DE102010026152A1 - Block shaped card body for manufacturing dual-interface-card, has strip line designed as bulge in area by area, and bulge part arranged in spatial region of body, where region is provided as block shaped opening to receive chip module - Google Patents

Abstract

The body (9) has a coil-shaped antenna (2) with strip lines (6) embedded in the body. One of the lines is designed as a bulge (16) in area by area. A part of the bulge is arranged in a preset spatial region of the body, where the region is provided as a block shaped opening (11) for receiving a chip module (13). The opening is formed by an abrasive process e.g. milling process. The bulge on a side of the lines forms an elevation and on another side of the lines forms a recess relative to the elevation. An electrical conductive material is provided in the recess. An independent claim is also included for a method for manufacturing a smart card.

Description

The invention relates to a card body for producing a chip card and a method for producing a chip card.

DE-A-19610507 describes a method for producing a chip card, in which an antenna coil formed from a wire is arranged. From the card body, a recess having a predetermined depth for receiving a chip module is worked out. As a result of the machining process for producing the recess, the antenna wires in this area are removed to such an extent that contact surfaces for electrical contacting of the chip module are formed on the antenna wires. In order to be able to absorb the tolerances of the machining process, a relatively strong coil wire with a diameter of 100 to 200 μm must be used.

DE-C-19610044 describes a method for producing a chip card using thickened material orders. In the card body antenna devices are arranged with chip contacts for connecting a chip, which is used with antenna contacts for connection to the antenna devices in a recess of the card body. The chip contacts have thickened, z. B. made of solder material orders, which are received by a cover layer, wherein the thickened material orders can be removed at least in sections when working out of the recess from the cover layer. These thickenings are selected to be about 100 to 200 microns thick so that the tolerances occurring during subsequent milling in any case safely collected.

The invention has for its object to provide an improved card body for producing a smart card. In addition, an improved method for producing a chip card is to be specified.

The object is achieved by a card body for producing a chip card, comprising an antenna embedded in the card body with conductor tracks, wherein at least one of the conductor tracks is partially formed as at least one bulge and at least a portion of the at least one bulge in a predetermined spatial area of the card body is arranged which is provided as a recess for receiving a chip module.

The object is further achieved by a method for producing a chip card, comprising the steps of: forming an antenna by arranging a pattern-structured layer of an electrically conductive material on an antenna substrate, wherein the pattern-structured layer forms conductor tracks of the antenna; Forming at least one of the conductor tracks in regions as at least one bulge; Embedding the antenna substrate with the antenna disposed thereon between a plurality of superimposed layers; Forming a card body by bonding the plurality of superimposed layers and the antenna substrate interposed therebetween to the antenna formed by the patterned layer so as to retain the at least one protrusion; Forming a recess in the card body for receiving a chip module having on a surface first contact surfaces, such that during molding a portion of the at least one bulge is removed and thereby at least one second contact surface is formed in a recess defining surface of the card body lies; and arranging the chip module in the recess such that an electrical connection is formed between the at least one second contact surface and one of the first contact surfaces.

An essential point of the invention is that the antenna layer, formed by the pattern-patterned layer of an electrically conductive material forming the antenna, is initially completely built into the card material, but the conductor track sections of the antenna serving for electrical contacting of a chip module are in some regions as a bulge are formed such that at a taking place during the manufacture of the chip card molding a recess in the card body for inserting a chip module into the card body by removing card body material in a predetermined spatial area of the card body, z. B. by milling, ablation by radiation or chemical etching, at least a portion of the bulge is also removed. This is achieved in that the bulge extends in those defined space region of the card body, which is to be removed in order to form the recess. Before the recess is formed, the predetermined spatial area of the card body, in which the recess is to be formed, thus contains at least part of the bulge. By removing at least a portion of the bulge during the formation of the recess, at least one second contact surface is formed, which lies in a surface of the card body bounding the recess.

A bulge formed by the at least one conductor track in the sense of the present invention can also be referred to as a dent, bump, bulge or bulge formed by the at least one conductor track.

The card body forms a flat, flat and plate-shaped, preferably cuboid body, in particular with dimensions in the range of 1 to 15 cm, z. B. a card according to ISO 7816 , The thickness of the card body is in a range of 0.1 mm to 3 mm, preferably in a range of 0.5 mm to 1.2 mm. The flat card body, in particular one of its top surfaces, defines a plane along the x-axis and the y-axis of a three-dimensional Cartesian coordinate system. The card body is formed of a plurality of parallel layers and an antenna embedded between two of the parallel layers of the card body. The conductor tracks of the antenna extend at least in regions parallel to the plane spanned by the card body and thus span an antenna plane parallel to the x-axis and the y-axis of the Cartesian coordinate system defined by the card body. The at least one bulge of the at least one printed conductor forms an increase or a depression along the z-axis of the Cartesian coordinate system. The bulge protrudes out of the antenna plane in which the at least one track runs.

The antenna has traces made of one or more electrically conductive material (s), either of a metal-free material or a metal-containing material, e.g. As a metal such as copper, aluminum or silver or a metal alloy with at least one of the metals copper, aluminum and / or silver. The conductor tracks may also be formed from a plurality of layers arranged above and / or next to one another from the same or different electrically conductive, metal-free or metal-containing materials. The conductor tracks may be formed as a structure formed by a coating method. It is possible that the antenna is formed by one or a combination of the following coating methods: a printing method, e.g. As screen printing or gravure printing, a deposition or coating method such. As physical vapor deposition, short PVD (= Physical Vapor Deposition), chemical vapor deposition, short CVD (= Chemical Vapor Deposition), chemical deposition in aqueous media, eg. As electrical and / or electroless plating, or spray coating, z. B. thermal spraying, d. H. "Thermal spraying", or spraying on a suspension, d. H. "Slurry spraying", or by means of lamination or laminating. It is preferred if the antenna is formed from an electrical conductor, which is embedded in a coil shape in the card body and whose ends terminate in the region of the recess, where they are electrically connectable to first contact surfaces of the chip module. In this case, at least the ends of the electrical conductor are formed as conductor tracks.

