DE19827124A1 - Transport of flat circular disc-shaped workpieces to and from working stations - Google Patents

Transport of flat circular disc-shaped workpieces to and from working stations

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Publication number
DE19827124A1
DE19827124A1 DE1998127124 DE19827124A DE19827124A1 DE 19827124 A1 DE19827124 A1 DE 19827124A1 DE 1998127124 DE1998127124 DE 1998127124 DE 19827124 A DE19827124 A DE 19827124A DE 19827124 A1 DE19827124 A1 DE 19827124A1
Authority
DE
Germany
Prior art keywords
transport
suction
jet pump
axis
disc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE1998127124
Other languages
German (de)
Inventor
Reiner Schleiff
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Leybold Systems GmbH
Original Assignee
Leybold Systems GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leybold Systems GmbH filed Critical Leybold Systems GmbH
Priority to DE1998127124 priority Critical patent/DE19827124A1/en
Publication of DE19827124A1 publication Critical patent/DE19827124A1/en
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/568—Transferring the substrates through a series of coating stations
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B23/00—Record carriers not specific to the method of recording or reproducing; Accessories, e.g. containers, specially adapted for co-operation with the recording or reproducing apparatus ; Intermediate mediums; Apparatus or processes specially adapted for their manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers

Abstract

The workpiece discs (1,1',1''.....) are held on suction discs (14,14',14''.....) spaced at equal intervals on the periphery of a large transport disc (2) rotating about a vertical central axis (R) with a connection (7) to a suction device. The suction is controlled by electromagnetically operated valves (3,3',3''.....) and there are radial vacuum channels (6) extending from the center. A jet pump (5,5',5''.....) is associated with each vacuum line and valve and the system also incorporates pressure valves (11,11',11'').

Description

Die Erfindung betrifft eine Vorrichtung für den Transport von flachen, vorzugsweise kreisscheiben­ förmigen Substraten von und nach Behandlungssta­ tionen mit einer um eine vertikale Achse rotierba­ ren, motorisch angetriebenen Transportscheibe mit einer Vielzahl von im radial äußeren Bereich der Transportscheibe angeordneten Saugeraufnahmen.The invention relates to a device for the Transport of flat, preferably circular discs shaped substrates from and to treatment station tion with a rotatable around a vertical axis ren, motor-driven transport disc with a variety of in the radially outer area of the Transport disc arranged suction cups.

In der Vakuum-Prozeßtechnik - insbesondere in der Dünnschicht-Technik - ist das Beschichten von kreisscheibenförmigen Substraten, beispielsweise von Glas- oder Aluminiumscheiben für magnetische oder magneto-optische Datenträger bekannt. Diese scheibenförmigen Substrate werden als Speicherme­ dien für digitale Information vielfältig verwen­ det. In einem Sputterprozeß werden beispielsweise geprägte Kunststoffscheiben mit einer Aluminium­ schicht überzogen. Die hierzu eingesetzten Sput­ ter-Beschichtungsanlagen besitzen in aller Regel ein automatisiertes Greiferführungsgetriebe für die Beförderung der Substrate vor, in und hinter einer Vakuumkammer.In vacuum process technology - especially in Thin film technology - is the coating of circular disk-shaped substrates, for example of glass or aluminum discs for magnetic or magneto-optical data carriers known. This disc-shaped substrates are called storage cells services for digital information det. For example, in a sputtering process  embossed plastic discs with an aluminum layer covered. The sput used for this ter coating systems usually have an automated gripper guide gear for the transport of the substrates in front of, in and behind a vacuum chamber.

Von einer Bereitstellungsstation aus transportiert beispielsweise ein Schwenkarm eines Greiferfüh­ rungsgetriebes die Substrate in die Vakuumkammer. In der Kammer werden dann die Substrate auf einen Drehteller aufgelegt und mit diesem durch die ein­ zelnen Stationen der Vakuumkammer hindurchbewegt. Zum Be- und Entladen der Drehteller mit den Substraten sind im Stand der Technik zahlreiche Vorrichtungen zum Greifen und Halten bekannt.Transported from a delivery station for example a swivel arm of a gripper guide the transmission into the vacuum chamber. In the chamber, the substrates are then placed on one Turntable put on and with this through the one individual stations of the vacuum chamber moved through. For loading and unloading the turntables with the Substrates are numerous in the prior art Gripping and holding devices are known.

