DE19755792C2 - Textile fabric made of several interconnected fabric layers, some of which contain electrically conductive wires / threads - Google Patents
Textile fabric made of several interconnected fabric layers, some of which contain electrically conductive wires / threadsInfo
- Publication number
- DE19755792C2 DE19755792C2 DE19755792A DE19755792A DE19755792C2 DE 19755792 C2 DE19755792 C2 DE 19755792C2 DE 19755792 A DE19755792 A DE 19755792A DE 19755792 A DE19755792 A DE 19755792A DE 19755792 C2 DE19755792 C2 DE 19755792C2
- Authority
- DE
- Germany
- Prior art keywords
- textile
- electrically conductive
- threads
- layers
- conductive wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
- B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
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- D—TEXTILES; PAPER
- D04—BRAIDING; LACE-MAKING; KNITTING; TRIMMINGS; NON-WOVEN FABRICS
- D04B—KNITTING
- D04B21/00—Warp knitting processes for the production of fabrics or articles not dependent on the use of particular machines; Fabrics or articles defined by such processes
- D04B21/14—Fabrics characterised by the incorporation by knitting, in one or more thread, fleece, or fabric layers, of reinforcing, binding, or decorative threads; Fabrics incorporating small auxiliary elements, e.g. for decorative purposes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0286—Programmable, customizable or modifiable circuits
- H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
- H05K1/0289—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns having a matrix lay-out, i.e. having selectively interconnectable sets of X-conductors and Y-conductors in different planes
-
- D—TEXTILES; PAPER
- D10—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
- D10B—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
- D10B2401/00—Physical properties
- D10B2401/16—Physical properties antistatic; conductive
-
- D—TEXTILES; PAPER
- D10—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
- D10B—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
- D10B2403/00—Details of fabric structure established in the fabric forming process
- D10B2403/02—Cross-sectional features
- D10B2403/021—Lofty fabric with equidistantly spaced front and back plies, e.g. spacer fabrics
-
- D—TEXTILES; PAPER
- D10—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
- D10B—INDEXING SCHEME ASSOCIATED WITH SUBLASSES OF SECTION D, RELATING TO TEXTILES
- D10B2403/00—Details of fabric structure established in the fabric forming process
- D10B2403/02—Cross-sectional features
- D10B2403/024—Fabric incorporating additional compounds
- D10B2403/0243—Fabric incorporating additional compounds enhancing functional properties
- D10B2403/02431—Fabric incorporating additional compounds enhancing functional properties with electronic components, e.g. sensors or switches
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/0281—Conductive fibers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
- H05K2201/029—Woven fibrous reinforcement or textile
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
- H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
Description
Die Erfindung betrifft ein textiles Flächengebilde aus mehreren miteinander verbundenen, teilweise elektrisch lei tende Drähte/Fäden enthaltenden Gewebelagen, insbesondere zum Aufbau elektronischer Schaltungen.The invention relates to a textile fabric several interconnected, partially electrically conductive Tissue layers containing wires / threads, in particular to build electronic circuits.
Die elektronische Schaltungstechnik verwendet konventio nelle Leiterplatten, Hybridschaltkreise und die derzeit hochaktuelle Folienmontagetechnik für die Multichipmontage. Dabei handelt es sich stets um planare Strukturen, in denen mit additiver und Subtraktionstechnik mehrlagige Leiterbahnführungen mit Durchmetallisierungen erzeugt werden. Eine Alternative, die sich im Unterschied zur planaren Leitungsebene einer räumlich vernetzten Leiter drahtstruktur bedient und dabei gleichzeitig ein hohes Maß an Flexibilität besitzt, ist nicht bekannt. Es existieren zwar textile Flächengebilde, in denen Leiter drahtstrukturen angeordnet sind, so daß elektrische Leitfähigkeit in einer Richtung erzielt wird oder das gesamte textile Flächengebilde elektrisch leitfähig ist. Bei diesen herkömmlichen textilen Flächengebilden handelt es sich aber um einfache meist gleichstrukturierte Gebilde mit geringer Anforderung an die laterale Präzision.The electronic circuit technology uses konventio nelle PCBs, hybrid circuits and the currently state-of-the-art film assembly technology for multi-chip assembly. These are always planar structures, in those with additive and subtraction technology multilayer Conductor tracks with through metallizations generated become. An alternative that differs from planar line level of a spatially networked conductor operated wire structure and at the same time a high Degree of flexibility is not known. It there are textile fabrics in which conductors wire structures are arranged so that electrical One-way conductivity is achieved or that entire textile fabric is electrically conductive. These conventional textile fabrics act but it is simple, mostly of the same structure Structures with low demands on the lateral Precision.