At least one track has one or more areas in which the at least one track is formed as at least one bulge, d. H. is deformed in the form of at least one bulge, wherein the at least one bulge not deformed areas of the at least one conductor track in the direction perpendicular to the plane spanned by the card body, d. H. along the z-axis of the Cartesian coordinate system, surmounted. The shaping of the recess is preferably carried out by removing material of the card body in a defined area of space. Before training out of the card body herauszuarbeitenden, z. B. herauszufräsenden, recess is integrated into the at least one conductor track in the deformed and in the non-deformed areas of the at least one conductor in the card body. In the formation of the recess material of the card body, and thus also the at least one conductor track in one or more deformed areas, removed and thus the at least one conductor track partially exposed. The subsequent working out or forming a recess for receiving a chip module after the formation of the card body is particularly common in dual-interface cards, in which the chip module must be contacted from the outside.

In conventional card bodies for producing chip cards, in which conductor tracks of the antenna have no bulge, the permissible depth tolerance of the removal method is limited by the thickness of the conductor tracks, since during the removal process, the conductor tracks must be milled, but not completely removed. With depth tolerance is meant a tolerance in the direction perpendicular to the plane spanned by the card body. Since the depth tolerance of the ablation method can not be reduced further in many cases, the interconnects must therefore be formed with a relatively large thickness.

In conventional card bodies for the production of chip cards, conductor tracks of the antenna must either be chosen so thick that deep tolerances occurring in a subsequent milling process are reliably absorbed in each case. Or it may be for this purpose in an additional process step by means of a material application thickening on a contact surface are formed, which are exposed in a subsequent milling.

Due to the fact that, in the case of the card body according to the invention, the at least one conductor track is formed in regions as at least one bulge, the recess in the card body can be removed by means of a removal method, in particular a milling method, a chemical ablation method or a radiation-based method Ablation method to be formed, the depth tolerance is greater than the layer thickness of the at least one conductor track. The depth tolerance of the ablation process is absorbed by the at least one bulge. Compared to conventional card bodies, a considerably smaller layer thickness of the conductor tracks of the antenna is thus sufficient in the case of the card body according to the invention, resulting in a significant material saving. The previously required high layer thickness of the tracks is achieved by using wire as a conductor. The diameter of the wire essentially determines the layer thickness of the conductor track. However, wire tracks are only to be applied by means of complicated, slower and expensive production methods, wherein the wire is placed on an antenna substrate in the intended antenna coil structure or form. In the case of the card body according to the invention, the conductor tracks can have a flat, thin, structured form, wherein this structured form can be constructed and produced in layers, as described above, in particular with large-scale production methods in mass production, for example in a roll-to-roll process. A complex and complicated application of each individual antenna to each individual antenna substrate is eliminated.

In addition, the at least one bulge can be formed in a simple and rapid mechanical deformation process. A mechanical forming tool which can be used for this purpose is generally available anyway during the production process of a chip card, in particular in the form of a tool for forming plated-through holes, eg. As a needle, a stamp or other deformation tools. On an additional process step for forming a material application, possibly associated with a complex adhesive or soldering process, which must also be carried out with a high positional accuracy, can thus be dispensed with. The formation of the buckle according to the invention requires no waiting time for curing or crosslinking of an adhesive or for melting / cooling of a solder. This results in significant material, time and cost savings.

In addition, by using a solder and the heat input necessary for processing the solder, undesired deformation of the cardinal body, which is as flat as possible and flat, especially in the area of the contact surfaces, can occur. In addition, the solder used here represents an additional material in the layer structure of the card body, which can lead to local adhesion problems in the layer composite of the card body. Within the lifecycle of the card body, high temperatures may cause heat to "reflow", either through heat. H. to a remelting of the solder, or come by cold to an embrittlement and breaking of the solder. The remelting and embrittlement of the solder may cause complete or partial breakage of the electrically conductive contact between the contact surfaces. The remelting can cause an electrical short between the pads. All of these disadvantages mentioned are avoided by the present invention.

Advantageous embodiments of the invention are designated in the subclaims.

Preferably, the card body formed in the method according to claim 8 is a card body according to one of claims 1 to 7.

The at least one conductor track itself is partially deformed in the form of a bulge, without the application of additional material. Depending on the extensibility of the material of the trace, the trace is deformed in a plastic deformation without tearing or the trace breaks or breaks during deformation, so that form one or more openings in the trace. Since such openings usually form in a region in which the deformed material of the conductor track is exposed to the greatest deformation forces, in particular at the highest point of the bulge, which is removed anyway in the subsequent formation of the recess of the card body, this has no negative Effects on the procedure. The same applies to a wanted punching of the track in the formation of the bulge.

Preferably, the at least one conductor track is formed as a flat, strip-shaped conductor track, wherein a first, flat side of the conductor track is directed to a surface of the card body from which the recess is to be worked out, and a second, flat side of the conductor track on one of the first side opposite side of the conductor track is arranged.

The shape of the bulge is dependent on the shape of the mechanical forming tool, which may be formed as a stamping or punching tool, for. B. as a needle or an embossing stamp. The shape of the bulge also depends on whether an abutment is used and, if an abutment is used, on the shape of the abutment. Preferably, the anvil has substantially the negative shape of the embossing or punching tool used to achieve a coherent engagement. But it has also proven to use abutment that is not the negative shape of the embossing or Punching tool correspond to achieve special shapes of the bulges. The shape of the forming tool and the embossing pressure are chosen so that the conductor is partially formed as a bulge in the desired shape.

It is possible for the at least one bulge on a first side of the at least one interconnect to form an elevation, and a recess corresponding to the elevation to form an elevation on the second side of the at least one interconnect opposite the first side. The at least one bulge occurs depending on the considered side of the trace as an increase or as a depression, in each case with respect to non-deformed areas of the trace, in appearance.

It is preferred if the conductor tracks, measured perpendicular to a plane spanned by the card body, have a thickness of at most 70 μm, preferably in a range of 5 to 50 μm.

It is preferred if the conductor tracks, measured perpendicular to the plane spanned by the card body, have at most a thickness which is substantially less than a depth tolerance of the removal method for forming the recess. In this case, the depth tolerance is also measured perpendicular to the plane spanned by the card body. The depth tolerance of conventional removal methods is about 70 microns. If the conductor tracks, measured perpendicular to the plane spanned by the card body, are formed with a thickness of at most 50 μm, their thickness is substantially less than the depth tolerance of conventional removal methods for forming the recess. Thus, the interconnects have a significantly lower layer thickness than conventional interconnects having a thickness in the range of 100 to 200 microns, d. H. it results in a significant material savings. On the other hand, printed conductors with a thickness in the range of at most 70 μm can be produced with common production methods and are relatively robust against damage.