Bekannt ist auch eine Vorrichtung (G 93 07 263.5) zum Greifen und Halten eines flachen, vorzugsweise scheibenförmigen Substrats, im wesentlichen beste­ hend aus mehreren fingerförmigen Greifern und ei­ ner Membran aus elastischem Material, die eine in einem druckfesten Gehäuse angeordnete Öffnung ver­ schließt, wobei auf der Vorder- und Rückseite der Membran unterschiedliche Drücke einstellbar sind und die Membran so angeordnet ist, daß sie bei an­ liegender Druckdifferenz eine Auslenkung aus ihrer Ruhelage ausführt und bei Druckgleichheit durch eine Druckfeder wieder in ihre Ruhelage zurück­ stellbar ist und wobei die Greifer mit ihrem je­ weils einen Ende mechanisch mit der Membran so verbunden sind, daß sie mit ihrem anderen, freien Ende eine Schwenkbewegung proportional zur Auslen­ kung der Membran zum Greifen und Halten, bezie­ hungsweise Freigeben des Substrats ausführen.A device is also known (G 93 07 263.5) for gripping and holding a flat, preferably disc-shaped substrate, essentially the best consisting of several finger-shaped grippers and egg ner membrane made of elastic material, the one in a pressure-resistant housing arranged ver closes, being on the front and back of the Membrane different pressures are adjustable and the membrane is arranged so that at lying pressure difference a deflection from their Executes rest position and in case of pressure equality a compression spring back to its rest position is adjustable and the gripper with their ever because one end mechanically with the membrane like that connected with their other, free End of a swivel movement proportional to the deflection  the membrane for gripping and holding, or Complete the substrate release procedure.

Bekannt ist weiterhin eine Vorrichtung für den Transport von flachen Werkstücken (EP 0 487 848) von einem Förderband zu einer Bearbeitungsstation mittels eines um eine vertikale Achse schwenkba­ ren, zweiarmigen Transportarmes, an dessen beiden freien Enden Sauggreifer angeordnet sind, wobei die Sauggreifer jeweils über Schlauchleitungen an einzelne Vakuumpumpen angeschlossen sind. Diese bekannte Vorrichtung hat insbesondere den Nach­ teil, daß für jeden Saugheber eine eigene Saugpum­ pe erforderlich ist, die über besondere Rohr- und Schlauchleitungen mit der Pumpe verbunden sind, wobei in die Leitungen jeweils ein Paar Ventile eingeschaltet sind, über die der Saugstrom steuer­ bar ist. Es ist klar, daß die Anzahl der Saughe­ ber, die an einem Transportarm vorgesehen sein können, praktisch begrenzt ist, da andernfalls die Vielzahl von erforderlichen Schlauch- und Rohrlei­ tungen das Aggregat überfrachten würde.A device for the is also known Transport of flat workpieces (EP 0 487 848) from a conveyor belt to a processing station by means of a pivotable about a vertical axis ren, two-armed transport arm, on the two Free ends of suction pads are arranged, whereby the suction cups via hose lines individual vacuum pumps are connected. This known device has in particular the after part that a separate suction pump for each siphon is required, which has special pipe and Hose lines are connected to the pump, with a pair of valves in the lines are switched on, over which the suction flow control is cash. It is clear that the number of suction Be provided on a transport arm can, is practically limited, otherwise the Variety of hose and pipe requirements the unit would overload.

Bekannt sind auch Treibmittelpumpen, bei denen ein schnell bewegtes gasförmiges Treibmittel zur För­ derung des abzupumpenden Gases benutzt wird (Wutz, Adam, Walcher: Theorie und Praxis der Vakuumtech­ nik, Friedrich Vieweg & Sohn, Braun­ schweig/Wiesbaden, 3. Auflage, Seite 193 ff.). Derartige Treibmittelpumpen werden auch als Ejek­ toren, Luftstrahlpumpen oder Venturipumpen gehan­ delt. Propellant pumps are also known in which a fast moving gaseous propellant for conveying the gas to be pumped out is used (Wutz, Adam, Walcher: Theory and Practice of Vacuum Tech nik, Friedrich Vieweg & Sohn, Braun Switzerland / Wiesbaden, 3rd edition, page 193 ff.). Such propellant pumps are also called Ejek gates, air jet pumps or venturi pumps delt.  

