FR2232907B1
(de)
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1973-06-08 |
1978-07-13 |
Frances Andre |
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1977-01-03 |
1978-04-04 |
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1981-10-26 |
1986-04-15 |
Amp Incorporated |
High density interconnect system
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1982-03-22 |
1984-05-01 |
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1990-03-27 |
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Method of making a chip carrier with terminating resistive elements
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1990-04-26 |
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1990-12-21 |
1991-02-13 |
Amp Holland |
Stamped and formed electrical tab
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1991-06-27 |
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1993-11-15 |
2001-05-16 |
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1993-11-15 |
1995-09-26 |
Berg Technology, Inc. |
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1994-01-24 |
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Telecommunications terminal
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2001-02-13 |
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2001-02-13 |
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2001-02-13 |
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2001-02-13 |
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2002-07-31 |
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2007-08-22 |
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Medallion Technology, Llc |
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2011-02-15 |
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Medallion Technology, Llc |
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2014-08-14 |
2017-01-24 |
Continental Automotive Systems, Inc. |
Compliant staple pin for connecting multiple printed circuit boards
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2015-02-11 |
2016-08-30 |
Dell Products, Lp |
Double action compliant connector pin
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2016-11-22 |
2018-03-27 |
Lear Corporation |
Remote control device having motherboard and battery daughterboard connected by interconnect
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2017-04-14 |
2021-07-06 |
Amphenol Corporation |
Float connector for interconnecting printed circuit boards
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2017-04-25 |
2017-12-19 |
Pat Technology Systems Inc. |
Grounding system and method for providing electrical contact between two components
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