It is possible that in the recess, which forms the at least one bulge on a second side of the at least one conductor track, a second electrically conductive material is arranged, which differs from a material of which the at least one conductor track is formed. The recess thus forms a container of the additional, arranged in the recess second electrically conductive material, for. As conductive adhesive or solder paste. When forming the recess in the card body for receiving a chip module, not only material of the at least one conductor track is thus exposed, but also a region of the additional second electrically conductive material arranged in the recess. By additional, arranged in the recess, electrically conductive material, it is possible to form the at least one second contact surface of the at least one conductor formed during the machining of the recess, larger than without additional, arranged in the recess electrically conductive material. Due to the relatively large at least one second contact surface, it is thus easier and safer possible to form the electrical connection between the at least one second contact surface (the conductor track) and the one first contact surface (of the chip module).

When a conductive adhesive is used as the additional electrically conductive material disposed in the recess, it may comprise metal particles, metal chips or metal-coated polymer particles, preferably in an epoxy resin-based matrix. If a soldering paste is used as an additional electrically conductive material arranged in the recess, then this can be a mixture of a soldering flux and a soldering alloy, eg. Example, a lead-containing alloy or a lead-free, tin-containing alloy, in particular a tin-silver (Sn-Ag), tin-copper (Sn-Cu) or tin-copper-silver (Sn-Cu-Ag) alloy , It is possible that the conductive adhesive or the solder paste by local application of heat, for. B. by a thermode, laser radiation or inductive heat, cured or melted. Alternatively, the curing or melting process may be performed during a subsequent lamination process to form the card body.

The shaping of the recess by removing material of the card body is preferably carried out by means of a milling tool or a high-energy beam such as a laser beam. It is thus possible that the recess is milled in the card body. It is preferred if, after the formation of the recess, the at least one second contact surface lies in a bottom surface of the recess.

It is possible for the at least one conductor track to have a non-deformed, preferably flat region adjoining the at least one bulge, the at least one bulge, viewed parallel to the layers of the card body, the non-deformed region of the at least one printed conductor by at least 50 μm surmounted. The at least one conductor track, which is formed in regions as at least one bulge, also includes areas in which it is not formed as a bulge. These areas form the undeformed area. It is preferred if the undeformed area is up extends parallel to the plane spanned by the card body.

It is possible for the undeformed region to be defined as the region of the at least one interconnect in which a surface of the at least one interconnect has a z-direction height deviation of at most 10 μm from a surface of the at least one interconnect defined as a reference surface prior to forming the bulges has.

It is possible that the maximum layer thickness of the conductor tracks, measured perpendicular to the layers of the card body, in the region of the at least one bulge is at most as large as the maximum layer thickness of the strip conductors in the undeformed region. If the at least one bulge is formed by deforming the at least one conductor track by means of a forming tool, the material of the at least one conductor track in the deformation area is moved in the z direction, i. H. deformed perpendicular to the plane spanned by the card body level. As a result of this deformation, the material of the at least one printed conductor is stretched, as a result of which the layer thickness of the at least one printed conductor in the deformed region is reduced. In a deformation of a conductor track without subsequent galvanization, the maximum layer thickness of the conductor tracks, measured perpendicular to the layers of the card body, in the region of at least one bulge, d. H. in the deformed region, ie preferably at most as large as the maximum layer thickness of the conductor tracks in the undeformed region, which is preferably flat.

If the at least one bulge by a coating process, for. B. formed by deposition of a metallic layer in a vapor deposition on a partially deformed antenna substrate, less material is deposited in the deformed areas of the antenna substrate per surface unit than in non-deformed areas of the antenna substrate. This is due to surface enlargement in the deformed regions due to a non-zero depth-to-width ratio of the deformed regions and the resulting reduced thickness of the coating. The dimensionless depth-to-width ratio is a characteristic feature of the surface enlargement in the deformed regions. Due to the deformation, "mountains" and "valleys" are formed. Depth is here the distance between "mountain" and "valley", as width the distance between two "mountains". The higher the depth-to-width ratio, the steeper the "mountain flanks" and the thinner the metallic layer deposited on the "mountain flanks". In such a method for forming the at least one bulge, it is thus possible for the maximum layer thickness of the conductor tracks, measured perpendicular to the layers of the card body, to be at most as large as the maximum layer thickness of the conductor tracks in the undeformed region in the region of the at least one bulge ,

It is also possible for the maximum layer thickness of the conductor tracks, measured perpendicular to the layers of the card body, to be at least as great in the region of the at least one bulge as the maximum layer thickness of the conductor tracks in the undeformed region. If the at least one bulge is formed by galvanic amplification of a seed layer arranged on a partially deformed antenna substrate, approximately as much material is deposited in the deformed regions of the antenna substrate as in non-deformed regions of the antenna substrate, or a stronger one in the deformed regions of the antenna substrate Material deposition than in non-deformed areas of the antenna substrate, since in the region of the bulge, in particular in the region of a tip, a higher electric field strength, d. H. a larger field line density, is present than in non-deformed areas, and thus a higher current density. The higher current density results in an accelerated material build-up (layer thickness per unit time), which leads to a greater material deposition in the deformed regions of the antenna substrate.

It is possible for the at least one bulge, prior to the formation of the recess, to essentially have a contour of a cone whose base surface is arranged on the undeformed region of the conductor track. This shape is achieved by the formation of the bulge by a suitably trained forming tool. After the formation of the recess, it is possible for the at least one bulge to essentially have a contour of a truncated cone whose base surface is arranged on the undeformed region of the conductor track and wherein the at least one second contact surface lies in the top surface of the truncated cone. The top surface of the truncated cone is formed by a conical tip of the conical protrusion is removed during the formation of the recess. It is also possible that a bulge has a contour of a pyramid, a calotte or a spherical segment. A bulge may also have a different geometric shape, depending on the shape of the forming tool, such as in the form of a corrugated sheet, a plank or a rail.

