DE1913988A1 - Soldering ti-zr parts to copper compacts - Google Patents

Soldering ti-zr parts to copper compacts

Info

Publication number
DE1913988A1
DE1913988A1 DE19691913988 DE1913988A DE1913988A1 DE 1913988 A1 DE1913988 A1 DE 1913988A1 DE 19691913988 DE19691913988 DE 19691913988 DE 1913988 A DE1913988 A DE 1913988A DE 1913988 A1 DE1913988 A1 DE 1913988A1
Authority
DE
Germany
Prior art keywords
copper
titanium
soldering
parts
eutectic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19691913988
Other languages
German (de)
Inventor
Arno Hinckeldey
Laimboeck Dr Josef
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE19691913988 priority Critical patent/DE1913988A1/en
Publication of DE1913988A1 publication Critical patent/DE1913988A1/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/005—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of a refractory metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Common Detailed Techniques For Electron Tubes Or Discharge Tubes (AREA)

Abstract

Soldering Ti-Zr parts to copper compacts. Process for attaching titanium or zirconium parts to copper bodies, particularly anodes in electrical discharge devices, by the formation of eutectic soldering phases consists of electro-plating the copper-compact body first with a protective Ni layer, adding a copper film and then fixing the titanium and zirconium particles by heating, e.g. in a protective gas to at least 880 degrees C but not higher than 950 degrees C whilst forming a eutectic soldering phase.

Description

Verfahren zum Befestigen von Titan- oder Zirkonteilen auf Kupfer-Kompakt-Körpern, insbesondere Anoden,elektrischer Entladungsgefäße Die Erfindung betrifft ein-Verfahren zum Befestigen von Titan- oder Zirkonteilen auf Kupfer-Kompakt-Körpern, insbesondere Anoden, elektrischer Entladungsgefäße unter Bildung einer eutektischen Sotphaæe.Method for fastening titanium or zirconia parts on compact copper bodies, in particular anodes, electrical discharge vessels. The invention relates to a method for fastening titanium or zirconia parts on compact copper bodies, in particular Anodes, electrical discharge vessels with the formation of a eutectic sotphaæe.

Sie hat besondere Bedeutung für das Befestigen von Titan- oder Zirkongettern an Kupfer-Kompakt-Elektro den, insbesondere an Kupfernaoden. elektrischer Entladungsgefäße.It is of particular importance for the fastening of titanium or zircon getters on compact copper electrodes, especially on copper aodes. electrical discharge vessels.

Bei der Verlötung von Titan- bzw. Zirkonteilen mit Kupfer-Körpern tritt bei 88000 eine eutektische Legierung auf, die schon bei geringer Temperaturerhöhung über die eutektische Temperatur hinaus zu einer sehr starken Legierungsbildung führt, so daß z.3. das aufgebrachte Titanteilchen auf der Eupfer-Kompakt-Flektrode von dieser in erheblichem Maße gelöst.wird.When soldering titanium or zirconia parts with copper bodies a eutectic alloy occurs at 88000, which occurs even with a slight increase in temperature above the eutectic temperature leads to a very strong alloy formation, so that z.3. the applied titanium particles on the Eupfer compact flectrode from this is solved to a considerable extent.

Diese nachteilige Erscheinung,z.B. biem Anbringen von Titan-oder Zirkongettern auf Kupfer-Anoden,zu vermeiden, ist das Ziel der Erfindung.This disadvantageous phenomenon, e.g. when attaching titanium or zirconia frames on copper anodes, is the aim of the invention.

Erreicht wird dies bei einem im ersten Absatz beschriebenen Verfahren nach der Erfindung dadurch, daß der Kupfer-Kompakt-Körper zuerst galvanisch vernickelt und darauf dann unter Zwischenfügen einer Kupferfolie das Titan- bzw. Zirkonteilchen durch Erwärmen, z.B. in einem Schutzgas, auf mindestens 88000 jedoch höchstens 95000 unter Bindung einer eutektischen Lötphase befestigt wird.This is achieved with a procedure described in the first paragraph according to the invention in that the compact copper body is first galvanically nickel-plated and then, with the interposition of a copper foil, the titanium or zirconium particles by heating, e.g. in a protective gas, to a minimum of 88,000 but a maximum of 95,000 is attached with binding of a eutectic solder phase.

