DE3040315A1 - Testing attachment of electronic chips to circuit boards - by ultrasonic testing, involving mechanical contact with ultrasonic vibrator on either side of board - Google Patents

Testing attachment of electronic chips to circuit boards - by ultrasonic testing, involving mechanical contact with ultrasonic vibrator on either side of board

Info

Publication number
DE3040315A1
DE3040315A1 DE19803040315 DE3040315A DE3040315A1 DE 3040315 A1 DE3040315 A1 DE 3040315A1 DE 19803040315 DE19803040315 DE 19803040315 DE 3040315 A DE3040315 A DE 3040315A DE 3040315 A1 DE3040315 A1 DE 3040315A1
Authority
DE
Germany
Prior art keywords
testing
board
circuit board
ultrasonic
components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19803040315
Other languages
German (de)
Inventor
Leopold 8071 Lenting Schätz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefunken Electronic GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Priority to DE19803040315 priority Critical patent/DE3040315A1/en
Publication of DE3040315A1 publication Critical patent/DE3040315A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M99/00—Subject matter not provided for in other groups of this subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N19/00—Investigating materials by mechanical methods
    • G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A method of testing printed circuit boards enables evaluation of the attachment of electronic chip components mounted on the board. It is easily applied manually or automatically and gives highly reliable evaluation results. The method involves subjecting the printed circuit board to ultrasonic processing. This is achieved by bringing the printed circuit board into mechanical contact with an ultrasonic vibrator on the side of the board which does not carry the electronic components. The components are first glued to the board and the soldered. The attachment testing is performed in between gluing the components and soldering. Alternatively, the testing can be performed after soldering. All chips which are not adequately attached are removed by the processing which can be performed on a series of components.

Description

Beschreibungdescription

Verfahren zum Prüfen von Leiterplatten Die vorliegende Erfindung betrifft ein Verfahren zum Prüfen der Haftfestigkeit von auf einer Leiterplatte befestigten chipförmigen elektrischen Bauelementen.Methods of Inspecting Printed Circuit Boards The present invention relates to a method for testing the adhesive strength of fasteners mounted on a printed circuit board chip-shaped electrical components.

Es ist bereits bekannt, Leiterplatten mit chipförmigen Bauelementen zu bestücken. Die Aufbringverfsbren besteben im wesentlichen darin, daß diese Chips zunächst an der Leiterplatte angeklebt werden, um in einem nachfolgenden Löt-Tauch-Verfahren an die Leiterbahnen angelötet angelötot zu werden.It is already known, circuit boards with chip-shaped components to equip. The Aufbringverfsbren consist essentially in the fact that these chips first to be glued to the circuit board in order to be used in a subsequent soldering-immersion process to be soldered to the conductor tracks.

Von großer Bedeutung ist eine Überprüfung der Haftfestigkeit der chipförmigen Bauelemente, insbesondere in dem Verfahrensstadium, in dem die Chips an der Leiterplatte angeklebt sind. Schlechte Klebungen können dazu führen, daß während des Lötens Chips von der Leiterplatte heruntergespült werden, wodurch nicht nur unbrauchbare Leiterplatten entstehen, sondern auch eine unerwünschte verunreinigung des Lötbades mit Chips erfolgt.It is of great importance to check the adhesive strength of the chip-shaped Components, especially in the process stage in which the chips are attached to the circuit board are glued on. Bad bonds can cause chips to appear during soldering washed down from the circuit board be what not only unusable circuit boards are created, but also undesirable contamination of the solder bath is done with chips.

)er vorliegenden erfindung liegt die Aufgabe zugrunde ein Prüfverfahren der eingangs genannten Art anzugeben, das sowohl manuell als auch machinell leicht durchführbar ist und eine hohe Zuverlässigkeit besitzt. ) he present invention is based on the task of a test method Specify the type mentioned above, which is easy both manually and machinell is feasible and has high reliability.

Diese Aufgabe wird erfindungsgemäß dadurch gelöst, daß die Leiterplatte einer Ultraschalbehandlung ausgesetzt wird.According to the invention, this object is achieved in that the circuit board is subjected to ultrasound treatment.

1) i.e Vorteile der Erfindung sind besonders darin zu sehen, daß die Ultraschalbchandlung sowohl manuell als auch automatisch im Zuge eines Fortigungsbandes mit einfachen Mitteln durchzuführen ist und daß dieses Verfahren eine hohe Zuverlössigkeit gewöhrleistet, da alle nicht hinreichend befestigten Chips bei dieser Ultraschallbehandlung abspringen. Ein weiterer Vorteil der Erfindung ist die Vielseitigkeit seiner Anwendung, nömlich wenngleich das beschriebene Verfahren bevorzugt in dem Zwischenstadium anwendbar ist, in welchem die Chips schon. angeklebt, aber noch nicht angelötet sind so eingnet es sich auch zur Prüfung der Haftestigkeit von bereits angelöteten Chips.1) i.e advantages of the invention are particularly to be seen in the fact that the Ultrasonic treatment both manually and automatically in the course of a continuation belt can be carried out with simple means and that this process is highly reliable ensures that all chips that are not adequately attached during this ultrasonic treatment jump off. Another advantage of the invention is the versatility of its application, Namely, although the method described can preferably be used in the intermediate stage is in which the chips already. glued on, but not yet soldered on are so wetted it can also be used to test the adhesion of chips that have already been soldered on.