It is possible that the interconnects are formed as electrically conductive layers, arranged on a front side and a front side opposite back of an antenna substrate. The formation of the electrically conductive layers forming the conductor tracks on both sides of the antenna substrate has the advantage that a larger second contact area can thereby be provided than with a merely single-sided arrangement on the antenna substrate. The antenna substrate may be made of a dielectric material, preferably a flexible polymer film having a layer thickness in the range of 2 to 500 μm, preferably 12 to 200 μm, e.g. Polyethylene terephthalate (= PET), PET with glycol (= PET-G), polyvinyl chloride (= PVC), polycarbonate (= PC), polypropylene (= PP), ^Teslin® , polystyrene (= PS), polyethylene naphthalate (= PEN ) or acrylonitrile-butadiene-styrene copolymer (= ABS). Also, composite films of various individual films with arranged between the individual films additional adhesion promoter layers are possible. The antenna substrate and the antenna layer disposed thereon form layers of the card body formed of multiple layers.

It is possible that the tracks of the antenna are formed in the form of a metallization. In this case, the metallization may have been provided by a method in which in a metallization layer arranged on the antenna substrate by a mask exposure and a subsequent removal, for. B. an etching, the exposed or unexposed areas of a patterned seed layer is generated in the form of the tracks, the so-called "seed layer". It is also possible that the patterned seed layer by means of a printing process, for. B. by gravure or screen printing, using a conductive ink is generated. In both cases, the patterned seed layer can be reinforced by a galvanic material deposition until the tracks have a desired layer thickness.

It is preferred that to form the antenna and the at least one bulge a seed layer (= seed layer), z. B. of electrically conductive or semiconducting material, applied to the antenna substrate, z. B. is printed, the antenna substrate with the seed layer disposed thereon is partially deformed according to the at least one bulge, and the seed layer is galvanically reinforced until the partially formed as at least one bulge tracks in a predetermined shape, preferably with a defined minimum layer thickness formed are.

The printed conductors can also be produced using one or more of the following processes or processes: Galvanic processes, structuring, LDS (laser direct structuring), ablation, gluing, lamination, embossing, printing, vapor deposition, preferably over a mask, spraying.

It is possible that for forming the antenna and the at least one bulge, the antenna substrate is deformed in regions corresponding to the at least one bulge and the patterned layer of the electrically conductive material is disposed on the partially deformed antenna substrate.

It is possible that a mechanical forming tool is used to form the at least one bulge. The forming tool is pressed into the antenna substrate, optionally with a seed layer or conductor track arranged thereon, so that at least one bulge is formed. The forming tool can only be shaped as a tip, so that a forming process takes place for each desired bulge. It is possible that the at least one conductor track is deformed with an embossing tool, in particular a lifting or rotary embossing tool. The forming tool can also have an embossing punch which simultaneously forms a desired number of bulges in a desired arrangement in a single forming operation. The embossing tools and / or the antenna substrate may also be cooled or heated to influence the deformation profile of the bulges.

It is possible for the at least one second contact surface to abut the first contact surface of the chip module that is electrically connected to it directly and / or by means of an electrically conductive connection means. It is possible that prior to arranging the chip module in the recess, the connecting means in the region of the at least one second contact surface is applied, which establishes the electrical connection between the at least one second contact surface and a first contact surface. The connecting means is an electrically conductive material, for. As a conductive adhesive or a solder paste.

It is possible for one or more polymer layers, each forming one of the layers of the card body, to be arranged on each side of the antenna substrate with the antenna arranged thereon. It is preferred if the layers adjacent to the antenna layer are deformable such that the at least one bulge is not deformed when the card body is connected by joining, e.g. B. laminating one or more polymer layers. Since the glass transition temperature or softening temperature of the layers adjacent to the antenna layer, e.g. B. polymer layers, is much lower than that Softening temperature of metals such as copper or aluminum, from which the conductor tracks and thus also the bulges are preferably formed, the shape of the at least one bulge remains unchanged in the formation of the card body. In the formation of the card body, the material of the layers adjoining the antenna layer preferably flows around the at least one bulge without substantially deforming it. The resulting deformation is either very low or is already precompensated in the formation of the bulge, so that the functionality of the bulge is fully retained. The precompensation can z. Example, include the step of counteracting the bulge according to a later deformation, ie, for example, to make something higher and / or sharper than desired in the finished card body, to counteract a subsequent flattening.

It is possible that the at least one second contact surface of the at least one bulge and the electrically connected first contact surface of the chip module, seen perpendicular to the plane spanned by the card body, overlap.

It is possible for a sectional area of the at least one bulge with a surface bounding the recess, seen perpendicular to a plane spanned by the card body, to lie opposite the first contact area of the chip module electrically connected thereto. The second contact surface lies after the formation of the recess in the cut surface.

In the following the invention will be explained with reference to several embodiments with the aid of the attached schematic and not to scale drawings. It shows

1 a card body,

2 an enlarged section 1 .

3 a first method for the formation of bulges,

4 a second method for the formation of bulges,

5 a third method for the formation of bulges,

6 Cuts through various card bodies,

7 a section through a chip card,

8a a section through adjacent bulges, which were formed by a deformation of a metallized antenna substrate,

8b a section through a bulge, which was formed by a galvanic material on a deformed seed layer,

9 to 12 Cuts through a card body with different deep recesses,

13 Steps for forming a two-sided antenna layer,

14 Cuts through a card body with the two-sided antenna layer according to 13 .

15 a section through a chip card with the two-sided antenna layer according to 13 .

16 Steps for forming bumps of a bilateral antenna layer serving as a container,

17 Sections through a card body with the antenna layer according to 16 .

18 a section through a chip card with the antenna layer according to 16 .

19 Steps for forming buckets of a unilateral antenna layer serving as a container,

20 Sections through a card body with the antenna layer according to 19 , and

21 a section through a chip card with the antenna layer according to 19 ,

1 shows a schematic representation of a cuboid card body 9 for producing a smart card, z. B. a dual-interface card. The card body 9 includes one in the card body 9 integrated, coil-shaped antenna 2 whose ends are in the area of one of the card body 9 worked out, z. B. cuboid recess 11 , a so-called cavity, for inserting a chip module, end. The antenna 2 can be designed as an RF antenna, which is used for non-contact communication of an integrated into the chip module electronic circuit with a test device (RF = radio frequency).

