DE19610507A1 - Smart card e.g. for data transactions - Google Patents

Abstract

The smart card has a main body 49 formed as a laminated structure and formed in this is a rectangular recess 59 into which is embedded an integrated circuit chip module 50. The chip has contact pads on the outer surface that can be used for communication purposes. The underside of the chip has contacts 54 that connect with the ends of a inductive coil track 56 that is formed as planar arrangement. This allows non contact exchange of data between the card and a terminal.

Description

The present invention relates to a chip card in various embodiments. On the one hand, the present invention relates to a chip card for contacts Access to a chip arranged in a chip module, the chip module being a recess of a card body is arranged that contact surfaces of the Chipmo duls are arranged on the surface of the card body. Such smart cards are known for example as so-called "telephone cards".

On the other hand, the present invention relates to a chip card for contactless access on a chip or a chip module, the chip or the chip module for training a transponder unit arranged together with a coil in a card body is and conductor ends of the coil on pads of the chip or the chip module are contacted. Such chip cards are called "transponder cards" referred to, which are used for example for personal identification.

In addition, the present invention relates to a chip card for contacts and contactless access to a chip arranged in a chip module, wherein the Chip module is arranged in a recess of a card body that outer  Contact surfaces of the chip module are arranged on the surface of the card body and inner contact surfaces of the chip module to form a transponder unit with Conductor ends of a coil arranged in the card body are connected. Such Chip cards are referred to as so-called "combicards" or "hybrid cards", because on the one hand they have direct contact access to the chip module and on the other contactless access to the chip module by means of the coil acting as an antenna enable.

With all of the aforementioned chip cards, it proves to be independent of the respective gene embodiment as essential for the functional reliability of the chip card that a secure contact access to the chip or the chip module is possible. With chip cards of the type which is provided with a chip module and has contact-based access to outward-facing pads of the chip module are special Measures are required to ensure the defined fit of the chip module and thus also the Positioning the outer pads relative to the card body despite the To maintain chip cards frequently changing bending stresses. A particular problem is that the chip module due to its arrangement voltage in the card body at a distance from the so-called "neutral fiber" at a bending bend stress with the maximum occurring in the surface area of the card body Bending stress is applied. The chip module is in a recess in the card secured by gluing.

To prevent delamination in the area between the interface Glue and the card body comes, which is a detachment of the chip module from the card body per result, it is known to arrange a metal ring on the chip module, which creates a certain anchorage in the card body and thus the card body in the Area of the chip module stiffened.

Regardless of the particular embodiment of the chip card, the present one Invention based on the object of proposing measures in relation to the a chip card frequently occurring changing dynamic bending loads  Increase the functional reliability of the chip card.

In the case of a chip card for contact-based access, the solution to this problem is as follows Features of claim 1.

According to the invention, the card body is in the region of the recess with a Laminated stiffening device extending card longitudinal direction.

In contrast to the known stiffening device outlined above, the one represents an integral part of the chip module, the stiffening according to the invention device independent of the chip module and is already in the manufacture of the Card body integrated into this before the recess for receiving the Chipmo duls is introduced into the card body. From the one in the card body for example laminated arrangement of the stiffening device results in an improved Anchoring in the card body. In addition, it is possible to have a standardized To use stiffener that is not exactly the dimensions of the Chip module must be matched, as in the one piece with the chip module the known ring-shaped stiffening device is the case.

In the event that the card body in a different process than by means of the laminate technology is manufactured - for example manufactured in a spraying process Card body -, it is by appropriate arrangement of the stiffening device in a form also possible to the advantageous integrated in the card body Arrange the stiffening device. The essential is in any case integral arrangement of the stiffening device in the card body, without limitation to a specific manufacturing process of the card body.

In an advantageous embodiment, the stiffening device is as a stiffener tion frame formed, the frame parts at a distance from the edges of the recess are arranged in the card body. This embodiment enables one over the  Card cross section uniformly acting stiffening device with simultaneous Arrangement of the stiffening device in the plane of the chip module.

However, there is also the possibility that the stiffening device at least has an elongated stiffening element that is spaced from one in cards longitudinally extending edge of the recess adjacent to the recess is. In this case, there is again a symmetrically acting stiffening device with arrangement of one stiffening element on opposite sides the recess.

In the case of a chip card for contactless access, the solution faces that of the invention deliegen task the features of claim 4.