Durch die Vernickelung des kompakten Kupferteilos wird die sonst eintretende starke Begierungsbildung vermieden, Der Schmelzpunkt der sich stattdessen ausbildenden Kupfer-Nickel-Legierung liegt oberhalb von 108300 und der der Nickel-Uitan-Legierung bei mindestens 95500. Beide Schmelzpunkte liegen somit höher als der der eutektischen Kupfer-itan-Legierung.Due to the nickel-plating of the compact copper part, the otherwise occurring Avoided strong acidification, the melting point of the instead developing Copper-nickel alloy is above 108300 and that of the nickel-Uitan alloy at least 95500. Both melting points are thus higher than those of the eutectic Copper-itan alloy.

Bei der praktischen Durchführung des Verfahrens wird somit das Titan- bzw. das Zirkongetter zusammen mit einer KupSer-Folie auf die vernickelte Anode aufgelegt bzw. aufgepreßt und durch entsprechendes Erwärmen verlötet. Die Nickelschicht schützt dabei das zu befestigende Teilchen gegen eine Legierungsbildung durch das kompakte Kupfer. Die Stärke der dabei verwendeten Folie bestimmt die Tiefe der Legierungs-Zone mit dem Titan- bzw.In the practical implementation of the process, the titanium or the zircon getter together with a copper foil on the nickel-plated anode placed or pressed on and soldered by heating accordingly. The nickel layer protects the particle to be fastened against the formation of an alloy by the compact copper. The thickness of the foil used determines the depth of the alloy zone with the titanium resp.

Zirkonteilchen und kann somit im Bedarfsfall variiert werden.Zirconium particles and can therefore be varied if necessary.

1 Patentanspruch1 claim

Claims (1)

Patentanspruch Verfahren zum Befestigen von Titan- oder Zirkontcilen auf Kupfer-Kompakt-Körpern, insbesondere Anoden, elektrischer Entladungsgefäße mittels Bildung einer eutektischen Lötphase, d a d u r c h g e k e n n -z e i c h n e t , daß auf den Kupfer-Kompakt-Körper zuerst galvanisch eine Nickel-Schutzschicht aufgebracht und darauf unter Zwischenfügen einer Kupferfolie das betreffende Titan- bzw. Zirkonteilchen durch Erwärmen, z.B. in einem Schutzgas, auf mindestens 880°C jedoch höchstens 95000 unter Bildung einer eutektischen Lötphase befestigt wird. Claim method for attaching titanium or zirconia sticks on compact copper bodies, in particular anodes, by means of electrical discharge vessels Formation of a eutectic soldering phase, which is not shown that a protective nickel layer is first applied to the compact copper body by electroplating applied and then with the interposition of a copper foil the relevant titanium or zirconium particles by heating, e.g. in a protective gas, to at least 880 ° C but not more than 95,000 is attached to form a eutectic solder phase.
DE19691913988 1969-03-19 1969-03-19 Soldering ti-zr parts to copper compacts Pending DE1913988A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19691913988 DE1913988A1 (en) 1969-03-19 1969-03-19 Soldering ti-zr parts to copper compacts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691913988 DE1913988A1 (en) 1969-03-19 1969-03-19 Soldering ti-zr parts to copper compacts

Publications (1)

Publication Number Publication Date
DE1913988A1 true DE1913988A1 (en) 1970-10-15

Family

ID=5728662

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19691913988 Pending DE1913988A1 (en) 1969-03-19 1969-03-19 Soldering ti-zr parts to copper compacts

Country Status (1)

Country Link
DE (1) DE1913988A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2655409A1 (en) * 1975-12-18 1977-06-30 Ferco Int Usine Ferrures ACTUATING DEVICE FOR DOORS WITH HANDLE, WINDOW OR DGL.
US4714107A (en) * 1981-03-05 1987-12-22 International Laser Systems, Inc. Titanium heat exchanger for laser cooling

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2655409A1 (en) * 1975-12-18 1977-06-30 Ferco Int Usine Ferrures ACTUATING DEVICE FOR DOORS WITH HANDLE, WINDOW OR DGL.
US4714107A (en) * 1981-03-05 1987-12-22 International Laser Systems, Inc. Titanium heat exchanger for laser cooling

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