Der vorliegenden Erfindung liegt die Aufgabe zu­ grunde, eine Vorrichtung der in Frage stehenden Art so zu verbessern, daß sie mit einer möglichst großen Anzahl von Saugeraufnahmen ausgestattet werden kann, die jeweils einzeln ansteuerbar sind und besonders rasch und zuverlässig arbeiten.The object of the present invention is to achieve reasons, a device of the question Art to improve so that it is possible with a large number of suction cups can be controlled individually and work particularly quickly and reliably.

Diese Aufgabe wird erfindungsgemäß dadurch gelöst, daß jeder Saugeraufnahme eine eigene Luftstrahl­ pumpe zugeordnet ist, wobei in die Verbindungslei­ tung vom Sauganschluß der Strahlpumpe zur Sau­ geraufnahme ein Ventil eingeschaltet ist und der Druckanschluß jeder Strahlpumpe jeweils mit einer einzigen zentralen Druckluftquelle verbunden ist.According to the invention, this object is achieved by that each suction cup holder has its own air jet pump is assigned, being in the connection line tion from the suction connection of the jet pump to the sow a valve is switched on and the Pressure connection of each jet pump with one single central compressed air source is connected.

Die Erfindung läßt die verschiedensten Ausfüh­ rungsmöglichkeiten zu; eine davon ist in den an­ hängenden Zeichnungen rein schematisch näher dar­ gestellt, und zwar zeigen:The invention allows a wide variety of designs opportunities for; one of them is in the an hanging drawings purely schematically posed, showing:

Fig. 1 die Draufsicht auf eine Transportscheibe mit den auf dieser angeordneten Ventilen und Strahlpumpen, Fig. 1 is a plan view of a transport disk with the arranged on these valves and the jet pump,

Fig. 2 den Teilschnitt nach den Linien A-B gemäß Fig. 1, Fig. 2 is a partial section taken on lines AB in Fig. 1,

Fig. 3 den Teilschnitt nach den Linien C-D gemäß Fig. 1 und Fig. 3 shows the partial section along the lines CD of FIG. 1 and

Fig. 4 den Teilschnitt nach den Linien E-F gemäß Fig. 1. Fig. 4 is a partial section on the lines EF in FIG. 1.

Die Vorrichtung gemäß Fig. 1 besteht im wesentli­ chen aus sieben auf der Oberseite der radial äuße­ ren Partie der Transportscheibe 2 angeordneten Elektromagnetventilen 3, 3', 3", . . . und sieben Druck­ schaltern 4, 4', 4", . . . und sieben auf der Unterseite der Transportscheibe 2 vorgesehenen Strahlpumpen 5, 5', 5", . . ., wobei jedes Elektromagnetventil 3, 3', 3", . . . einerseits über einen eigenen, sich ra­ dial in der Transportscheibe 2 erstreckenden Kanal 6, 6', 6", . . . mit einem zentralen Luftdruckschacht 7 verbunden ist und andererseits jeweils an eine Strahlpumpe 5, 5', 5", . . . angeschlossen ist, die ih­ rerseits wiederum mit einem Druckschalter 4, 4', 4", . . . zusammenwirkt und mit einem eigenen Ab­ luftkanal 8, 8', 8", . . . verbunden ist.The apparatus according to Fig. 1 consists wesentli chen of seven on top of the radially äuße ren section of the transport wheel 2 are arranged solenoid valves 3, 3 ', 3 ",... And seven pressure switches 4, 4', 4",. . . and seven jet pumps 5 , 5 ', 5 ",... provided on the underside of the transport disk 2 , each solenoid valve 3 , 3 ', 3 ",. . . '"is connected... having a central air pressure shaft 7, and on the other hand respectively to a jet pump 5, 5, 6', 5" on one hand on its own, is ra dial extending in the transport disc 2 channel 6, 6,. . . is connected, which in turn interacts with a pressure switch 4 , 4 ', 4 ",... and with its own air duct 8 , 8 ', 8 ",. . . connected is.

