DE1913679B2 - HEAT CONDUCTING DEVICE FOR ELECTRIC ASSEMBLIES - Google Patents

HEAT CONDUCTING DEVICE FOR ELECTRIC ASSEMBLIES

Info

Publication number
DE1913679B2
DE1913679B2 DE19691913679 DE1913679A DE1913679B2 DE 1913679 B2 DE1913679 B2 DE 1913679B2 DE 19691913679 DE19691913679 DE 19691913679 DE 1913679 A DE1913679 A DE 1913679A DE 1913679 B2 DE1913679 B2 DE 1913679B2
Authority
DE
Germany
Prior art keywords
heat conducting
conducting device
electric assemblies
assemblies
electric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE19691913679
Other languages
German (de)
Other versions
DE1913679A1 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to DE19691913679 priority Critical patent/DE1913679B2/en
Publication of DE1913679A1 publication Critical patent/DE1913679A1/en
Publication of DE1913679B2 publication Critical patent/DE1913679B2/en
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
DE19691913679 1969-03-18 1969-03-18 HEAT CONDUCTING DEVICE FOR ELECTRIC ASSEMBLIES Ceased DE1913679B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19691913679 DE1913679B2 (en) 1969-03-18 1969-03-18 HEAT CONDUCTING DEVICE FOR ELECTRIC ASSEMBLIES

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19691913679 DE1913679B2 (en) 1969-03-18 1969-03-18 HEAT CONDUCTING DEVICE FOR ELECTRIC ASSEMBLIES

Publications (2)

Publication Number Publication Date
DE1913679A1 DE1913679A1 (en) 1970-09-24
DE1913679B2 true DE1913679B2 (en) 1971-03-25

Family

ID=5728499

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19691913679 Ceased DE1913679B2 (en) 1969-03-18 1969-03-18 HEAT CONDUCTING DEVICE FOR ELECTRIC ASSEMBLIES

Country Status (1)

Country Link
DE (1) DE1913679B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2608125A1 (en) * 1976-02-27 1977-09-08 Tekade Felten & Guilleaume Plug:in unit for communications equipment rack - has front plate with cooling fins and printed circuit boards mounted on it at right angles
DE3310109A1 (en) * 1983-03-21 1984-09-27 Siemens AG, 1000 Berlin und 8000 München Insulating spacer for printed-circuit boards
DE9316149U1 (en) * 1993-10-22 1993-12-23 Deutsche Aerospace Heat dissipation hoods for electronic plug-in cards in a coolable housing

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4029999A (en) * 1975-04-10 1977-06-14 Ibm Corporation Thermally conducting elastomeric device
DE3003373A1 (en) * 1980-01-31 1981-08-06 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Plug-in printed circuit board - has electrically-insulating, heat-conducting layer between board proper and base plate for component cooling
JPS58218376A (en) * 1982-06-14 1983-12-19 Mitsubishi Electric Corp Output controller of welding machine
FR2654890B1 (en) * 1989-11-17 1996-08-02 Matra Sep Imagerie Inf THERMAL DISSIPATION DEVICE FOR PRINTED CIRCUIT BOARD AND METHOD FOR THE PRODUCTION THEREOF.
FR2669178B1 (en) * 1990-11-09 1996-07-26 Merlin Gerin ELECTRONIC BOX AND THERMAL DRAIN CARD AND METHOD FOR MANUFACTURING SUCH A CARD.
DE4339786C5 (en) * 1993-11-18 2004-02-05 Emi-Tec Elektronische Materialien Gmbh Process for producing a heat dissipation arrangement

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2608125A1 (en) * 1976-02-27 1977-09-08 Tekade Felten & Guilleaume Plug:in unit for communications equipment rack - has front plate with cooling fins and printed circuit boards mounted on it at right angles
DE3310109A1 (en) * 1983-03-21 1984-09-27 Siemens AG, 1000 Berlin und 8000 München Insulating spacer for printed-circuit boards
DE9316149U1 (en) * 1993-10-22 1993-12-23 Deutsche Aerospace Heat dissipation hoods for electronic plug-in cards in a coolable housing

Also Published As

Publication number Publication date
DE1913679A1 (en) 1970-09-24

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