DE19747388C1 - Contactless chip card manufacturing method - Google Patents

Abstract

The manufacturing method has a conductive adhesive (9) applied via a dosing device to the surface of an antenna contact surface (20) incorporated in the card body, for securing a chip module contact surface, the height of the applied conductive adhesive measured via an electrode (35) displaced perpendicular to the chip card surface, with a voltage applied across the antenna contact surface and the measuring electrode, for providing a voltage discharge in the gas-filled space between the measuring electrode and the deposited conductive adhesive. An Independent claim for a device for a manufacture of chip cards is also provided.

Description

The invention relates to a method and an apparatus for the production of chip cards.

Various ID cards are known, for which contact areas of a semiconductor chip module with contact areas must be tied that belong to a second component, that is already built into the body of the card. Such one second component can, for example, an antenna for a con tactless chip card. Such an arrangement is in described for example in DE 195 00 925 A1. The verb The contact surfaces can be formed by different conductors capable masses, for example with a conductive adhesive or The like take place on the by means of a metering device the contact surfaces of the component built into the card body is applied. Correct installation of the chip module in the card body while ensuring a flawless Only then is contact between the contact surfaces guaranteed performs when the conductive mass or the conductive adhesive in correct amount was applied so that the survey, which is formed by the conductive mass, always about is the same height (relative to the mounting surface). It is easy conceivable that too much conductive mass also to faulty contacts or a faulty Mon Daily result of the chip module in the card leads to one low dimensioning.  

DE 42 29 639 C1 describes a method and a device described for the production of EC cards. In doing so, a Microchip glued into a plastic card. As an adhesive a reaction liquid adhesive is used. Predetermined Individual amounts of the reaction liquid adhesive are by means of a Cannula as glue dots on the plastic card or the Microchip applied. Then the microchip is on the Glue dots put on. The volume of adhesive to be dispensed is determined by three setting variables for small individual quantities. These are the pressure with which the glue in the cannula is applied, the length of time in which the cannula Glue is fed, and the height of the cannula end over the order area. If a very small amount of adhesive the cannula end is very close to the Order area introduced. If the glue starts now To emerge from the end of the cannula is very quick Contact to the adhesive surface instead. Because of the low The viscosity of the adhesive spreads very quickly over a surface area of the adhesive surface, so that at a Interruption of the adhesive supply has already been defined The amount of adhesive sticks to the adhesive surface. If a bigger one The amount of adhesive to be dispensed will be corresponding greater distance between the cannula end and the adhesive surface chosen. This will immerse the cannula in the Prevents glue. Such pollution would Reduce the accuracy of subsequent gluing processes. The Height is determined either by measurement or Calibration of a position device with attached Cannula. The calibration for a large number of EC cards has the Disadvantage that the plastic cards are identical must and one after the other in exactly the same place have to be positioned. A concrete method of measurement the cannula height is not mentioned in DE 42 29 639 C1.  

After it in particular to the level of the conductive Mass formed elevation relative to the map body (or the arrives there for the chip module) arrives, an attempt was made to optically determine this height. Due to the Reflective properties and varying forms of the survey Such optical measurements are not practical. Wei purely mechanical scanning measurements are not possible, because during the height measurement the conductive mass still ver is malleable and in particular adheres to a stylus.

The invention has for its object a method and a device for the production of chip cards in this regard to show that a correct assembly of chip module and Chip card is ensured.

This task is carried out in a process in which min at least a first contact surface of a first component such as Chip module or the like with at least a second con tact area of a second provided in a card body Component such as antenna or the like via a conductive Mass such as conductive adhesive or the like is connected, the by means of a metering device on the second contact surface is applied, solved in that a measuring electrode in essentially perpendicular to the map body over the applied a mass is positioned, an electrical voltage between the second contact surface with the applied conductive capable mass and the measuring electrode is placed, the measuring elec trode in the direction of the applied conductive mass is moved, and that the height of the measuring electrode above the Kar body then to measure a height relative to the map body is determined when a discharge of electrical Voltage in the gas space between the measuring electrode and the conductive capable mass takes place. This procedure is despite its Simplicity amazingly precise and delivers considerably strong tiger signals than, for example, with a capacitive Distance measurement can be found. After the electric conductive mass under constant conditions using a Application system is applied are essentially kon  constant surface shapes of the applied mass respect, think highly of. This means that the only parameter that the Measurement result could falsify, in fluctuations of the Ioni Searchability of the surrounding gas is to be sought. But since one generally such card productions in air-conditioned Rooms with a relatively constant temperature and humidity carried out, these fluctuations play little Role, so that the achievable measurement result is sufficiently accurate is when you use air as the surrounding gas for the discharge is working.