2 shows an enlarged view of the area of in 1 illustrated card body 9 in which the recess 11 is arranged out of the card body 9 by removing the card body 9 forming material in a given spatial area of the card body 9 was worked out, z. B. in a milling process. The ends of the antenna 2 are as two tracks 6 formed in the region of the recess 11 ends and are formed in each case as four bulges. Since at least in each case a part of the bulges, preferably in each case one parallel to the plane defined by the card body plane, the undeformed portion of the conductor path furthest protruding vertex portion of the bulges, is arranged in the predetermined spatial region of the card body, as the recess for Receiving the chip module is provided, during the working out of the recess 11 from the card body 9 at the same time each with the recess 11 overlapping part, preferably the apex area, the bulges removed, so that through the non-abraded parts of the bulges annular second contact surfaces 19 be formed in a floor space 12 the recess 11 lie. These annular second contact surfaces 19 serve as contact surfaces for placing first contact surfaces of a chip module, not shown, wherein the annular contact surfaces 19 be electrically connected to the first contact surfaces of the chip module.

The area fraction of the bulges on the surface of the conductor tracks that overlaps with the contact surfaces of the chip module is preferably more than 5%. Preferably, this value is in the range of 10 to 70%. Preferably, this surface portion of the bulges is selected so that an absolute contact area between the antenna and a contact surface of the chip module is more than 0.1 mm ² per contact surface, preferably more than 0.5 mm ² per contact surface.

3 illustrates a method of forming an antenna layer 2 with bulges. In a first step, as shown in the section I, an antenna substrate 3 provided, for. B. formed of a flexible plastic film with a thickness of less than 200 microns, located in the xy plane of a Cartesian coordinate system, as in 3 below. Subsequently, as shown in the section II, on a front side 4 of the antenna substrate 3 a pattern-structured layer of an electrically conductive material is applied, which is an antenna 2 formed. The electrically conductive material of the antenna layer 2 can affect the antenna substrate 3 z. B. imprinted, vapor-deposited or laminated. The thus formed antenna 2 has conductor tracks 6 on, z. As metallic strips with a layer thickness in a range of 5 to 50 microns. In a subsequent step, the antenna substrate 3 and the conductor tracks arranged thereon 6 deformed by means of a forming tool so that the conductor tracks 6 in some areas as bulges 16 be formed, as shown in section III. At the same time, the antenna substrate becomes too 3 permanently deformed. The bulges 16 the tracks 6 have a conical contour. The bulges 16 make up from the back 5 of the antenna substrate 3 from recesses in the z-axis direction, and from the antenna substrate 3 remote side of the tracks 6 seen from increases in the direction of the z-axis.

4 illustrates an alternative method of forming an antenna layer 2 with bulges. It will be like in 3 first an antenna substrate 3 provided that extends in the xy plane, as shown in the section I. In a subsequent step, by means of a forming tool in the antenna substrate 3 bulges 16 formed as shown in section II. On the partially deformed antenna substrate 3 become in a following step traces 6 the antenna 2 arranged, wherein the conductor tracks 6 , the surface relief of the antenna substrate 3 following, corresponding bulges 16 form. In this case, the electrically conductive material that makes up the antenna 2 formed by a coating method such as PVD, CVD, a chemical deposition in aqueous media, for. As electrical and / or electroless plating, or a spray coating, z. B. thermal spraying (= thermal spraying) or spraying a suspension (= slurry spraying) is formed.

5 illustrates another method of forming an antenna layer 2 with bulges. First, an antenna substrate 3 provided, which extends in the xy plane, as shown in the section I. Thereafter, a thin, electrically conductive, z. B. metallic, seed layer 22 on the antenna substrate 3 applied, wherein the seed layer 22 the pattern is structured in the same way as the antenna to be trained 2 , The germ layer 22 the antenna layer 2 can affect the antenna substrate 3 z. B. imprinted, vapor-deposited or laminated. This is shown in section II. In a subsequent step, the antenna substrate 3 and the germ layer arranged thereon 22 deformed by means of a forming tool, so that the seed layer 22 in some areas bulges 16 forms, as shown in section III. Subsequently, by means of a galvanic deposition, the seed layer 22 reinforced by further application of material until the formed trace 6 has reached a predetermined layer thickness, as shown in section IV.

6 shows three sectional views through card body according to the invention 9 , Cut I in the upper part of the 6 is a vertical section through the card body 9 perpendicular to the through the card body 9 spanned xy plane. The card body 9 has a a front side of the card body 9 forming upper cover layer 10 and an underside of the card body 9 forming lower cover layer 10 ' on. Both the upper cover layer 10 as well as the lower cover layer 10 ' may each have one or more layers and each have a thickness in the range of> 12 .mu.m, preferably from 25 .mu.m to 400 .mu.m, more preferably from 50 .mu.m to 200 .mu.m. A chip card made of the card body has a thickness in the range of 0.1 mm to 3 mm, preferably 0.5 mm to 1 2 mm.

The antenna substrate 3 and the antenna layer disposed thereon 2 are from the topcoats 10 . 10 ' enclosed. This has a trace 6 the antenna layer 2 in some areas bulges 16 in a first case, see section II, cone-shaped and in a second case, see section III, are rail-shaped. The bonding of the cover layers 10 . 10 ' , the antenna substrate 3 and the antenna layer 2 with each other, z. B. by means of a lamination, is carried out such that the bulges 16 the conductor track 6 not deformed by the connection process. It is preferred if the material of the cover layer 10 softens during the connection process and the bulges 16 flows around without significantly deforming them.

The vertical section in the upper part of the 6 shows a given spatial area 25 of the card body 9 as a recess for receiving a chip module 13 is provided. The given spatial area 25 is limited by a) the surface of the card body 9 , b) side surfaces 26 extending from the surface of the card body 9 extend to a sectional plane AA, and c) a bottom surface 27 that are in the immediate vicinity of the side surfaces 26 adjacent areas coincides with the sectional plane AA and is formed in the central region by a trough-shaped bottom surface. The material of the card body 9 located in the given spatial area 25 of the card body 9 is worked out in a subsequent process step for producing a smart card from the card body.

Section II in the middle part of the 6 is a section along the top of the 6 (= Section I) indicated cutting plane AA, wherein the bulges are formed cone-shaped. The sectional plane AA indicates a depth, up to the one from the card body 9 recess to be worked out is sufficient. Therefore, the section II corresponds in regions to a state after a formation of a recess from the card body 9 , where bulges 16 are so far removed that they in the sectional plane AA second contact surfaces 19 Form, flush in one in the upper surface layer 10 running surface 12 lie.