Während des Betriebes strömt Druckluft vom Schacht 7 in die sich radial erstreckenden Kanäle 6, 6', . . . und von diesen aus in die jeweiligen Elektroma­ gnetventile 3, 3', 3", . . ., die je nach Schaltstellung den Durchlaß 9, 9', 9", . . . zum jeweiligen Abluftkanal 8, 8', 8", . . . durch die entsprechende Strahlpumpe 5, 5', 5", . . . öffnen oder schließen. Die einzelnen Strahlpumpen 5, 5', 5", . . . sind mit ihren Saugstutzen 10, 10', . . . jeweils mit einem Druckschalter 11, 11', . . . verbunden, der jeweils über eine Bohrung 12, 12', . . . mit der an sich bekannten Saugeraufnahme 14, 14', . . . verbunden ist. Eine Luftstrahlpumpe 5, 5', 5", . . . der in Frage stehenden Art kann beispielsweise mit ei­ nem Überdruck zwischen 0,38 MPa (55,1 Psi) bis 0,6 MPa (87 Psi) bei einem Unterdruck von etwa -93 kPa (-27,9 in Hg) und einer Durchflußmenge von 0,4 l/s arbeiten. Der von einer solchen Luft­ strahlpumpe erzeugte Druck reicht vollständig aus, um beispielsweise eine Compact Disc (CD) bei Ver­ wendung eines handelsüblichen Vakuumgreifers bzw. einer Saugeraufnahme anzuheben und zu transportie­ ren. Um ein Anheben des Substrats zu bewirken, wird der mit dem entsprechenden Vakuumgreifer ver­ bundene Sauganschluß 10, 10', 10", . . . durch Betäti­ gung des korrespondierenden Druckschalters 11, 11', 11", . . . geöffnet, so daß sich an der jewei­ ligen Bohrung 13, 13', 13", . . . ein Unterdruck ein­ stellt. During operation, compressed air flows from the shaft 7 into the radially extending channels 6 , 6 ',. . . and from these into the respective electromagnetic solenoid valves 3 , 3 ', 3 ",..., which, depending on the switching position, the passage 9 , 9 ', 9 ",. . . to the respective exhaust air duct 8 , 8 ', 8 ",... by the corresponding jet pump 5 , 5 ', 5 ",. . . open or close. The individual jet pumps 5 , 5 ', 5 ",... Are connected with their suction ports 10 , 10 ',... Each to a pressure switch 11 , 11 ',..., Each of which has a bore 12 , 12 ',. ... is connected to the suction holder 14 , 14 ', ... known per se. An air jet pump 5 , 5 ', 5 ",. . . of the type in question can be, for example, with an overpressure between 0.38 MPa (55.1 psi) to 0.6 MPa (87 psi) at an underpressure of about -93 kPa (-27.9 in Hg) and a flow rate working from 0.4 l / s. The pressure generated by such an air jet pump is completely sufficient, for example, to lift and transport a Compact Disc (CD) when using a commercially available vacuum gripper or a suction cup holder. In order to raise the substrate, use the appropriate vacuum gripper connected suction port 10 , 10 ', 10 ",... by actuation of the corresponding pressure switch 11 , 11 ', 11 ",. . . opened so that a negative pressure is at the respective bore 13 , 13 ', 13 ",...