Bekannte Lösungen sind Zaunbänder gemäß DE 41 27 774 A1 und DE 40 36 886 A1 und Heizmatten gemäß DE 42 21 454 A1 sowie Sportanzüge, in denen über elektrische Leiter Signale übertragen werden gemäß DE 38 21 477 A1. Known solutions are fence strips according to DE 41 27 774 A1 and DE 40 36 886 A1 and heating mats according to DE 42 21 454 A1 as well as sports suits in which have electrical conductors Signals are transmitted according to DE 38 21 477 A1.
Weiterhin bekannt ist das Einarbeiten von elektrisch leitfähigen Drähten in Fechterkleidung zur Signalgabe.The incorporation of electrical is also known conductive wires in fencer clothing for signaling.
Bekannt sind weitere textile Flächengebilde, die elek trische Leiter zur Abschirmung von elektromagnetischer Strahlung enthalten gemäß DE 41 32 985 A1. Meistens handelt es sich bei den textilen Flächengebilden um Gewebe.Other textile fabrics are known, the elek tric conductor for shielding electromagnetic According to DE 41 32 985 A1 contain radiation. Mostly the textile fabrics are Tissue.
Ferner sind nach DE 43 00 791 A1 aber auch metalldraht haltige Gewirke zur Herstellung von Katalysatoren ge bräuchlich. Weiterhin sind gemäß EP-Anmeldung 0 616 065 A1 Abstandsgewirke bekannt, die aus zwei außenliegenden Ge wirkebahnen und einer dazwischenliegenden Abstandsstruktur, gebildet aus Abstandshalterfäden bestehen. Diese bekannten textilen Flächengebilde sind zum Aufbau elektronischer Schaltungen nicht geeignet, da die Anforderungen der komplexen, auch auf mehreren Ebenen auszuführenden Verdrahtungstechnik elektronischer Schaltungen nicht erfüllt werden.Furthermore, according to DE 43 00 791 A1 are also metal wire knitted fabrics for the production of catalysts ge common. Furthermore, according to EP application 0 616 065 A1 Spacer fabrics are known, the two outer Ge webs and an intermediate spacing structure, formed from spacer threads. These well-known Textile fabrics are electronic for building Circuits not suitable because the requirements of the complex, wiring technology to be carried out on several levels electronic circuits are not met.
Die DE 19 19 421 C3 beinhaltet eine Mehrschichtleiter platte, bei der sich die Leiter in mehreren mit Harz imprägnierten und zu einem Mehrschichtstoff verbundenen Lagen befinden, wobei auch Gewebe für den Aufbau der Lagen Anwendung finden können und die Leiter als Kett- oder Schußfäden eingewebt werden können. Diese mit Harz imprägnierten Lagen werden unter Druck- und Wärmeanwendung zu einer starren Mehrschichtplatte verbunden, die so fest und nicht biegsam erhalten werden muß, um exakt zielge richtet Bohrlöcher einzubringen, die eine Kontaktverbin dung bzw. eine Leiterunterbrechung bewirken. Weiterhin wird mindestens eine isolierende Zwischenschicht zwischen den Lagen benötigt. DE 19 19 421 C3 contains a multilayer conductor plate, with the ladder in several with resin impregnated and bonded to a multilayer Layers are located, including tissue for building the Layers can be used and the ladder as a warp or weft threads can be woven. This with resin impregnated layers are under pressure and heat application connected to a rigid multilayer board that is so firm and does not have to be obtained to be exactly pliable aligns drill holes that create a contact joint effect or a wire break. Farther there is at least one insulating intermediate layer between the layers needed.