According to the invention, the card body is spaced apart from the chip or chip module Arranged stiffening device provided, which is in a covering position with the chip or chip module or in a peripheral position to the chip or chip module located.

This solution is based on the idea that it is a contactless chip card Access to maintain functional safety despite frequently changing dynamics shear bending stress that depends on the bending stress Contacting the coil conductor ends with the pads of the chip or Protect chip module. This is achieved according to the invention in that the area of the card body that surrounds the contacting area is stiffened. Hereby the harmful bending loads are kept away from the contact points. This can either by a led over the chip or the chip module and thus in a stiffening device arranged overlapping to the chip or chip module take place or on the other hand by an arrangement peripheral to the chip or to the chip module stiffening device.  

The stiffening device according to the invention also has an effect during manufacture protection of the chip card in the lamination process for the chip module or for the Contact points between the chip module and the conductor ends of the coil. Especially the loads occurring during the lamination process are at least partially taken up by the stiffening device.

According to a particular embodiment, the stiffening device is a Chip or the chip module enclosing stiffening frame formed with through breaks or recesses is provided, which crosses the stiffening frame Permitting arrangement of the conductor ends.

In addition to the stiffening function, the stiffening device can also perform the function come a contact device that for the electrically conductive connection between the conductor ends of the coil and the contact surfaces of the chip or chip module is used. This further function of the stiffening device proves to be particularly good advantageous if the coil is not, for example, laid on a laminate layer Acting coil, but rather a previously separately wound coil, the conductor ends are connected to the pads of the chip or the chip module have to. Here, by using the stiffening device as a contact direction increased contact areas are created.

In the above case, it proves to be particularly advantageous if the reinforcement tion device as a two-part Ver enclosing the chip or the chip module stiffening frame is formed, each having a frame part a pad of Connects chips or chip module with a conductor end of the coil.

In the case of a chip card that is suitable for both a contact and a contactless Sen access is determined, the solution to the problem underlying the invention the features of claim 8.  

According to the invention, the coil is designed as a wire coil and the recess for Recording the depth of the chip module so dimensioned that in the region of the recess arranged wire ends one through the machining process to produce the Have recess formed contact flat.

This solution is based on the idea of the functional reliability of such Chip card to increase that the contact points between the conductor ends the coil and the pads of the chip module more resistant to changing dynamic bending load can be designed. According to the invention, this is done by that the contacting areas between the conductor ends and the pads be designed as large as possible. Because the contact between the connector surfaces of a chip module inserted in a recess of the card body and the Conductor ends of a coil is usually done with a conductive adhesive, it happens to ensure that the contact surfaces in adhesive contact with one another are as large as possible shape. It also proves to increase resistance to Bending loads on the adhesive connection as advantageous if the adhesive connection if possible in a connection plane parallel to the card surface.

This solution takes advantage of a high-frequency coil in the Use diameter of relatively strong coil wire, the thickness of which is usually between 100 and 200 microns. So there is sufficient for the formation of a flattening Material thickness available (about half the wire thickness). On one Tolerance of this order of magnitude can be achieved in a milling machine, for example the depth of penetration of the milling tool into the card body with little Easily adjust accuracy requirements. In this way they become Resistance to bending increased contact areas on the Conductor ends of the coil take place during the formation of the recess anyway end the milling process.

Although milling is certainly a particularly easy to implement, because convents The type of processing is the processing method to make an exception  tion with simultaneous formation of the flattening at the conductor ends of the coil manufacture, not limited to milling.

Another solution to the problem of increasing functional safety at a Chip card that is used for both contact and contactless access is determined, has the features of claim 10.

According to the invention, a starting device is provided for this purpose in the card body Coil contact surfaces are contacted with conductor ends of the coil and the chip module-facing thrust surface a stop for the feed movement at a Milling process forms, such that the contact surface is flush with the bottom of the recess produced by milling.

The above solution is based on the idea of a particularly secure contact with one for the stresses that occur with dynamically changing bending to create sufficient material cross-section.

It can be assumed that in the production of a conventional chip card, that enables both contact and contactless access - that is a so-called "hybrid card" -, the rule is that for the production of the recording of the chip module serving recess in the card body up to the conductor ends of the Coil conductor tracks are milled. As a rule with conventional hybrid cards Coils used by forming conductor tracks on etched polyimide films are, the conductor tracks anyway only a thickness in the range of 15 to 20 microns aufiveisen, occurs again in the milling process described above Weakening of the already small material cross section of the conductor tracks.

