can be determined by the appropriate choice of polyaiinosides, epoxy resins and. the proportion 'm inorganic fillers within wide limits. can be varied.
In der Zeichnung ist ein Selen-Kleingleichrichter, der mit einer lackumhüllung gemäß der leuerung versehen ist, dargestellt. Pie Figuren 1 und 2 zeigen zwei Ansichten des Gleichrichters mit aufgeschnittener lackurahüllung, die Figur 3 einen Schnitt durch das Gleiehrichtersystem.The drawing shows a small selenium rectifier which is provided with a lacquer coating in accordance with the control system. Pie FIGS. 1 and 2 show two views of the rectifier with the lacquer casing cut open, FIG. 3 a section through the rectifier system.
Wie atis Figur 3 erkennbar ist, umfaßt das Sleichrichtersystea Tier Selen-fileichrichtertaMetteii 1, die von einer aetalli-■schea Klaimaer 2■ .umfaßt sind. Auf der Oberseite ,des Stapels aus den Öleichrichter-Tabletten 1 liegt' eine Blattfeder 3, die lit der llamsier 2 in elektrischem Kontakt steht. Im ürbigeii ist die Ilainsier 2 gegen die Tabletten I durch, eine . Isolierfolie 4 isoliert. An. der Unterseite; des Stapels liegt ein: insehlusfiblech 5. Bie: flaumer 2 ist ait■' eiser insehluS- ■. ·■,, fahnt 2a, das inschluSblech 5 mit einer Anschi«Sfshne 5# ■Tersehen. Bas: ileichrichtersysteffi und" ein feil dtrAs can be seen in FIG. 3, the Sleichrichtersystea animal includes selenium-fileichrichtertaMetteii 1, which are encompassed by an metallic ■ schea Klaimaer 2 ■. On top of the stack of oil rectifier tablets 1 lies a leaf spring 3, which is in electrical contact with the llamsier 2. In the ürbigeii the Ilainsier 2 is against the tablets I through, one. Insulating foil 4 insulated. At. the bottom; of the stack is one: insehlusfiblech 5. Bie : fluff 2 is ait ■ 'eiser insehluS- ■. · ■ ,, fahnt 2a, the inschluSblech 5 with a Anschi "Sfshne 5 # ■ Marketers marriages. Bas: ileichrichtersysteffi and "ein feil dtr
PLI. 68/0036PLI. 68/0036
fahnen ist 70η einer Laökumhällim§ 6 dar angegebenen aetiuflg umgeben. ; ;flags is 70η of a Laökumhäll in § 6 indicated aetiuflg surrounded. ; ;
Die LackimhÜllung kann in der leise hergestellt werden, daß der Sieichrichter an den InaohluJfahneE 2a und. 5a gef sit und in den Lack eingetaucht' wird. Sann lird der Gleichrichter langsam (in etwa 10 bis 20 see) fco angezogen vmä. auf einem Fließpapier mm Abfangen der eich'bildenden Kropfes, tbfe·- stelit. Danach wird der -G-Ieichrichter etwa. ©1η§ Stunde bei 80° C in einen Trockenschrank gesetzt. Saoh dem Höra^sBÄien und Abkühlen ist die Lackümhülllung soweit ausgehirtet, daß. die Gleichrichter geschüttet werden können, ohne änß ein \ Verkratzen der Laekoberfläche oder ein.Yerfcieben der CLeichrieht er zu befürchten ist. innerhalb, von 100 Stunden trocknet der lack bia mir endgültigen Härte aus.The LackimhÜllung can be produced in the quiet that the Sieichrichter on the InaohluJfahneE 2a and. 5a is gef sit and immersed in the paint '. Then the rectifier is slowly tightened (in about 10 to 20 seconds) fco. on a blotting paper mm interception of the calibrating goiter, tbfe · - stelit. Thereafter, the -GI e ichrichter about. Set in a drying cabinet at 80 ° C. for 1 hour. Even after hearing and cooling down, the lacquer coating has been worn out to such an extent that. the rectifier can be poured without änß a \ scratching the Laekoberfläche or ein.Yerfcieben he CLeichrieht is to be feared. within 100 hours the lacquer dries out to its final hardness.
3 figuren. ■ ·■, ■ ' '- ■■■.'-. * '-., . ' 2-Ansprüche , . \ \. --. " .3 figures. ■ · ■, ■ '' - ■■■ .'-. * '-.,. '2 claims ,. \ \. -. ".