Section III in the lower part of the 6 is a section along the top of the 6 (= Section I) indicated sectional plane AA, wherein the bulges are rail-shaped. The sectional plane AA indicates a depth, up to the one from the card body 9 recess to be worked out is sufficient. Therefore, the section III corresponds in regions to a state after formation of a recess from the card body 9 , where bulges 16 are so far removed that they in the sectional plane AA second contact surfaces 19 Form, flush in one in the upper surface layer 10 running surface 12 lie.

7 shows a vertical section, perpendicular to the through the card body 9 spanned xy plane, by a chip card 1 , From the map body 9 consisting of an upper cover layer 10 , a lower cover layer 10 ' , the antenna substrate 3 and the antenna layer disposed thereon 2 , is a recess 11 worked out whose boundary surfaces the enclosing surfaces or the contour of the given spatial area 25 correspond. During the formation of the recess 11 were the upper parts of a first subset of the bulges 16 so far removed that second contact surfaces 19 were formed in a one bottom of the recess 11 forming surface 12 of the card body 9 lie. During the formation of the central area of the recess 11 which has a greater depth than the edge regions of the recess 11 , became a second subset of the bulges 16 and the tracks 6 very worn. In this central area, therefore, no second contact surfaces 19 educated.

In the recess 11 is a chip module 13 attached to the edge of its lower, the bottom of the recess 11 facing surface 14 first contact surfaces 15 having the second contact surfaces 19 the antenna 2 lie opposite and are electrically connected to them. The electrical contact can be directly between the contact surfaces 15 . 19 be prepared or by means of an interposed connecting means which in 7 not shown. 7 also shows the cutting plane AA, which is the level of a soil 12 the one from the card body 9 recessed recess 11 indicates.

The dimensions of the recess 11 are dependent on the dimensions of the chip module used. Typical values for the total width / length of the recess 11 are at 5 to 30 mm, preferably 10 to 20 mm, typical values for the depth, measured as the distance of the surface of the card body 9 to the cutting plane AA, are 50 to 500 microns, preferably 100 to 300 microns. A typical value for a maximum depth of recess 11 is in the range of 100 to 1000 microns, preferably from 300 to 600 microns.

8a shows a section through two immediately adjacent bulges 16 a trace 6 , shown as solid lines. The dotted lines indicate the shape of the track 6 before the formation of the bulges 16 at. The width B of a bulge 16 is defined as the largest extent of the bulge 16 forming deformed area 30 the conductor track 6 in the plane defined by the card body, the deformed area 30 as an area of the at least one track 6 is defined, in which a surface of the at least one conductor track 6 a height deviation in the z-direction of more than 5 microns to a surface defined as the reference surface of the at least one conductor before forming the bulge 16 having. In the case of a cone-shaped bulge 16 The width B corresponds to the diameter of the bulge at the foot of the cone. The undeformed area 20 is the complementary area of the at least one track 6 , The width B of a bulge 16 is in a range of 25 to 2000 μm, preferably in a range of 50 to 1000 μm, more preferably in a range of 100 to 500 μm.

Two adjacent bulges 16 have a distance A, defined as the distance of the vertices S _E of the bulges 16 formed increases 17 , The distance A of adjacent bulges 16 is in a range of 100 to 5000 microns, preferably in a range of 250 to 2000 microns. The height of the bulges 16 is preferably in a range of 2 to 100 microns, in particular in a range of 5 to 75 microns.

The bulges 16 make up on a first page 7 the at least one conductor track 6 an increase 17 and on one of the first page 7 opposite second side 8th the at least one conductor track 6 one to the increase 17 corresponding recess 18 out.

A bulge 16 is defined among other things by a height HE of the bulge 16 formed increase 17 , measured as the distance of the apex S _E of the bulge 16 formed increase 17 from the corresponding surface in an undeformed area 20 the conductor track 6 , and by a height H _V of the bulge 16 formed depression 18 , measured as the distance of the sole point S _V by the bulge 16 formed depression 18 from the corresponding surface in an undeformed area 20 the conductor track 6 , The height HE of the bulge 16 formed increase 17 is in a range of 20 to 500 μm, preferably in a range of 50 to 300 μm. The height H _V of the bulge 16 formed depression 18 is in a range of 20 to 500 μm, preferably in a range of 50 to 300 μm.

Because the bulges 16 by deforming the conductor track 6 were formed by means of a forming tool, which is a stretching or stretching of the material of the conductor track 6 has the consequence, the layer thickness D _{0 of} the conductor track 6 in the undeformed area 20 at least as large as or greater than the layer thickness D _{P of} the conductor track 6 measured at a point P in the deformed region 30 the conductor track 6 , In this case, the layer thickness D _P in the deformed region 30 measured perpendicular to a passing through the point P tangent plane E _P. The layer thickness D _{0 of} the conductor track 6 in the undeformed area 20 is in a range of 2 to 70 μm, preferably in a range of 5 to 50 μm. The minimum layer thickness D _P in the deformed region 30 the conductor track 6 is in a range of 1 to 60 microns, preferably in a range of 2 to 40 microns.

It is also possible that the in 8a shown bulges 16 by depositing a metallic layer in a vapor deposition process on a partially deformed antenna substrate. Also in this case will be in the deformed areas 30 of the antenna substrate deposited less material per surface unit than in non-deformed areas 20 of the antenna substrate, so that the layer thickness D _{0 of} the conductor track 6 in the undeformed area 20 at least as large as or greater than the layer thickness D _{P of} the conductor track 6 measured at a point P in the deformed region 30 the conductor track 6 is.

8b shows a section through a conductor track 6 , the area wise 30 as a bulge 16 is trained. The bulge 16 defines undeformed areas 20 and a deformed area 30 the conductor track 6 , The conductor track 6 is formed by a thin, electrically conductive seed layer 22 in the 8b indicated by hatching, area by area 30 as a bulge 16 is formed and subsequently in a galvanic deposition process arranged on an antenna substrate seed layer 22 coated with electrodeposited material until the trace 6 has a desired layer thickness.