By using the starting device according to the invention there is a weakening the coil conductor ends are excluded regardless of the type of coil.  

If the starting device extends laterally beyond the recess, it also serves as a stiffening device.

Another solution to the problem on which the invention is based relates to a Chip card that is used for both contact and contactless access is determined, has the features of claim 12.

According to the invention, a contact device is provided on the card body Coil contact surfaces are contacted to conductor ends of the coil and on the chip module-facing chip contact areas the inner contact areas of the chip module are contacted, the contacting of the conductor ends in a peripheral region of the Chip module is provided. Such a contact device also serves as a stiffening device, since they are between the pads of the chip module and extends the conductor ends of the coil and thus bend the card body exactly sensitive contact area stiffened.

It proves to be particularly advantageous if the contact device has a housing part for receiving the chip module and contact bracket for contacting the conductor ends having. The integral design of the housing part in the contact device enables light it up to the milling process used to produce the recess to waive in the card body. Rather, it is possible to use the contact device together with or independent of the chip module into one with a corresponding one Laminate layer provided with window opening. The back of the contact device device or its contact arm can then on the corresponding page of the Lami contact with the conductor ends of the coil and then with a another layer of laminate for the production of the card body are covered. This The structure of the chip card therefore enables a completely new manufacturing process.

It also proves to be particularly advantageous if the contact arms on their in the Contact protruding housing part are designed as contact springs. Consequently can the chip module with its inner contact surfaces on the contact ends  against the resistance of the contact springs so far into the housing part, until the surface of the chip module is flush with the outer contact surfaces to the surface surface of the card body or the corresponding laminate layer. In doing so, there will be dimensional problems satchel between the depth of the housing part and the thickness of the chip module through the Spring action of the contact springs balanced.

The above configuration of the contact device can then be particularly advantageous use if the chip module is fixed with adhesive in the housing part, as for Adjustment of an arrangement of the outer surface flush with the surface of the card body Contact surfaces of the chip module only apply pressure to the chip module as long as the spring force of the contact ends must be applied until the adhesive has hardened is.

Even without integral formation of a housing part, it is advantageous for contacting of the chip module to provide contact springs on the contact device, the mechani enable pressure contact, and the chip module directly into the recess mung use.

The various solutions according to the invention are described below with the aid of Drawings explained in more detail. Show it:

Figure 1 shows a chip card for contact-based access with a Ver stiffening device in a first embodiment.

Figure 2 is a smart card for contact access with a Ver stiffening device in a second embodiment.

Fig. 3 is a chip card for contactless access to a auctioning expansion means in a first embodiment;

Figure 4 is a smart card for contactless access with a stiffening device in a second embodiment.

Fig. 5 is a chip card for contact and contactless to handle with a formed on the conductor ends of a wire coil contact flat in a plan view;

FIG. 6 shows an enlarged representation of the chip card according to FIG. 5;

Fig. 7 is a cross-sectional view of the illustration of Fig 6 taken along section line VII-VII.

Figure 8 is a chip card for contact and contactless to handle with a starting device in plan view.

Fig. 9, the map shown in Figure 8 in a longitudinal section presen- tation along section line IX-IX.

Fig. 10 to Fig. 12, the production of a chip card with a stiffening con contact device in three successive manufacturing steps.

Fig. 1 shows a smart card 20 for contact-type access to a valve disposed in a Kartenkör by 21 chip module 22. The chip module 22 is located in a recess 23 made, for example, by a milling process in the card body 21 . Chip cards of the type shown in FIG. 1 are also known, for example, as so-called "telephone cards".

Integrated in the card body 21 is an approximately U-shaped stiffening device 24 , which stiffens a chip module receiving area 25 that extends beyond the dimensions of the recess 23 when bent about a bending axis 26 indicated by a dash-dotted line in FIG. 1.

FIG. 2 shows an embodiment of a stiffening device 27 which has been modified compared to FIG. 1 and which is formed here in two parts with two stiffening strips 28 , 29 extending in parallel and extending on both sides of the recess 23 in the longitudinal direction of the card. In their effect, the stiffening strips 28 , 29 correspond to the stiffening device 24 shown in FIG. 1 and stiffen the corresponding chip receiving area 25 of a chip card 30 otherwise corresponding to the chip card 20 shown in FIG. 2.