Auf die isolierende Zwischenschicht kann auch bei der mehrlagigen Anordnung von elektrischen Leitern nach US-Patent 47 29 166 A bei Verwendung elastischer Binde mittel - Elastomere - nicht verzichtet werden, da es sonst bei den eingesetzten Geweben zwangsläufig zu Kurzschlüssen zwischen den elektrisch leitfähigen Dräh ten der einzelnen Lagen kommt.The insulating intermediate layer can also be used for the multilayer arrangement of electrical conductors US Patent 47 29 166 A when using elastic bandage medium - elastomers - not to be dispensed with as it otherwise inevitably in the tissues used Short circuits between the electrically conductive wires of the individual layers.
Der Erfindung liegt die Aufgabe zugrunde, textile Flä chengebilde zu schaffen, die als Trägermaterial für den Aufbau elektronischer Schaltungen auf Hybrid- und Baugruppenebene einsetzbar sind und permanente Flexibili tät aufweisen.The invention has for its object textile surfaces to create chengebilden that as a carrier material for the Structure of electronic circuits on hybrid and Module level can be used and permanent flexibility act.
Erfindungsgemäß wird diese Aufgabe mit dem in den kennzeichnenden Teilen der Patentansprüche 1 und 2 beschriebenen textilen Flächengebilde aus mehreren mit einander verbundenen, teilweise elektrisch leitende Drähte/Fäden enthaltenden Gewebelagen, mit mikrostruktu rierter Verdrahtung gelöst.According to the invention, this task is performed in the characterizing parts of claims 1 and 2 described textile fabrics of several with interconnected, partially electrically conductive Fabric layers containing wires / threads, with microstructure wiring disconnected.
Die Erfindung wird nachstehend anhand von zwei Ausfüh rungsbeispielen näher erläutert.The invention is based on two Ausfüh tion examples explained in more detail.
In den Zeichnungen zeigen:The drawings show:
Fig. 1 eine Prinzipskizze in perspektivischer Sicht eines mehrschichtig aufgebauten textilen Flächengebildes mit mikro strukturierter Verdrahtung Fig. 1 is a schematic diagram in perspective view of a multi-layer textile fabric with micro-structured wiring
Fig. 2 die schematische Draufsicht eines textilen Flächengebildes mit in zwei Ebenen angeordneten Verdrahtungen sowie Mikrotrenn- und Mikroverbin dungsstellen Fig. 2 shows the schematic plan view of a textile fabric with wiring arranged in two planes as well as micro separation and micro connec tion points
Fig. 3 ein textiles Flächengebilde in Form einer zweilagigen Abstandsstruktur mit integriertem Elektronikbauteil im Querschnitt Fig. 3 shows a textile fabric in the form of a two-layer spacing structure with an integrated electronic component in cross section
Das textile Flächengebilde nach Fig. 1 besteht aus den Lagen eines mehrschichtig aufgebauten textilen Flächen gebildes, bestehend aus elektrisch isolierendem textilem Material 1, 1', 1" sowie sinngemäß weiteren Lagen des elektrisch isolierenden textilen Materials - beispiels weise Geweben oder Gelegen - mit in definierten Abständen und in festgelegten Richtungen eingebundenen elektrisch leitfähigen Drähten 2. Das Leitermaterial und die Abstände der elektrisch leitfähigen Drähte 2 in den einzelnen Lagen 1, 1' und 1" sind entsprechend der einzusetzenden elek tronischen Bauteile, wie Schaltkreise, angeordnet. . The fabric according to Figure 1 consists of the layers of a multi-layered textile surfaces structure consisting of electrically insulating textile material 1, 1 ', 1 ", and accordingly further layers of the electrically insulating textile material - example as woven or laid - with in defined Distances and bound in predetermined directions electrically conductive wires 2. The conductor material and the distances of the electrically conductive wires 2 in the individual layers 1 , 1 'and 1 "are arranged according to the electronic components to be used, such as circuits.