By doing deformed area 30 the germ layer 22 there is a greater material deposition than in the non-deformed areas 20 the germ layer 22 because in the area of the bulge 16 , In particular in the region of the apex point S _E , a higher electric field strength and thus also a higher current density is present than in the non-deformed regions 20 , The higher current density results in an accelerated material build-up (layer thickness per unit time), which makes it in the deformed area 30 the germ layer 22 leads to a stronger material deposition. Therefore, the layer thickness of the conductor track 6 in the undeformed areas 20 less than or at most as large as in the deformed area 30 ,

The 9 to 12 show sections through a card body according to the invention 9 with one between an upper cover layer 10 and an antenna substrate 3 embedded trace 6 that in a deformed area as a bulge 16 is trained.

9 shows a first case in which a depth T of a recess 11 so chosen, that the bulge 16 is not removed. In this case, no electrical contact between a chip module and the conductor track 6 getting produced.

10 shows a second case in which the depth T of the recess 11 just so large is chosen that the top tip of the recess 16 is removed. In the 10 illustrated depth T of the recess 11 thus provides a minimum depth of the recess 11 in which a desired electrical contact between the second contact surface 19 and the chip module can be made.

11 shows a third case in which the depth T of the recess 11 is chosen so large that at the bottom of the recess 11 just a rest of the track 6 preserves and there a second contact area 19 can train. In the 11 illustrated depth T of the recess 11 thus provides a maximum depth of the recess 11 in which an electrical contact between the second contact surface 19 and a chip module can be made.

12 shows a fourth case in which the depth T of the recess 11 so large is chosen that both the material of the bulge 16 as well as the material of the undeformed trace 6 was completely removed. In this case, no second contact surface is formed and an electrical contact between the chip module and the conductor track 6 can not be made in the desired way.

The present invention thus makes it possible to have the depth T of a recess 11 between the in 10 and 11 selected extremes to choose, ie in a much larger area than in the previously known card bodies, in which the tolerance range of a recess 11 on the thickness of the conductor track 6 was limited.

13 illustrates a method for forming a double-sided conductor track 6 , In a first step, an antenna substrate 3 provided as shown in section I. In a second step, by means of a forming tool in the antenna substrate 3 a bulge 16 formed, with the top of the bulge 16 has a through opening. This can be z. B. by punching a forming tool or a removal of the antenna substrate 3 take place in the area to be opened. The thus deformed antenna substrate 3 is shown in section II. In a subsequent step, both on the front 4 as well as on the back 5 of the antenna substrate 3 electrically conductive material applied to the conductor track 6 formed. The so-formed double-sided conductor track 6 is shown in section III.

14 shows two sections through a card body 9 with the in 13 shown antenna layer 2 , In the upper area of the 14 is a vertical section through the card body 9 shown at the bottom of the 14 is a section along a section plane BB indicated in the upper part shown. Through the formation of the tracks 6 on both sides of the antenna substrate 3 becomes the second contact surface 19 formed in the form of a double ring when a recess of the card body is worked out to a depth indicated by the cutting plane BB. The advantage of this embodiment is that the second contact surface 19 thus considerably larger than in only one-sided training of the conductor track 6 , such as In 6 shown. This allows the electrical contact between the antenna 2 and a chip module can be made simpler and safer.

15 shows a vertical section through a chip card, which consists of the in 14 illustrated card body 9 was trained. This was from the card body 9 a recess 11 worked out, the sectional plane BB the level of a floor 12 the one from the card body 9 recessed recess 11 indicates. In the recess 11 becomes a chip module 13 used, wherein contact surfaces of the chip module 13 and the second contact surfaces 19 the antenna 2 come into contact with each other or at least opposite, so that an electrical contact between the contact surfaces 19 the antenna 2 and the first contact surfaces 15 of the chip module 13 formed.

16 shows another method for forming bulges 16 a double-sided conductor track 6 , For this purpose, firstly an antenna substrate is provided, as shown in the section I, and the antenna substrate in regions in the form of bulges 16 deformed, as shown in section II. After that, the antenna substrate becomes 3 on both sides with conductor tracks 6 coated, z. B. steamed, as shown in section III, and finally in by the bulges 16 formed depressions 18 second electrically conductive material 21 introduced as shown in section IV. The second electric conductive material 21 can z. B. be a solder paste or an electrically conductive adhesive.

17 shows two sections through a card body 9 with the in 16 shown antenna layer 2 , In the upper area of the 17 is a vertical section through the card body 9 shown at the bottom of the 17 is a section along a cutting plane DD indicated in the upper part shown. Through the formation of the tracks 6 on both sides of the antenna substrate 3 becomes the second contact surface 19 formed in the form of a double ring when a recess of the card body is worked out to a specified by the cutting plane DD depth. In addition to the double ring of the second contact surface 19 is the inner surface of the inner ring 19 with the electrically conductive material 21 filled. The advantage of this arrangement is thus a significant increase in the second contact surfaces 19 around the inner surface of the inner ring 19 , This allows the electrical contact between the antenna 2 and a chip module can be made simpler and safer.

18 shows a vertical section through a chip card, which consists of the in 17 illustrated card body 9 was trained. This was from the card body 9 a recess 11 worked out, the sectional plane DD the level of a floor 12 the one from the card body 9 recessed recess 11 indicates. When working out the recess 11 become the second contact surfaces 19 together with a part of the electrically conductive material 21 , as in 17 shown, exposed. In the recess 11 becomes a chip module 13 used, wherein contact surfaces of the chip module 13 and the second contact surfaces 19 the antenna 2 come into contact with each other or at least opposite, so that an electrical contact between the contact surfaces 19 the antenna 2 and the first contact surfaces 15 of the chip module 13 formed.

19 shows steps to form bulges 16 on a track 6 with one in the bulges 16 arranged electrically conductive material 21 , First, an antenna substrate 3 , z. In the form of a plastic film, as shown in section I. Below is on the antenna substrate 3 a trace 6 arranged of an electrically conductive material and the antenna substrate together with the conductor track 6 with a forming tool so deformed that the trace 6 in some areas bulges 16 forms, as shown in the section II. The bulges 16 are formed so that they form recesses in the direction of the negative z-axis. In this trough-shaped recess 18 becomes electrically conductive material 21 that differs from the material of the trace 6 differs, introduced, z. B. a drop of a solder paste or an electrically conductive adhesive.