In the embodiments of FIGS. 1 and 2, both the stiffening device 24 and the Versteifungsein device 27 formed from the two stiffening strips 28 , 29 are formed from a thin steel sheet. When the chip cards 20 and 30 are produced using laminating technology, the stiffening devices 24 , 27 can be arranged integrally in a laminate layer (not shown in more detail here) and overall integrated as an intermediate layer in the laminate structure of the chip card 20 or 30 . In addition to the steel sheet exemplified here as a material for the stiffening devices 24 , 28 , other materials can of course also be used; The only requirement is an increased stiffness compared to the other material of the card body.

FIGS. 3 and 4 show two embodiments of stiffeners 31 and 32 at a smart card 33 (FIG. 3) or 34 (Fig. 4) having a contactless access to a chip 35 a of the chip 35 and a coil 36 Transponder unit 38 formed in a card body 37 .

The stiffening device 31 is approximately U-shaped and surrounds the chip 35 or a chip module having the chip 35 on three sides, so that, as shown in FIG. 3, the stiffening device 31 is arranged peripherally to the chip and a passage of conductor ends 39 , 40 from an opening area 41 of the stiffening device 31 enables.

The stiffening device 32 shown in FIG. 4 is formed in two parts with two strip-shaped stiffening elements 42 , 43 , which simultaneously form a contact device 44 . Each stiffening element 42 , 43 forms an electrical connection between a connection surface 45 or 46 of the chip 35 and a conductor end 39 or 40 of the coil 36 .

FIG. 5 shows a chip card 47 which enables both a contact-based and a contactless access to a chip module 48 . For the contact access to the chip module 48 has this arranged on its body 49 flush with the surface of a card outside contact surface 50 outer contact surfaces 51, the exact number and position are not shown in detail here in detail (Fig. 7).

For contactless access to the chip module 48 , this is provided on its inner contact side 52 with inner contact surfaces 53 , 54 which allow contacting with wire ends 55 , 56 of a wire coil 57 which forms a trans ponder unit 58 together with the chip module 48 .

From FIGS. 6 and 7 it is clear that, which is introduced in this case by a corresponding milling of the card body 49 in this for receiving the chip module 48 in the area of the wire ends 55, 56 a recess 59 is provided. It is noticeable in Fig. 7, that the depth t of the recess 59 is larger than the distance a between a chip module-side surface 60 of the chip card 47 and the card body 49 and the surface of the wire ends 55 and 56 respectively. Since the wire coil 57 is a laying coil made of a coil wire 62 with a relatively large wire thickness, which is applied to a laminate layer 61 in a laying process, for example in the range from 100 to 200 μm, and the wire has a round to oval cross section When milling the card body 49 into the material of the coil wire 62 (as shown in FIG. 7), a relatively large-area flattening 63 occurs at each wire end 55 and 56 . In this way, a relatively large flat adhesive contact surface is available for contacting the inner contact surfaces 53 , 54 of the chip module 48 with the wire ends 55 and 56 by means of conductive adhesive, not shown here, so that a mechanically highly resilient adhesive connection is created.

FIG. 8 shows a chip card 64 which, like the chip card 47 shown in FIG. 5, enables both a contact-based and a contactless access to a chip module 65 . For contacting inner connection surfaces 66 , 67 of the chip module 65 with conductor ends 68 , 69 of a coil 70 , the chip card 64 has a starting device 73 formed here from two contact strips 71 , 72 ( FIG. 8). The contact strips 71 , 72 are located on a carrier film 74 and each have a contact pin 75 , 76 . The contact pins 75 , 76 penetrate the carrier film 74 and are contacted on the contact surfaces 77 , 78 of the contact strips 71 , 72 opposite side of the carrier film 74 with the conductor ends 68 and 69 of the coil 70 . The coil 70 can be of any design, for example also as a coil applied to a polyamide film in the etching process.