Gleiches gilt für die mustermäßige Einbindung der elek trisch leitfähigen Drähte 2 mit Hilfe unterschiedlicher textiler Bindungstechniken. Die Verbindung der Lagen 1, 1', 1" des textilen Flächengebildes nach Fig. 1 erfolgt im Prozeß der textilen Flächenbildung, wie durch Frottier-, Rips- und Samtbindung sowie durch spe zifische Jacquardtechnik erzeugte Bindungen - Matelassé- oder Cordbindung. Weiter ist es möglich, die textilen Flächengebilde durch Nähen sowie durch Webtechniken mit mehreren Fadensystemen zu verbinden - Multitextilien -. Beispiele sind mehrlagige Gewebe oder Abstandsgewirke. Die Mikrostruktur der elektrisch leitfähigen Drähte 2 innerhalb des textilen Flächengebildes gemäß Fig. 1 ent spricht der jeweiligen schaltungstechnischen Aufgabe. Hierzu sind die elektrisch leitfähigen Drähte 2 durch die textile Mustergestaltung mit unterschiedlichen Faden legungen funktionsgerecht angeordnet. Weiterhin sind zur Erzeugung der Mikrostruktur des textilen Flächen gebildes Mikrotrennstellen 3 und Mikroverbindungs stellen 4 zwischen den elektrisch leitfähigen Drähten 2 innerhalb einer der Lagen 1, 1', 1" sowie zwischen den Lagen 1, 1', 1" entsprechend des Schaltungsplanes vorgesehen. Die Mikrotrennstellen 3 entstehen beispiels weise durch mechanisches Durchtrennen der elektrisch leitfähigen Drähte 2 unter einem Mikroskop. Die Mikro verbindungsstellen 4 sind z. B. Lötstellen oder Klebe stollen mit elektrisch leitfähigen Verbindungswerkstoffen und dienen ausschließlich der elektrischen Kontaktierung.The same applies to the pattern integration of the electrically conductive wires 2 using different textile binding techniques. The layers 1 , 1 ', 1 "of the textile fabric according to FIG. 1 are connected in the process of textile fabric formation, such as terry, grosgrain and velvet weave as well as specific jacquard weaves - matelasse or cord weave. It is further It is possible to connect the textile fabrics with several thread systems by sewing and weaving techniques - multi-textiles - examples are multi-layer fabrics or spacer fabrics. The microstructure of the electrically conductive wires 2 within the textile fabric according to FIG the electrically conductive wires 2 are arranged in a functionally appropriate manner by means of the textile pattern design with different thread layers, and in order to produce the microstructure of the textile surface, micro-separation points 3 and micro-connection points 4 are formed between the electrically conductive wires 2 within one of the layers 1 , 1 ' , 1 "and between layers 1 , 1 ', 1 " according to the circuit diagram. The micro separation points 3 arise, for example, by mechanically cutting the electrically conductive wires 2 under a microscope. The micro connection points 4 are z. B. solder joints or adhesive cleats with electrically conductive connecting materials and serve only the electrical contact.
Im einfachsten Fall kann die in Fig. 2 dargestellte rechtwinklige Verkreuzung der elektrisch leitfähigen Drähte 2 vorliegen. In the simplest case, the right-angled crossing of the electrically conductive wires 2 shown in FIG. 2 can be present.