20 shows two sections through a card body 9 with the in 19 shown antenna layer 2 , In the upper area of the 20 is a vertical section through the card body 9 shown at the bottom of the 20 is a section along a section indicated in the upper part CC shown. In the central region of the bottom of the recess forming surface 12 are two elliptical surfaces of electrically conductive material 21 which serve as contact surfaces for contacting a chip module to be arranged thereon.

21 shows a section through a chip card 1 from the in 20 illustrated chip card 9 was formed by a recess 11 from the card body 9 was worked out and in the recess 11 a chip module 13 was used. The chip module 13 has at its to the bottom of the recess 11 pointing surface first contact surfaces 15 on that with the at the formation of the recess 11 exposed electrically conductive material 21 come into contact, so that an electrical connection between the chip module 13 and the antenna 2 formed.

LIST OF REFERENCE NUMBERS

1

smart card

2

antenna

3

antenna substrate

4

Front of 3

5

Back of 3

6

conductor path

7

first page of 6

8th

second page of 6

9

card body

10, 10 '

Layer of 9

11

spatial area, recess of 9

12

Surface of 9

13

chip module

14

Surface of 13

15

first contact surface of 13

16

upheaval

17

increase

18

deepening

19

second contact surface

20

undeformed area

21

second electrically conductive material

22

seed layer

25

spatial area

26

side surface

27

floor area

30

deformed area

A

distance

B

width

D ₀

Layer thickness in the undeformed area

D _P

Layer thickness at point P

E _P

Tangential plane through the point P

H _E

Height of 17

H _V

Height of 18

P

Point

S _E

vertex

S _V

sole point

T

Depth of 11

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• DE 19610507 A [0002]
• DE 19610044 C [0003]

Cited non-patent literature

• ISO 7816 [0009]

Claims (12)

Card body ( 9 ) for producing a chip card ( 1 ), comprising one in the card body ( 9 ) embedded antenna ( 2 ) with conductor tracks ( 6 ), wherein at least one of the tracks ( 6 ) partially as at least one bulge ( 16 ) is formed and at least part of the at least one bulge ( 16 ) in a given spatial area ( 25 ) of the card body ( 9 ) arranged as a recess ( 11 ) for receiving a chip module ( 13 ) is provided. Card body ( 9 ) according to claim 1, characterized in that the at least one bulge ( 16 ) on a first page ( 7 ) of the at least one conductor track ( 6 ) an increase ( 17 ) and on one of the first page ( 7 ) opposite the second side ( 8th ) of the at least one conductor track ( 6 ) one to the increase ( 17 ) corresponding recess ( 18 ) trains. Card body ( 9 ) according to claim 2, characterized in that in the recess ( 18 ) an electrically conductive material ( 21 ) is arranged, which is made of a material of the at least one conductor track ( 6 ) is different. Card body ( 9 ) according to one of the preceding claims, characterized in that the at least one conductor track ( 6 ) one to the at least one bulge ( 16 ) subsequent undeformed area ( 20 ), wherein the at least one bulge ( 16 ), parallel to one of the card body ( 9 ), the undeformed area ( 20 ) of the at least one conductor track ( 6 ) surmounted by a height (H _E ) of at least 50 microns. Card body ( 9 ) according to one of the preceding claims, characterized in that the conductor tracks ( 6 ), perpendicular to one of the card body ( 9 ) spanned plane, having a thickness (D ₀ , D _P ) of at most 70 microns. Card body ( 9 ) according to one of the preceding claims, characterized in that the at least one bulge ( 16 ) has substantially a contour of a cone whose base surface on the non-deformed region ( 20 ) the conductor track ( 6 ) is arranged. Card body ( 9 ) according to one of the preceding claims, characterized in that the conductor tracks ( 6 ) are formed as electrically conductive layers on a front side ( 4 ) and one of the front ( 4 ) opposite rear side ( 5 ) of an antenna substrate ( 3 ) are arranged. Method for producing a chip card ( 1 ), comprising the steps of: forming an antenna ( 2 by arranging a pattern-structured layer of an electrically conductive material on an antenna substrate ( 3 ), wherein the pattern-structured layer conductor tracks ( 6 ) of the antenna ( 2 ) trains; Forming at least one of the tracks ( 6 ) partially as at least one bulge ( 16 ); Embedding the Antenna Substrate ( 3 ) with the antenna arranged thereon ( 2 ) between several superimposed layers ( 10 ); Forming a card body ( 9 ) by connecting the several superimposed layers ( 10 ) and the interposed antenna substrate ( 3 ) with the antenna ( 2 ) such that the at least one bulge ( 16 ) preserved; Forming a recess ( 11 ) in the card body ( 9 ) for receiving a chip module ( 13 ) attached to a surface ( 14 ) first contact surfaces ( 15 ), such that at least a part of the at least one bulge ( 16 ) is removed and thereby at least a second contact surface ( 19 ) is formed in a recess ( 11 ) delimiting surface ( 12 ) of the card body ( 9 ) lies; and arranging the chip module ( 13 ) in the recess ( 11 ) such that an electrical connection between the at least one second contact surface ( 19 ) and one of the first contact surfaces ( 15 ) is formed. Method according to claim 8, characterized in that for forming the antenna ( 2 ) and the at least one bulge ( 16 ) a germ layer ( 22 ) on the antenna substrate ( 3 ), the antenna substrate ( 3 ) with the germ layer arranged thereon ( 22 ) in regions corresponding to the at least one bulge ( 16 ) is deformed, and the germ layer ( 22 ) is galvanically reinforced until the area as at least one bulge ( 16 ) formed tracks ( 6 ) are formed. Method according to claim 8, characterized in that for forming the antenna ( 2 ) and the at least one bulge ( 16 ) the antenna substrate ( 3 ) in regions corresponding to the at least one bulge ( 16 ) is deformed and the pattern-structured layer of the electrically conductive material on the partially deformed antenna substrate ( 3 ) is arranged. Method according to one of claims 8 to 10, characterized in that for forming the at least one bulge ( 16 ) a mechanical forming tool is used. Method according to one of claims 8 to 11, characterized in that before the Arranging the chip module ( 13 ) in the recess a connecting means on the at least one second contact surface ( 19 ) is applied, the electrical connection between the at least one second contact surface ( 19 ) and the first contact surface ( 15 ).

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