As can be seen from the longitudinal sectional view in FIG. 9, the chip module 65 is received in a recess 79 , the depth t of which is greater than the distance a between the surface of the run-up strips 71 , 72 and a surface 80 of the card module 81 receiving the chip module 65 . The stop strips 71 , 72 are provided in the region of the recess 79 with the stop surface 77 or 78 , which is set back from the surface of the stop strips 71 , 72 and is formed during the milling process due to the penetration of the milling tool into the material of the stop strips 71 , 72 . Since the contact strips 71 , 72, in contrast to the conductor ends 68 , 69 of the coil 70 produced, for example, in the etching process, have a relatively large material thickness, penetration of the milling tool into the material of the contact strips 71 , 72 is possible without the risk of excessive weakening of the material. Since the thrust strips 71 , 72 provide a sufficient material thickness, it is even possible to control the feed of the milling tool in a force-dependent manner, such that the feed, for example, when measuring an increase in force due to the penetration of the milling tool into the material of the thrust strips 71 , 72 Sheet steel that is stopped. A much more complex direct monitoring of the penetration depth during the milling process can therefore be dispensed with.

A method for the manufacture of a chip card 82 is explained below with reference to FIGS . 10 to 12, which is also intended for both contact-based and contactless access. The structure of the chip card 82 can best be seen from the following description of a manufacturing option.

FIG. 10 shows a laminate layer 83 which is the carrier of a coil 84 , of which only one conductor end 85 is shown in FIG. 10. The method explained below is not limited to a specific coil design. Rather, both coils are suitable, which are created by laying a wire conductor on a laminate layer, as well as coils, which are wound in a separate process and then brought up to the laminate layer, or coils, which are applied to a carrier film in the etching process, in which case the carrier film can be used as a laminate layer.

Adjacent to the conductor ends, of which only one conductor end 85 is shown in FIGS . 10 to 12, a window-shaped opening 86 is provided in the laminate layer 83 .

As shown in Figure 11 is in the opening 86 of the laminate sheet. 83, shown inserted from above, a contact device 87 which has a housing part 88 having arranged thereon contact beams 89, of which in Figs. 11 and 12 for purposes of illustration only one is shown. The housing part 88 has an opening 90 through which a chip module 91 is already inserted in the housing part 88 in FIG. 11. The housing part 88 remains open even after the chip module 91 has been inserted in order to enable contact-based access to external contact surfaces 92 of the chip module 91 .

The housing part 88 formed in this embodiment from plastic is provided in its bottom region 93 with the contact arms 89 in such a way that they protrude from the housing part 88 with outer coil contact ends 94 and with the inner contacts, which are designed here as contact springs 95 , into the interior of the Extend housing part 88 . The contact springs 95 are used to make contact with inner contact surfaces 96 of the chip module 91 .

As shown in the illustration of FIG. 11 is clear, the contact beams Cart 89 during insertion into the opening 86 of the laminate sheet 83 at the conductor ends 85 of coil 84 and thus allow a slight contacting.

As shown in FIG. 12, after the contact arms 89 have been contacted with the conductor ends 85 of the coil 84, a further laminate layer 97 is applied to the laminate layer 83 , so that the coil 84 is now arranged between two laminate layers 83 and 97 and seals the contact device 87 to the rear is.

If not already done before, the chip module 91 can now be inserted into the housing part 88 of the contact device 87 . The contacting of the inner contact surfaces 96 of the chip module 91 with the contact springs 95 can be purely mechanical, that is to say pressure-loaded here, this contact being able to be secured by gluing the chip module 91 to the housing part 88 . If pressure is applied to the chip module 91 during the curing of the bond, such that the surface of the chip module 91 is arranged flush with the surface of the laminate layer 83 , an optimal positioning of the chip module 91 in the housing part 88 is possible without the depth the interior of the housing part should be matched to the height or thickness of the chip module 91 .

Claims (16)