You can now use a DC voltage or a high frequency Use AC voltage, which facilitate ionization of the Brings air. But is preferably used as an electrical Voltage an alternating voltage of lower frequency (20-30 kHz) used, the amplitude of the accuracy requirements is chosen relatively low, so that a Ent charge only at a relatively low (but constant) Distance between the measuring electrode and the conductive Mass takes place. On the one hand, this makes it quite high Accuracy of measurement achieved, on the other hand, those to the environment emitted electromagnetic interference low.

The electrical voltage is preferably non-contact, especially through influence or capacitively to the second Transfer the electrode with the applied conductive mass. So it is not necessary to have a direct electrical con clock to the component built into the card body.

The amount applied is preferably the amount applied regulated depending on the order size. Always then So if the measurement shows that the amount of the plotted Mass in the upper limit range (with a tendency to an over increase), the applied quantity of the applied mass reduced a little.  

In the case of a device for producing chip cards of this type, the above object is achieved by attaching the following devices:
A clamping device for clamping a card body in a defined position;
a measuring electrode, the height of which is adjustable relative to the clamping device and which can be moved in the direction of the second contact surface with the conductive mass applied to it;
a voltage generating device for generating an electric voltage between the measuring electrode and the conductive mass; and
a scanning device for determining an electrical discharge between the measuring electrode and the conductive mass and for registering the height of the measuring electrode relative to the clamping device at the time of the electrical discharge.

The voltage generating device preferably comprises one LF AC voltage source that is particularly easy to manufacture or is available on the market. The achievable measurement signals are very trouble-free.

The voltage generating device also preferably comprises have an electrically conductive section of the clamping direction as the opposite pole to the measuring electrode, the electrical conductive section in capacitive coupling to an elec trically conductive section of the second component at least is partially arranged closely adjacent. The invention The device is thus particularly well suited for production of contactless chip cards, in which the second component is an antenna.

In a preferred embodiment, the scanning stone comprises direction a measuring device by means of which the collapse of the  electrical voltage can be determined during a discharge. This can be, for example, a transformer in the electrical Connection line between the voltage source and the measuring electrode or a direct voltage tap via a Be resistance. In another preferred embodiment form of the invention, the scanning device comprises an elek trically conductive surface as a measuring electrode, which in kapaziti ver coupling to an electrically conductive section of the second component at least partially adjacent to this is arranged. This arrangement corresponds to the one before described arrangement in which the opposite pole of the Voltage generating device via a capacitive coupling is ensured. Preferably, the measuring elec trode formed in the jig. The Messelek trode and the electrically conductive section of the clamping device direction can either be opposite to each other because one side of the card body or side by side lying, each part of the antenna or the second building partly overlapping.

The scanning device preferably comprises a signal evaluation device for sensing a drop in voltage between the measuring electrode and the second contact surface is formed.

The scanning device preferably has a control output to control an application device for applying the Mass on the second contact surface so that the on support means a substantially constant amount of conductive mass to produce a predetermined on carrying height, measured for each card and with a Target height is compared so that the comparison result or the resulting deviation as a control signal for the Order facility is usable.

Preferred embodiments of the invention result from the subclaims.

The invention is described below with reference to exemplary embodiments len with reference to the accompanying drawing purifies. Show here

Fig. 1 is a plan view of the relevant part of a pre-machined chip card,

Fig. 2 shows a section along the line II-II of Fig. 1,

Fig. 3 is a view similar to FIG. 2 aufgetra gener conductive mass,

Fig. 4 is a cut-away view of the contact area with correctly-applied conductive mass,

Fig. 5 is a view corresponding to Fig. 4, but each conductive with an excessive amount of mass,

Fig. 6 is a view corresponding to Fig. 4 with an applied too little conductive mass,

Fig. 7 is a representation of the map section of FIG. 3, in a measuring device

Fig. 8 shows an equivalent circuit of a measuring arrangement under Ver application of the arrangement according to Fig. 7,

Fig. 9 shows another embodiment of the invention in a representation corresponding to that of FIGS. 7 and

Fig. 10 is an equivalent circuit diagram corresponding to that of FIG. 8 using the embodiment of the invention according to Fig. 9.

In the following description, the same and equivalent parts used the same reference numerals.  

In Fig. 1 is a plan view of a part of a card body 10 is shown, in the card surface 13 (see Fig. 2) a recess 11 is milled, which comprises a deeper receiving portion for receiving a chip module and a support surface 12 on which the chip module is glued with its contact frame. In the card body 10 , an antenna is embedded in a known manner, the conductor track 21 is indicated in Fig. 1 with a broken line. The conductor track 21 ends below the support surface 12 with a contact surface 20. A second end of the antenna coil with a further contact surface is also provided diagonally (relative to the recess 11 ) opposite to the support surface 12 of the contact surface 20 shown in FIG. 1, but not shown here.