BezugszeichenlisteReference list

11

, ,

11

', . . .Substrat
',. . .Substrate

22nd

Transportscheibe
Transport disc

33rd

, ,

33rd

', . . .Elektromagnetventil
',. . .Electromagnetic valve

44th

, ,

44th

', . . .Druckschalter
',. . .Pressure switch

55

, ,

55

', . . .Luftstrahlpumpe, (Treibmittelpumpe)
',. . Air jet pump, (propellant pump)

66

, ,

66

', . . .Kanal
',. . .Channel

77

zentraler Druckluftschacht
central compressed air duct

88th

, ,

88th

', . . .Abluftkanal
',. . Exhaust duct

99

, ,

99

', . . .Durchlaß
',. . .Passage

1010th

, ,

1010th

', . . .Saugstutzen
',. . .Suction nozzle

1111

, ,

1111

', . . .Druckschalter
',. . .Pressure switch

1212th

, ,

1212th

', . . .Bohrung
',. . .Drilling

1313

, ,

1313

', . . .Bohrung
',. . .Drilling

1414

, ,

1414

', . . .Saugstutzen, Saugeraufnahme
',. . .Suction nozzle, suction cup holder

1515

, ,

1515

', . . .Abluftöffnung
',. . Exhaust opening

Claims (4)

1. Vorrichtung für den Transport von flachen, vorzugsweise kreisscheibenförmigen Substraten (1, 1', . . .) von und nach Behandlungsstationen mit einer um eine vertikale Achse (R) rotier­ baren, motorisch angetriebenen Transport­ scheibe (2) mit einer Vielzahl am radial äu­ ßeren Bereich der Transportscheibe (2) ange­ ordneten Saugeraufnahmen (14, 14', . . .) und mit einer auf der Transportscheibe (2) befestig­ ten, der Anzahl der Saugeraufnahmen (14, 14', . . .) entsprechenden Zahl von elektroma­ gnetisch betätigbaren Ventilen (3, 3', . . .) und Strahlpumpen (5, 5', . . .), wobei jede der Sau­ geraufnahmen (14, 14', . . .) jeweils an den Saug­ stutzen (10, 10', . . .) einer Strahlpumpe (5, 5', . . .) unter Zwischenschaltung eines Ventils oder Druckschalters (11, 11', . . .) angeschlossen ist, wobei der Druckanschluß jeder Strahlpumpe (5, 5', . . .) jeweils mit einer gemeinsamen Druckquelle oder einem zentralen Druckluft­ schacht (7) verbunden ist.1. Device for the transport of flat, preferably circular disc-shaped substrates ( 1 , 1 ',...) From and to treatment stations with a rotatable around a vertical axis (R), motor-driven transport disc ( 2 ) with a variety of radial Outer area of the transport disc ( 2 ) arranged suction cups ( 14 , 14 ',...) and with a on the transport disc ( 2 ) ten, the number of suction cups ( 14 , 14 ',..) corresponding number Electromagnetically actuated valves ( 3 , 3 ',...) and jet pumps ( 5 , 5 ',...), each of the suction devices ( 14 , 14 ',...) each connecting to the suction ( 10 , 10 ',...) Of a jet pump ( 5 , 5 ',...) With the interposition of a valve or pressure switch ( 11 , 11 ',...), The pressure connection of each jet pump ( 5 , 5 ',. .) each with a common pressure source or a central compressed air shaft ( 7 ) is connected. 2. Vorrichtung nach Anspruch 1, gekennzeichnet durch einen zentralen Druckluftschacht (7), der koaxial zur Drehachse (R) der Transport­ scheibe (2) verläuft und mit einer der Anzahl von Strahlpumpen (5, 5', . . .) entsprechenden, sich zur Drehachse (R) radial durch die Transportscheibe (2) hindurch erstreckenden Kanälen (6, 6', . . .) verbunden ist, die ihrer­ seits jeweils an ein Elektromagnetventil (3, 3', . . .) angeschlossen sind, das den Durch­ tritt der Druckluft zu jeweils einer Strahl­ pumpe (5, 5', . . .) gestattet.2. Device according to claim 1, characterized by a central compressed air shaft ( 7 ) which coaxially to the axis of rotation (R) of the transport disc ( 2 ) and with one of the number of jet pumps ( 5 , 5 ',...) Corresponding to the axis of rotation (R) radially through the transport disc ( 2 ) extending through channels ( 6 , 6 ',...) are connected, which in turn are each connected to an electromagnetic valve ( 3 , 3 ',...), the By passing the compressed air to a jet pump ( 5 , 5 ',...) Permitted. 3. Vorrichtung nach den Ansprüchen 2 und 3, da­ durch gekennzeichnet, daß dem Sauganschluß (13, 13', . . .) jeder Strahlpumpe (5, 5', . . .) jeweils ein Druckschalter (4, 4', . . .) nachgeschaltet ist, über den die Verbindung zwischen der Strahlpumpe (5, 5', . . .) und dem Saugstutzen (14, 14', . . .) steuerbar ist.3. Device according to claims 2 and 3, characterized in that the suction connection ( 13 , 13 ',...) Of each jet pump ( 5 , 5 ',...) Each has a pressure switch ( 4 , 4 ',.. .) is connected downstream, via which the connection between the jet pump ( 5 , 5 ',...) and the suction nozzle ( 14 , 14 ',...) can be controlled. 4. Vorrichtung nach den Ansprüchen 1 bis 3, da­ durch gekennzeichnet, daß der mit jeder Strahlpumpe (5, 5', . . .) verbundene Abluftkanal (8, 8', . . .) als eine sich radial zur Rotati­ onsachse (R) durch die Transportscheibe (2) erstreckende Bohrung ausgebildet ist, deren radial inneres Ende in einer sich parallel zur Rotationsachse (R) und in deren unmittel­ barer Nachbarschaft angeordnete Abluftöffnung (15, 15', . . .) einmündet.4. Device according to claims 1 to 3, characterized in that with each jet pump ( 5 , 5 ',...) Connected exhaust air duct ( 8 , 8 ',...) As a radially to the axis of rotation (R ) is formed through the transport disk ( 2 ) extending bore, the radially inner end of which flows into an exhaust air opening ( 15 , 15 ',...) arranged parallel to the axis of rotation (R) and in its immediate vicinity.
DE1998127124 1998-06-18 1998-06-18 Transport of flat circular disc-shaped workpieces to and from working stations Withdrawn DE19827124A1 (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001065558A1 (en) * 2000-02-29 2001-09-07 Polymer Reprocessors Limited Disc handling apparatus
WO2002005280A2 (en) * 2000-07-07 2002-01-17 Valley Compact Disc Repair Inc Method and apparatus for reconditioning digital discs
DE10108383A1 (en) * 2001-02-21 2002-09-12 Steag Hamatech Ag Device for receiving substrates
DE102010060517A1 (en) * 2010-11-12 2012-05-16 Schott Solar Ag Method for handling flat object e.g. semiconductor wafer, involves fixing object placed in receiving unit by negative pressure while rotating receiving unit
CN103287847A (en) * 2012-02-27 2013-09-11 北京北方微电子基地设备工艺研究中心有限责任公司 Substrate transmission mechanism and substrate transmission system provided with same