1. Chip card for contact-based access to a chip arranged in a chip module, the chip module being arranged in a recess in a card body such that contact surfaces of the chip module are arranged on the surface of the card body, characterized in that the card body ( 21 ) in Area of the recess ( 23 ) has an integrated stiffening device ( 24 , 27 ) extending in the longitudinal direction of the cards. 2. Chip card according to claim 1, characterized in that the stiffening device ( 24 ) is designed as a stiffening frame, the sen frame parts are arranged at a distance from the edges of the recess ( 23 ) in the card body ( 21 ). 3. Chip card according to claim 1, characterized in that the stiffening device ( 27 ) has at least one elongated stiffening element ( 28 , 29 ) which is arranged at a distance from a longitudinally extending edge of the recess ( 23 ) next to the recess ( 23 ) is. 4. Chip card for contactless access to a chip or a chip module, the chip or the chip module for forming a transponder unit is arranged together with a coil in a card body and the conductor ends of the coil are contacted on pads of the chip or the chip module, characterized in that the card body ( 37 ) has a spaced from the chip ( 35 ) or chip module on arranged stiffening device ( 31 , 32 ), which is in a covering position with the chip or chip module or in a peripheral position to the chip or chip module. 5. Chip card according to claim 4, characterized in that the stiffening device ( 31 ) is designed as a stiffening frame enclosing the chip ( 35 ) or the chip module, which is provided with openings or recesses which cross the stiffening frame arrangement of the conductor ends ( 39 , 40 ) enable. 6. Chip card according to claim 4 or 5, characterized in that the stiffening device ( 32 ) as a contact device ( 44 ) for the electrically conductive connection between the conductor ends ( 39 , 40 ) of the coil ( 36 ) and the connection surfaces ( 45 , 46 ) of the chip ( 35 ) or chip module is used. 7. Chip card according to claim 6, characterized in that the stiffening device ( 32 ) is designed as a two-part, the chip ( 35 ) or the chip module enclosing stiffening frame, each having a frame part ( 42 , 43 ) a connection surface ( 45 , 46 ) of Chips ( 35 ) or Chipmo module with a conductor end ( 39 , 40 ) of the coil ( 36 ) connects. 8. Chip card for contact-based and contactless access to a chip arranged in a chip module, the chip module being arranged in a recess in a card body such that outer contact surfaces of the chip module are arranged on the surface of the card body and inner contact surfaces of the chip module for training a transponder unit with conductor ends of a coil arranged in the card body are connected, characterized in that the coil is designed as a wire coil ( 57 ) and the recess ( 59 ) for receiving the chip module ( 48 ) is dimensioned in such a depth that in the region of the recess ( 59 ) arranged wire ends ( 55 , 56 ) have a contact flattening ( 63 ) formed by the machining process for producing the recess ( 59 ). 9. Chip card according to claim 8, characterized in that the recess ( 59 ) is made by milling. 10. Chip card for contact and contactless access to a chip arranged in a chip module, the chip module being arranged in a recess in a card body such that outer contact surfaces of the chip module are arranged on the surface of the card body and inner contact surfaces of the chip module for training a transponder unit with conductor ends of a coil arranged in the card body are connected, characterized in that a starting device ( 73 ) is provided in the card body, the coil contact surfaces ( 75 , 76 ) of which are contacted with conductor ends ( 68 , 69 ) of the coil ( 70 ) and whose the chip module ( 65 ) facing contact surface ( 77 , 78 ) forms an impact for the feed movement in a milling operation, such that the contact surface ( 77 , 78 ) is flush with the bottom of the recess ( 79 ) produced by the milling. 11. Chip card according to claim 10, characterized in that the starting device ( 73 ) extends laterally beyond the recess ( 79 ) in addition and serves as a stiffening device. 12. Chip card for contact-based and contactless access to a chip arranged in a chip module, the chip module being arranged in a recess in a card body such that outer contact surfaces of the chip module are arranged on the surface of the card body and inner contact surfaces of the chip module for training a transponder unit with conductor ends of a coil arranged in the card body are connected, characterized in that a contact device ( 87 ) is provided in the card body ( 81 ), on the coil contact surfaces ( 94 ) of which conductor ends ( 85 ) of the coil ( 84 ) are contacted and on the latter the chip module ( 91 ) facing chip contact surfaces ( 95 ) the inner contact surfaces ( 96 ) of the chip module ( 91 ) are contacted, the contacting tion of the conductor ends ( 85 ) in a peripheral region of the chip module ( 91 ) is easily seen. 13. Chip card according to claim 12, characterized in that the contact device has a housing part ( 88 ) for receiving the Chipmo module ( 91 ) and contact arm ( 89 ) for contacting the conductor ends ( 85 ). 14. Chip card according to claim 13, characterized in that the contact arm ( 89 ) on their projecting into the housing part con tact ends are designed as a contact spring ( 95 ). 15. Chip card according to claim 13 or 14, characterized in that the chip module ( 91 ) is fixed by means of adhesive in the housing part ( 88 ). 16. Chip card according to claim 12, characterized in that the contact device ( 87 ) has contact springs ( 95 ) for contacting the chip module ( 91 ).