Innerhalb der Lagen 1 und 1' aus elektrisch isolierendem textilem Material sind die elektrisch leitfähigen Drähte 2 vorzugsweise in gleichmäßigen Abständen eingebunden. Die Mikrotrennstellen 3 und Mikroverbindungsstellen 4 dienen dem elektrischen Schaltungsaufbau. Die Ausläufer der textilen Struktur 5 in Form von Flottungen oder Maschen dienen der elektrischen Kontaktierung nach außen hin.Within the layers 1 and 1 'made of electrically insulating textile material, the electrically conductive wires 2 are preferably integrated at regular intervals. The micro separation points 3 and micro connection points 4 are used for the electrical circuit construction. The extensions of the textile structure 5 in the form of floats or meshes serve to make electrical contact with the outside.
Die Fig. 3 zeigt ein textiles Flächengebilde in Form eines bekannten zweilagigen Abstandsgewirkes. Obere Lage 6 und untere Lage 7 des Abstandsgewirkes werden durch ab standshaltende Fäden 8 fixiert. In bindungstechnisch durch Polfäden ausgeformten Hohlräumen zur Bauteilaufnahme 9 sind Elektronikbauteile 10 vor äußeren Einwirkungen geschützt eingefügt. Die elektrische Verdrahtung und Kontaktierung ist, wie bereits dargelegt, ausgeführt. Anstelle der Drähte 2 ist die Verwendung von elektrisch leitfähigen Fäden, wie metalli sierte textile Fäden oder organische leitfähige Materialien in linienförmiger Struktur möglich. Fig. 3 shows a textile fabric in the form of a known two-layer knitted spacer. Upper layer 6 and lower layer 7 of the knitted spacer fabric are fixed by abutment threads 8 . Electronic components 10 are inserted in a weave formed by pile threads for receiving components 9 so that they are protected from external influences. The electrical wiring and contacting is carried out, as already explained. Instead of the wires 2 , the use of electrically conductive threads, such as metallized textile threads or organic conductive materials in a linear structure, is possible.
Die Erfindung ermöglicht den Ersatz der gedruckten Leiterplatten und der Hybridschaltkreise durch den Einbau aktiver und passiver elektronischer Bauelemente in räumlichen textilen Strukturen, deren Ausläufer sich zur elektrischen Kontaktierung eignen und mustergemäß in den Schaltungsaufbau einbezogen sind.The invention enables the replacement of the printed PCBs and the hybrid circuits through the Installation of active and passive electronic components in spatial textile structures, the foothills of which suitable for electrical contacting and according to model are included in the circuit structure.
Das erfindungsgemäße textile Flächengebilde mit mikro strukturierter Verdrahtung ist besonders für den Ein satz in der miniaturisierten Maschinentechnik wegen der hohen Flexibilität und wegen der räumlichen Draht führung zur elektrischen Signalübertragung von Chip zu Chip und zu den Anschlüssen geeignet. The textile fabric according to the invention with micro structured wiring is especially for the one set in miniaturized machine technology because of the high flexibility and because of the spatial wire Guide to electrical signal transmission from chip suitable for chip and connections.
Die textile Mustergestaltung ermöglicht durch die Viel falt der unterschiedlichsten Bindungsformen den Aufbau textiler Flächengebilde zur Realisierung komplexer elektronischer Schaltungen unter Ausnutzung der late ralen Präzision und Reproduzierbarkeit des textilen Prozesses auch bei kleinen Stückzahlen.The textile pattern design made possible by the amount folds the most diverse types of weave textile fabrics for the realization of complex electronic circuits using the late ralen precision and reproducibility of the textile Process even with small quantities.