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Cited By (10)

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WO2001065558A1 (en) * 2000-02-29 2001-09-07 Polymer Reprocessors Limited Disc handling apparatus
GB2378035A (en) * 2000-02-29 2003-01-29 Polymer Reprocessors Ltd Disc handling apparatus
WO2002005280A2 (en) * 2000-07-07 2002-01-17 Valley Compact Disc Repair Inc Method and apparatus for reconditioning digital discs
WO2002005280A3 (en) * 2000-07-07 2002-04-18 Valley Compact Disc Repair Inc Method and apparatus for reconditioning digital discs
US6991524B1 (en) 2000-07-07 2006-01-31 Disc Go Technologies Inc. Method and apparatus for reconditioning digital discs
US7357696B2 (en) 2000-07-07 2008-04-15 Disc Go Technologies, Inc. Method and apparatus for reconditioning digital discs
DE10108383A1 (en) * 2001-02-21 2002-09-12 Steag Hamatech Ag Device for receiving substrates
DE10108383B4 (en) * 2001-02-21 2006-06-14 Steag Hamatech Ag Device for picking up substrates
DE102010060517A1 (en) * 2010-11-12 2012-05-16 Schott Solar Ag Method for handling flat object e.g. semiconductor wafer, involves fixing object placed in receiving unit by negative pressure while rotating receiving unit
CN103287847A (en) * 2012-02-27 2013-09-11 北京北方微电子基地设备工艺研究中心有限责任公司 Substrate transmission mechanism and substrate transmission system provided with same

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