In the area of the contact surfaces 20, holes 15 , 15 'are countersunk in the contact surface 12 such that the contact surfaces 20 are open from above, as shown in FIG. 2.

In order to install a chip module and connect it with its corresponding contacts with the contact surface 20 , an electrically conductive mass, in particular a conductive adhesive, is introduced into the bore 15 in the manufacture of the chip card such that it fills the bore 15 and over the Support surface 12 protrudes. The conductive mass is designated by the reference number 9 in FIG. 3.

In Fig. 4 it is shown what the application amount of the conductive mass 9 must look like, so that correct contacting and simultaneous bonding takes place when the chip module is put on. If too much conductive mass or conductive adhesive is applied, as shown in FIG. 5, it can escape laterally during the joining process, that is to say when the chip module is implanted, and contaminate the card surface. There can even be short circuits if chip modules are used which have a metal ring on the underside to protect the chip module from breakage and come into contact with the conductive ground. If, in turn, the order quantity is too small, as can be seen in FIG. 6, either there is no contact at all with the contact surfaces of the chip module or the connection is not mechanically stable enough.

A reliable criterion for determining the correct amount of conductive mass is the application height above the contact surface 12 and thus to the card surface 13 , since the depth of the recess 11 relative to the card surface 13 is constant (and known).

To measure now the application height of the conductive mass 9, the card body 10 is placed after application of the conductive mass 9 to the contact surface 20 with its underside 14 to a lifting cylinder 34, an isolated signal electrode is located on the surface 33 so that the Signalelek trode 33 comes to lie between the underside of the card 14 and the lifting stamp 34 . The lifting stamp 34 is - as indicated in FIG. 7 with an arrow - pressed together with the card body 10 against a contact surface 31 on the underside of a reference plate 30 , which is made of metal. In this fixed state of the card body 10, a measuring electrode 35 is Freile by a recess 11 in the card body 10 constricting opening 32 of the reference plate down 30 in the direction of the applied conductive ground by means of a Meßantriebs 36 to a drive motor M, as shown with a double arrow in the Fig indicated. 7 and 8. The position of the end face of the measuring electrode 35 , which lies opposite the applied mass 9 , is communicated after calibration of the measuring drive 36 via a measuring line 40 to an evaluation device 38 .

The measuring electrode 35 is connected to an output terminal of an LF voltage source 37 with a frequency of preferably 30-40 kHz, the other output terminal of which is grounded. The reference plate 30 is also grounded. The signal electrode 33 is in the embodiment shown in Fig. 8 exporting the measuring circuit via a resistor R to ground approximate shape and connected to the input of a sense amplifier V, whose output is connected via a signal line 39 to an input of the evaluation device 38th The ge in Fig. 7 showed ports A, B and C of the sensing electrode 35 and the reference plate 30 and the signal electrode 33 are drawn in the circuit in Fig. 8. Furthermore, it is indicated in Fig. 8 that the contact surface 20 , which is indeed one end of the antenna built into the card body 10 , can be understood as a capacitor plate, on the one hand the reference plate 30 and on the other hand the signal electrode 33 opposite. This "opposite" does not necessarily have to happen, as shown in Fig. 7, on the one hand from the card surface 13 and on the other hand from the underside 14 of the card, it can rather be according to the symbolic representation in Fig. 8, the arrangement such that both the signal electrode 33 connected to the measuring amplifier V and the reference plate 30 connected to ground are arranged on the same side (top or bottom) of the card body 10 , but each cover part of the built-in antenna body 10 in the card body 10 .

If the measuring electrode 35 is moved close enough to the electrically conductive mass 9 , there is a sparkover at every half-wave due to the charging of the arrangement due to influence or capacitive coupling, which causes the potential difference between the measuring electrode 35 and the electrically conductive mass 9 compensates. At an amplitude of about 100 volts, a sparkover occurs at a distance of about 100 microns between the measuring electrode 35 and the electrically conductive mass 9 . With an amplitude of the voltage source 37 of 10 volts, it is only about 10 μm. So the achievable measurement accuracy (especially at low voltages) is very high. When the spark discharge takes place, the capacitor formed by the signal electrode 33 and the antenna is also discharged, so that a current flows through the resistor R, which forms a pulse-shaped signal at the input of the amplifier V. The evaluation device 38 is now designed such that it holds the position of the measuring electrode 35 at the time at which the first discharge takes place. This value is then displayed via an actuating output 41 of the evaluation device 38 to an operator or is used directly to regulate the amount of conductive mass which is released by the application device present in the process. By comparison with a target value, the order quantity can then be regulated in such a way that the order quantity shown in FIG. 4 is always delivered.

The embodiment of the invention shown in FIGS . 9 and 10 differs from that just described in that no signal electrode 33 is provided, but rather the current flowing at sparkover by means of a measuring resistor RM in a manner known per se as a voltage drop from the measuring amplifier V is scanned.