Anhand des in der Figur schematischen dargestellten Ausführungsbeispiels wird die Erfindung nachfolgend näher erklärt.On the basis of the exemplary embodiment shown schematically in the figure the invention is explained in more detail below.

Mit 1 ist eine Leiterplatte bezeichnet, auf deren einem Seite chipförmige Bauelemente 2 befestigt sind. Diese Lei-@erplatte i wird mit -ihrer freien Oberflächenseite gegen einen Ultraschallschwingkopf 3 gedrückt. Befinden sich unter den aufgebrachten Chips 2 welche, die z.B. durch verwendung eines unbrauchbaren Klebers oder zu geringer Aushärtung nicht binreichned auf der Leiterplatte befestigt sind, so springen diese von der Leiterplatte herunter. die Chips, die auf der leiterplatte verbleiben, sind in aller Regel so fest befestigt, daß sie durch das nachfolgende Lötbad nicht von der Platine heruntergespült werden können.1 with a circuit board is referred to, on one side of which is chip-shaped Components 2 are attached. This circuit board i is with its free surface side pressed against an ultrasonic oscillating head 3. Are among the applied Chips 2 which are e.g. use of an unusable adhesive or insufficient curing are not attached to the circuit board in a bin-rich manner, so they jump off the circuit board. the chips that are on the circuit board remain, are usually so firmly attached that they are through the following The solder bath cannot be flushed down from the circuit board.

L e e r s e i t eL e r s e i t e

Claims (5)

Patenatnsprüche 1. Verfahren zum Prüfen der Haftfestigkeit von auf einer Leiterplatte befestigten chipförmigen elektrischen Bauelementen, dadurch gekennzeichnet, daß die Leiterplatte einer Ultraschalbehandlung ausgesetzt wird. Patent claims 1. Method for testing the adhesive strength of on Chip-shaped electrical components attached to a printed circuit board, characterized in that that the circuit board is subjected to an ultrasonic treatment. 2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß die Leiterplatte mit einem Ultraschallschwinger in mechanischen Kontakt gebracht wird. 2. The method according to claim 1, characterized in that the circuit board is brought into mechanical contact with an ultrasonic transducer. 3. Verfahren nach Anspruch 2, dadurch gekennzeichnet, daß die Leiterplatte mit ihrer nicht mit den chipförmigen Bauelementen bestückten Seite mit einem Ultraschallschwinger in mechanischen Kontakt gebracht wir. 3. The method according to claim 2, characterized in that the circuit board with their side not equipped with the chip-shaped components with an ultrasonic transducer we brought into mechanical contact. 4. Verfahren nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, daß die chipförmigen Bauelemente zunächst mit einem Kleber auf der Leiterplatte befestigt und dann durch Löten befestigt we den und daß die Prtifnng der Haftfestigkeit an den Lei t.elplatten mit den angeklebten aber noch nicht angelötten chipförmigen Bauelementen vorgenommen wird. 4. The method according to any one of claims 1 to 3, characterized in that that the chip-shaped components first with an adhesive on the circuit board attached and then through Soldering is attached and that the test the adhesive strength on the circuit board with the glued on but not yet soldered on chip-shaped components is made. 5. Verfahren nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, daß die Prüfung der Haftfestigkeit an den Leiterplatten mit den angelöteten chipförmigen Bauelementen vorgenommen wird. 5. The method according to any one of claims 1 to 4, characterized in that that the test of the adhesion to the circuit boards with the soldered chip-shaped Components is made.
DE19803040315 1980-10-25 1980-10-25 Testing attachment of electronic chips to circuit boards - by ultrasonic testing, involving mechanical contact with ultrasonic vibrator on either side of board Withdrawn DE3040315A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19803040315 DE3040315A1 (en) 1980-10-25 1980-10-25 Testing attachment of electronic chips to circuit boards - by ultrasonic testing, involving mechanical contact with ultrasonic vibrator on either side of board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19803040315 DE3040315A1 (en) 1980-10-25 1980-10-25 Testing attachment of electronic chips to circuit boards - by ultrasonic testing, involving mechanical contact with ultrasonic vibrator on either side of board

Publications (1)

Publication Number Publication Date
DE3040315A1 true DE3040315A1 (en) 1982-05-27

Family

ID=6115186

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19803040315 Withdrawn DE3040315A1 (en) 1980-10-25 1980-10-25 Testing attachment of electronic chips to circuit boards - by ultrasonic testing, involving mechanical contact with ultrasonic vibrator on either side of board

Country Status (1)

Country Link
DE (1) DE3040315A1 (en)

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Legal Events

Date Code Title Description
8127 New person/name/address of the applicant

Owner name: TELEFUNKEN ELECTRONIC GMBH, 7100 HEILBRONN, DE

8139 Disposal/non-payment of the annual fee