Anwendungsfelder der Erfindung sind die Ansteuerung bewegter Maschinenteile in der Elektromechanik, die flexible Verbindung zu Peripheriekomponenten, wie Tastaturen, Displays, Sensorarrays und Aktuatorsyste men, extrem platzsparende Konstruktionen für die Fahrzeugtelekommunikation, medizintechnische Applika tionen sowie der Ersatz für Motherboards durch ver teilte Elektronik. Es sind ungehäuste Chips entspre chend dem neuesten Stand der Miniaturisierung ein setzbar.Fields of application of the invention are control moving machine parts in electromechanics, the flexible connection to peripheral components such as Keyboards, displays, sensor arrays and actuator systems extremely space-saving constructions for the Vehicle telecommunications, medical technology applications tion and the replacement of motherboards by ver shared electronics. There are unhoused chips state of the art in miniaturization settable.
Die Erfindung ermöglicht die Chipanordnung auf engstem Raum und führt damit zu einer Reduzierung des Platz bedarfs der elektronischen Schaltungen.The invention enables the chip arrangement to be very narrow Space and thus leads to a reduction in space of electronic circuits.
Ein besonderer Vorteil der Erfindung besteht darin, daß das textile Flächengebilde mit mikrostrukturierter Verdrahtung lediglich aus Faden- und Drahtmaterial sowie verbindungstechnischen Zusatzwerkstoffen be steht, so daß bei seiner Herstellung im Gegensatz zu Schichtsubstrattechniken keinerlei schädliche Abfälle entstehen. A particular advantage of the invention is that that the textile fabric with microstructured Wiring only from thread and wire material as well as joining materials stands so that in its production in contrast no harmful to layered substrate techniques Waste arises.
11
, ,
11
', ',
11
" Lagen eines mehrschichtig aufgebauten
textilen Flächengebildes, bestehend
aus elektrisch isolierendem textilem
Material
"Layers of a multilayered textile fabric, consisting of electrically insulating textile material
22nd
elektrisch leitfähige Drähte
electrically conductive wires
33rd
Mikrotrennstelle
Micro separation point
44
Mikroverbindungsstelle
Micro liaison
55
Ausläufer der textilen Struktu
rierung
Extension of the textile structure
66
obere Lage des Abstandsgewirkes
upper layer of the spacer fabric
77
untere Lage des Abstandsgewirkes
lower layer of the spacer fabric
88th
abstandshaltende Fäden
spacing threads
99
Hohlraum zur Bauteilaufnahme
Cavity for receiving components
1010th
Elektronikbauteil
Electronic component
Claims (2)
- - dieses in permanent flexibler Struktur aus mehreren Lagen eines mehrschichtig aufgebauten textilen Flä chengebildes, bestehend aus elektrisch isolierendem textilem Material (1, 1', 1") in definierten Abständen und in unterschiedlichen Richtungen zueinander inner halb jeder Lage (1, 1', 1") angeordneten nach außen durch eingesetzte textile Bindungstechnik isolierten elektrisch leitfähigen Drähten (2) und/oder elektrisch leitfähigen Fäden und/oder organisch leitfähigen Materia lien in linienförmiger Struktur bindungsgemäß verarbei tet, besteht, wobei die mustermäßige Anordnung der elektrisch leitfähigen Drähte (2) in den einzelnen Lagen (1, 1', 1") der einzusetzenden elektronischen Komponenten und der eingesetzten Bindungstechnik entspricht.
- - die elektrisch leitfähigen Drähte (2) mittels von Mikrotrennstellen (3) und Mikroverbindungs stellen (4) in jeder Lage (1, 1', 1") einen ge wünschten Schaltungsaufbau darstellen.
- - Ausläufer der textilen Struktur (5) gemäß der Bindungstechnik der textilen Flächengebilde nach außen hin zur elektrischen Kontaktierung angeordnet sind.