The method shown here or the arrangement shown here is always applicable if a sufficiently large ladder track embedded in or placed on the card body is, so that a charge by influenza or capacitive Coupling can be accomplished. It is particularly suitable but the procedure if in (or on) a card body are arranged by antenna coils, both wound as well as printed or etched antennas like this itself are known.

Reference list

9

electrically conductive mass

10th

Card body

11

Recess

12th

Contact surface

13

Map surface

14

Card bottom

15

,

15

'Drilling

20th

second contact area

21

Conductor track

30th

Reference plate

31

Contact surface

32

opening

33

Signal electrode

34

Lifting stamp

35

Measuring electrode

36

Measuring drive

37

Voltage source

38

Evaluation device

39

Signal line

40

Measurement line

41

Control output

Claims (13)

1. A method for producing chip cards, in which at least a first contact surface of a first component such as a chip module or the like with at least a second contact surface of a second component provided in or on a card body such as an antenna or the like via an electrically conductive mass such as conductive adhesive or the like verbun, which is applied by means of a metering device to the second contact surface, characterized in that a measuring electrode ( 35 ) is positioned substantially perpendicular to the body ( 10 ), above the applied mass ( 9 ), an electrical voltage between the second con tact surface ( 20 ), with the applied electrically conductive mass and the measuring electrode is placed, the measuring electrode is moved in the direction of the applied electrically conductive mass, and that the height of the measuring electrode above the card body then for measuring an order height of the electrical h conductive mass relative to the card body is determined when a discharge of the elec trical voltage in a gas space between the measuring electrode and the electrically conductive mass takes place. 2. The method according to claim 1, characterized, that the electrical voltage is an AC voltage, is preferably a low frequency AC voltage.   3. The method according to claim 2, characterized, that the AC voltage has a frequency of less than 100 kHz, preferably has 20-30 kHz. 4. The method according to any one of the preceding claims, characterized, that the electrical voltage is contactless, in particular the other by capacitive coupling to the second electrode with the applied electrically conductive mass over will wear. 5. The method according to any one of the preceding claims, characterized, that the order quantity of the applied electrically conductive capable mass depending on the order size is valid. 6. Device for the production of chip cards, wherein at least a first contact surface of a first component such as that of a chip module or the like with at least a second contact surface of a second component provided in or on a card body such as antenna or the like via an electrically conductive mass such as conductive adhesive or The like is connected, which is applied to the second contact surface by means of a metering device, comprising

• 1. a clamping device ( 30 , 34 ) for clamping a card body ( 10 ) in a defined position;
• 2. a measuring electrode ( 35 ), the height of which relative to a clamping device ( 30 , 34 ) can be defined in a defined manner (measuring drive 36 , M) and in the direction of the second contact surface ( 20 ) with an electrically conductive composition ( 9 ) applied thereon is movable;
• 3. a voltage generating device ( 30 , 37 ) for generating an electrical voltage between the measuring electrode ( 35 ) and the mass ( 9 );
• 4. a scanning device (33, R, V, 38; RM) for establishing an electrical discharge between the measuring electrode ( 35 ) and the electrically conductive mass ( 9 ) and for registering the height of the measuring electrode ( 35 ) relative to the jig for Time of electrical discharge.

7. The device according to claim 6, characterized in that the voltage generating device comprises an AC voltage source ( 37 ), preferably an LF AC voltage source. 8. The device according to claim 7, characterized, that the AC voltage source has a frequency of below 100 kHz, preferably 20-30 kHz. 9. Device according to one of claims 6 to 8, characterized in that the voltage generating device comprises an elec trically conductive section ( 31 ) of the Einspannvor direction ( 30 , 34 ) as the opposite pole to the measuring electrode ( 35 ), the electrically conductive section ( 31 ) in capacitive coupling an electrically conductive section from the second component is at least partially arranged adjacent. 10. Device according to one of claims 6 to 9, characterized in that the scanning device comprises an electrically conductive surface as a measuring electrode ( 35 ) which is at least partially adjacent in capacitive ver coupling to an electrically conductive portion of the second component. 11. The device according to claim 10, characterized in that the measuring electrode ( 35 ) is formed in the clamping device ( 30 , 34 ). 12. Device according to one of claims 6 to 11, characterized in that the scanning device comprises a Signalauswertein direction (V, 38 ) which is designed to sense a drop in the voltage between the measuring electrode ( 35 ) and the second contact surface ( 20 ). 13. Device according to one of claims 6 to 12, characterized in that the scanning device ( 38 ) has a control output ( 41 ) for controlling an application device for applying the electrically conductive mass ( 9 ) on the second contact surface ( 20 ) in such a way that a wesent union constant amount of the electrically conductive mass ( 9 ) for generating a predetermined order amount is portable.