DE19642627C2 - Fine soldering device - Google Patents

Fine soldering device

Info

Publication number
DE19642627C2
DE19642627C2 DE19642627A DE19642627A DE19642627C2 DE 19642627 C2 DE19642627 C2 DE 19642627C2 DE 19642627 A DE19642627 A DE 19642627A DE 19642627 A DE19642627 A DE 19642627A DE 19642627 C2 DE19642627 C2 DE 19642627C2
Authority
DE
Germany
Prior art keywords
solder
soldering
wire
soldering wire
solder joint
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE19642627A
Other languages
German (de)
Other versions
DE19642627A1 (en
Inventor
Frank Bergler
Uwe Kaeuffert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE19642627A priority Critical patent/DE19642627C2/en
Publication of DE19642627A1 publication Critical patent/DE19642627A1/en
Application granted granted Critical
Publication of DE19642627C2 publication Critical patent/DE19642627C2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/02—Soldering irons; Bits
    • B23K3/029—Solder or residue removing devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0227—Rods, wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0195—Tool for a process not provided for in H05K3/00, e.g. tool for handling objects using suction, for deforming objects, for applying local pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0415—Small preforms other than balls, e.g. discs, cylinders or pillars
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/046—Means for drawing solder, e.g. for removing excess solder from pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

Die vorliegende Erfindung bezieht sich auf eine Einrich­ tung und ein damit verbundenes Verfahren zum Herstellen von Lötverbindungen, vorzugsweise in der Elektronikindu­ strie. Insbesondere das manuelle Löten von elektronischer Bausteinen mit vielen, eng beieinander liegenden Anschlüs­ sen ist zeitaufwendig und führt häufig zu Kurzschlüssen.The present invention relates to a device device and an associated method for manufacturing of soldered connections, preferably in the electronics industry streaked. In particular, manual soldering of electronic ones Modules with many, closely spaced connections sen is time consuming and often leads to short circuits.

Bekannt sind Verfahren wie z. B. Reflow-Löten, welches vor allem bei größeren Serien eingesetzt wird oder mauelles Löten mit einer Feinlötspitze. Seit kurzem wird ein Verfah­ ren angeboten, wo Lötzinn in einer speziell ausgeformten Lötspitze über die Anschlußbeinchen gezogen wird.Methods such as z. B. reflow soldering, which especially used in larger series or mauelles Soldering with a fine soldering tip. A procedure has recently started offered where solder in a specially shaped Soldering tip is pulled over the connecting legs.

Aufgabe der vorliegenden Erfindung ist es, eine Möglich­ keit zu schaffen, um eng beieinander liegende Lötstellen schnell, fehlerfrei und ohne besondere Vorkenntnisse zu lö­ ten.The object of the present invention is one possible to create tightly spaced solder joints fast, error-free and without special previous knowledge ten.

Diese Aufgabe wird erfindungsgemäß dadurch gelöst, daß sowohl Lötzinn als auch Lötsauglitze in entsprechender Abstimmung gemeinsam an die Lötstelle herangeführt und erhitzt werden. Dadurch wird zunächst die Lötstelle voll­ ständig mit Lötzinn benetzt; durch die Lötsauglitze wird überschüssiges Lötzinn wieder entfernt. Das erfindungsge­ mäß ausgestaltete Lötzinn kann an viele Anschlüsse gleich­ zeitig herangeführt und erhitzt werden. Evtl. kann hierzu eine besonders breite Lötspitze eingesetzt werden um so eine ganze Seite eines ICs in einem Arbeitsgang zu löten.According to the invention, this object is achieved by that both solder and soldering wire in a corresponding Coordination led to the solder joint and be heated. This will fill the solder joint first constantly wetted with solder; through the soldering wire Excess solder removed. The fiction Properly designed solder can be used on many connections be brought in early and heated. Possibly. can do this a particularly wide soldering tip can be used all the more solder an entire side of an IC in one operation.

Im Folgenden wird die Erfindung anhand eines Ausfüh­ rungsbeispiels für das Löten eine quadratischen fine-pitch Bauteils erläutert.In the following the invention is based on an embodiment Example of soldering a square fine pitch Component explained.

Folgende Figuren zeigen:The following figures show:

Fig. 1 Lötvorgang, Fig. 1 soldering process,

Fig. 2 erfindungsgemäße Ausführung des Lötmittels. Fig. 2 inventive execution of the solder.

Das erfindungsgemäß realisierte Lötmittel (LM) besteht aus Lötzinn (LZ) und Lötsauglitze (LS) in geeigneter Ab­ stimmung; d. h. die Menge des Lötzinns ist für optimale Lötstellen bemessen, die Menge an Lötsauglitze gewährlei­ stet vollständige Entfernung überschüssigen Lötzinns.The solder (LM) realized according to the invention exists from solder (LZ) and soldering wire (LS) in a suitable Ab Mood; d. H. the amount of solder is for optimal Dimension the solder joints, ensure the amount of soldering suction strands constantly removing excess solder.