- - This in a permanently flexible structure consisting of several layers of a multilayered textile fabric consisting of electrically insulating textile material ( 1 , 1 ', 1 ") at defined intervals and in different directions to each other within half of each layer ( 1 , 1 ', 1 ") arranged externally insulated by means of textile binding technology insulated electrically conductive wires ( 2 ) and / or electrically conductive threads and / or organically conductive materials in a linear structure according to the binding, the patterned arrangement of the electrically conductive wires ( 2 ) in corresponds to the individual layers ( 1 , 1 ', 1 ") of the electronic components to be used and the binding technology used.
- - The electrically conductive wires ( 2 ) by means of micro separation points ( 3 ) and micro connection points ( 4 ) in any position ( 1 , 1 ', 1 ") represent a desired circuit structure.
- - Foothills of the textile structure ( 5 ) according to the binding technique of the textile fabrics are arranged to the outside for electrical contacting.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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DE19755792A DE19755792C2 (en) | 1997-12-16 | 1997-12-16 | Textile fabric made of several interconnected fabric layers, some of which contain electrically conductive wires / threads |
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DE19755792A DE19755792C2 (en) | 1997-12-16 | 1997-12-16 | Textile fabric made of several interconnected fabric layers, some of which contain electrically conductive wires / threads |
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DE19755792A1 DE19755792A1 (en) | 1999-06-24 |
DE19755792C2 true DE19755792C2 (en) | 2001-05-17 |
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DE19755792A Expired - Fee Related DE19755792C2 (en) | 1997-12-16 | 1997-12-16 | Textile fabric made of several interconnected fabric layers, some of which contain electrically conductive wires / threads |
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DE10325883A1 (en) * | 2003-06-06 | 2004-12-30 | Infineon Technologies Ag | Process for contacting conductive fibers |
DE10318446A1 (en) * | 2003-05-26 | 2004-12-30 | Schoedel Gmbh | Jacquard-weave fabric has array of warp and weft threads that incorporate electrically conducting fibres with nodes at defined interval |
DE102004005017A1 (en) * | 2004-01-30 | 2005-09-01 | ASTRA Gesellschaft für Asset Management mbH & Co. KG | Textile material with antenna components of an HF transponder |
DE102004054223A1 (en) * | 2004-11-02 | 2006-05-11 | Ksw Microtec Ag | Multi-layer flexible printed circuit board with opposite flexible conductive structures and method for their production |
DE102006008796B3 (en) * | 2006-02-24 | 2007-12-27 | Interactive Wear Ag | Fixing device has inserting unit, device body surrounding hollow space partly, and signal transit section formed in front area of device body |
DE102007001225A1 (en) * | 2007-01-08 | 2008-07-10 | Future-Shape Gmbh | Surface covering element, surface covering element arrangement and method for producing a surface covering element |
DE102007054543A1 (en) * | 2007-11-15 | 2009-05-20 | GM Global Technology Operations, Inc., Detroit | Textile flat structure for heating device of motor vehicle, has upper and lower positions formed in electrically conductive manner, and heating conductor comes out from upper position and extending through intermediate position |
DE102007054541A1 (en) * | 2007-11-15 | 2009-05-20 | GM Global Technology Operations, Inc., Detroit | Flat structure for vehicle seat, has electrical conducting upper layer, electrical conducting lower layer and connecting element is formed as bending threads, where has thread core is provided with coating of semiconducting material |
CN102971841A (en) * | 2010-07-06 | 2013-03-13 | 原子能和代替能源委员会 | Method for assembling a chip in a flexible substrate |
DE102013015015A1 (en) | 2013-09-07 | 2015-03-26 | Textilforschungsinstitut Thüringen-Vogtland e.V. | Method and device on a ribbon loom for weaving and fixing strips of mixed materials |
DE102013113816A1 (en) | 2013-12-11 | 2015-06-11 | Leibniz-Institut Für Photonische Technologien | Electronic arrangement with a textile carrier substrate formed by longitudinal elements and transverse elements and method for its production |
WO2018081038A1 (en) * | 2016-10-24 | 2018-05-03 | University Of Louisville Research Foundation, Inc. | Anisotropic conductive threads for electrical connections in soft electronics |
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JP2003512734A (en) * | 1999-10-18 | 2003-04-02 | マサチューセッツ・インスティテュート・オブ・テクノロジー | Flexible electronic circuit and method of manufacturing the same |
DE10101429B4 (en) * | 2001-01-13 | 2006-02-02 | Wirtz, Markus M., Dr. | Lightweight element and method of making the same |
DE10161527A1 (en) | 2001-12-14 | 2003-07-03 | Infineon Technologies Ag | Construction and connection technology in textile structures |
CA2436131A1 (en) * | 2003-07-25 | 2005-01-25 | Intelligent Devices Inc. | Connecting flexible circuitry by stitching |
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Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10318446A1 (en) * | 2003-05-26 | 2004-12-30 | Schoedel Gmbh | Jacquard-weave fabric has array of warp and weft threads that incorporate electrically conducting fibres with nodes at defined interval |
DE10325883A1 (en) * | 2003-06-06 | 2004-12-30 | Infineon Technologies Ag | Process for contacting conductive fibers |
US7958713B2 (en) | 2004-01-30 | 2011-06-14 | ASTRA Gesellschaft für Asset Management mbH & Co. KG | Textile material with antenna components of an HF transponder |
DE102004005017A1 (en) * | 2004-01-30 | 2005-09-01 | ASTRA Gesellschaft für Asset Management mbH & Co. KG | Textile material with antenna components of an HF transponder |
DE102004054223A1 (en) * | 2004-11-02 | 2006-05-11 | Ksw Microtec Ag | Multi-layer flexible printed circuit board with opposite flexible conductive structures and method for their production |
DE102004054223B4 (en) * | 2004-11-02 | 2007-03-01 | Ksw Microtec Ag | Multi-layer flexible printed circuit board with opposite flexible conductive structures and method for their production |
DE102006008796B3 (en) * | 2006-02-24 | 2007-12-27 | Interactive Wear Ag | Fixing device has inserting unit, device body surrounding hollow space partly, and signal transit section formed in front area of device body |
DE102007001225A1 (en) * | 2007-01-08 | 2008-07-10 | Future-Shape Gmbh | Surface covering element, surface covering element arrangement and method for producing a surface covering element |
DE102007054543A1 (en) * | 2007-11-15 | 2009-05-20 | GM Global Technology Operations, Inc., Detroit | Textile flat structure for heating device of motor vehicle, has upper and lower positions formed in electrically conductive manner, and heating conductor comes out from upper position and extending through intermediate position |
DE102007054541A1 (en) * | 2007-11-15 | 2009-05-20 | GM Global Technology Operations, Inc., Detroit | Flat structure for vehicle seat, has electrical conducting upper layer, electrical conducting lower layer and connecting element is formed as bending threads, where has thread core is provided with coating of semiconducting material |
CN102971841A (en) * | 2010-07-06 | 2013-03-13 | 原子能和代替能源委员会 | Method for assembling a chip in a flexible substrate |
DE102013015015A1 (en) | 2013-09-07 | 2015-03-26 | Textilforschungsinstitut Thüringen-Vogtland e.V. | Method and device on a ribbon loom for weaving and fixing strips of mixed materials |
DE102013113816A1 (en) | 2013-12-11 | 2015-06-11 | Leibniz-Institut Für Photonische Technologien | Electronic arrangement with a textile carrier substrate formed by longitudinal elements and transverse elements and method for its production |
WO2018081038A1 (en) * | 2016-10-24 | 2018-05-03 | University Of Louisville Research Foundation, Inc. | Anisotropic conductive threads for electrical connections in soft electronics |
US10612172B2 (en) | 2016-10-24 | 2020-04-07 | University Of Louisville Research Foundation, Inc. | Anisotropic conductive treads for electrical connections in soft electronics |
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