Claims (2)
dadurch gekenßzeichöet, daB äie Umhüllung aus 25 "bis .Gewichtsprozent eines oder meiirerer Polyaainoamiie und in übrigen aus einem oder stehrereii Bpoxydlharzen besteht.he r 1 ehts, with one just made by rope
This is characterized by the fact that the cover consists of 25 "to .Weight percent of one or more polyacrylates and the rest of one or more epoxy resins.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE1968S0064612 DE1988678U (en) | 1968-04-05 | 1968-04-05 | ELECTRICAL COMPONENT WITH A LACQUER COVERING PRODUCED BY DIPPING. |
| JP2611069A JPS4935869B1 (en) | 1968-04-05 | 1969-04-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE1968S0064612 DE1988678U (en) | 1968-04-05 | 1968-04-05 | ELECTRICAL COMPONENT WITH A LACQUER COVERING PRODUCED BY DIPPING. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE1988678U true DE1988678U (en) | 1968-07-04 |
Family
ID=33383713
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE1968S0064612 Expired DE1988678U (en) | 1968-04-05 | 1968-04-05 | ELECTRICAL COMPONENT WITH A LACQUER COVERING PRODUCED BY DIPPING. |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPS4935869B1 (en) |
| DE (1) | DE1988678U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102014103432B4 (en) | 2013-03-14 | 2021-08-12 | Infineon Technologies Austria Ag | Semiconductor package with top-side insulating layer and method for manufacturing the same |
-
1968
- 1968-04-05 DE DE1968S0064612 patent/DE1988678U/en not_active Expired
-
1969
- 1969-04-04 JP JP2611069A patent/JPS4935869B1/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102014103432B4 (en) | 2013-03-14 | 2021-08-12 | Infineon Technologies Austria Ag | Semiconductor package with top-side insulating layer and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4935869B1 (en) | 1974-09-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE10042636C1 (en) | Electrical component and method for its production | |
| DE1988678U (en) | ELECTRICAL COMPONENT WITH A LACQUER COVERING PRODUCED BY DIPPING. | |
| DE2650211C2 (en) | Ceramic capacitor and method of manufacturing | |
| DE2826803C3 (en) | Carbon film resistor | |
| DE579975C (en) | Coil with protective cover for counters and measuring instruments | |
| DE2624660C2 (en) | Electric capacitor made by screen printing | |
| DE1866341U (en) | ELECTRICAL COMPONENT WITH A WATER VAPOR-PROOF COVERING. | |
| DE901086C (en) | Electric capacitor | |
| DE1099644B (en) | Process for the production of a low-loss, electrical capacitor with a sintered dielectric consisting mainly of barium titanate | |
| DE748605C (en) | Method of insulating electrical conductors | |
| DE459553C (en) | High electrical resistance | |
| DE410462C (en) | Implementation for high voltages | |
| DE426993C (en) | Insulating material with great electrical and mechanical strength | |
| DE419373C (en) | Process for creating mechanically strong, electrically insulating coatings on metal parts of electrical apparatus and devices (measuring devices, switches, counters, etc.) | |
| DE2034919C3 (en) | Molding compounds based on organopolysiloxane which are heat-curable to form flame-resistant elastomers | |
| DE517970C (en) | Process for the production of flexible insulating materials | |
| DE749565C (en) | Insulating material, in particular paper, with a metal coating produced by cathode atomization or metal vapor deposition, which has been treated with pore-filling agents before metallization, in particular for capacitors | |
| DE685658C (en) | Process for the production of adjustable sheet resistors | |
| DE1072663B (en) | Multi-layer insulation based on cast resin for electrical components | |
| AT203111B (en) | Process for the production of ceramic tubular capacitors | |
| DE498885C (en) | Conductive coated membrane made of insulating material for electrostatic speech devices | |
| DE2003797C3 (en) | Maximum ohmic resistance | |
| DE4229835A1 (en) | Reference electrode for electrochemical sensor - has platinum@ electrode coated with platinum oxide and polyhydantoin layers to function independently of oxygen@ partial pressure. | |
| DE1123398B (en) | Electric luminous lamp | |
| DE1731185U (en) | ELECTRON TUBE WITH SURFACE GLIM PROTECTION. |