Beim Erhitzen des Lötmittel (LM) an der Lötstelle fließt zunächst das Lötzinn (LZ) und stellt die Lötverbindung her. Die Lötsauglitze (LS) nimmt im selben Arbeitsgang über­ schüssiges Lötzinn auf. Das verbrauchte Lötmittel (LM) wird von der Lötstelle entfernt und ein neues Stück Lötmit­ tel (LM) wird an die nächsten zu lötenden Anschlüsse her­ angeführt.When the solder (LM) is heated at the soldering point, it flows first the solder (LZ) and make the solder connection. The soldering suction wire (LS) takes over in the same operation putty solder on. The used solder (LM) is removed from the solder joint and a new piece of solder tel (LM) is connected to the next connections to be soldered cited.

Claims (9)

1. Verfahren zur Herstellung einer Lötverbindung, dadurch gekennzeichnet, daß Lötzinn und Lötsauglitze gemeinsam an die Lötstelle herangeführt und erhitzt werden.1. A method for producing a solder joint, characterized in that solder and soldering wire are brought together to the solder joint and heated. 2. Verfahren nach nach Anspruch 1, dadurch gekennzeichnet, daß flußmittelhaltiges Lötzinn verwendet wird.2. The method according to claim 1, characterized in that flux-containing solder is used. 3. Verfahren nach nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, daß flußmittelhaltige Lötsauglitze verwendet wird.3. The method according to any one of the preceding claims, characterized characterized in that flux-containing soldering wire is used. 4. Verfahren nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, daß das Heranführen von Lötzinn und Lötsauglitze an die Lötstelle maschinell erfolgt.4. The method according to any one of the preceding claims, characterized characterized in that the introduction of solder and soldering wire done mechanically to the solder joint. 5. Verfahren nach nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, daß das Heranführen von Lötzinn und Lötsauglitze an die Lötstelle manuell erfolgt.5. The method according to any one of the preceding claims, characterized characterized in that the introduction of solder and soldering wire to the soldering point manually. 6. Vorrichtung zur Durchführung des Verfahrens nach einem der vorangehenden Ansprüche, dadurch gekennzeichnet, daß Lötzinn und Lötsauglitze miteinander verbunden sind.6. Device for performing the method according to one of the preceding claims, characterized in that solder and Soldering suction wires are interconnected. 7. Vorrichtung nach Anspruch 6, dadurch gekennzeichnet, daß Lötzinn und Lötsauglitze so miteinander verbunden sind, daß sie in einem Arbeitsgang gemeinsam an die Lötstelle herangeführt und dort erhitzt werden können. 7. The device according to claim 6, characterized in that solder and soldering wire are connected so that they are in one Work step brought together to the solder joint and heated there can be.   8. Vorrichtung nach Anspruch 6 oder 7, dadurch gekennzeichnet, daß Lötzinn und Lötsauglitze so miteinander verbunden sind, daß sie in einem Arbeitsgang kurz hintereinander an die Lötstelle herangeführt werden können.8. The device according to claim 6 or 7, characterized in that Soldering tin and soldering wire are connected so that they are in one step shortly after the solder joint can be. 9. Vorrichtung nach nach einem der Ansprüche, dadurch gekennzeichnet, daß sich das Lötzinn im Innern der Lötsauglitze befindet.9. Device according to one of the claims, characterized in that that the solder is inside the soldering wire.
DE19642627A 1996-10-16 1996-10-16 Fine soldering device Expired - Fee Related DE19642627C2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19642627A DE19642627C2 (en) 1996-10-16 1996-10-16 Fine soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19642627A DE19642627C2 (en) 1996-10-16 1996-10-16 Fine soldering device

Publications (2)

Publication Number Publication Date
DE19642627A1 DE19642627A1 (en) 1998-04-30
DE19642627C2 true DE19642627C2 (en) 1999-12-02

Family

ID=7808880

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19642627A Expired - Fee Related DE19642627C2 (en) 1996-10-16 1996-10-16 Fine soldering device

Country Status (1)

Country Link
DE (1) DE19642627C2 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0604966A1 (en) * 1992-12-28 1994-07-06 Plato Products, Inc. Desoldering wick
JPH08215835A (en) * 1995-02-13 1996-08-27 Sony Corp Solder sucking device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0604966A1 (en) * 1992-12-28 1994-07-06 Plato Products, Inc. Desoldering wick
JPH08215835A (en) * 1995-02-13 1996-08-27 Sony Corp Solder sucking device

Also Published As

Publication number Publication date
DE19642627A1 (en) 1998-04-30

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8125 Change of the main classification

Ipc: B23K 1/00

D2 Grant after examination
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee