DE1828733U - ARRANGEMENT OF A LINE ON CIRCUIT BOARDS FOR PRINTED CIRCUITS. - Google Patents

ARRANGEMENT OF A LINE ON CIRCUIT BOARDS FOR PRINTED CIRCUITS.

Info

Publication number
DE1828733U
DE1828733U DEN11990U DEN0011990U DE1828733U DE 1828733 U DE1828733 U DE 1828733U DE N11990 U DEN11990 U DE N11990U DE N0011990 U DEN0011990 U DE N0011990U DE 1828733 U DE1828733 U DE 1828733U
Authority
DE
Germany
Prior art keywords
line
arrangement
circuit boards
printed circuits
diameter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DEN11990U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NORDDEUTSCHE MENDE RUNDFUNK A
Original Assignee
NORDDEUTSCHE MENDE RUNDFUNK A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NORDDEUTSCHE MENDE RUNDFUNK A filed Critical NORDDEUTSCHE MENDE RUNDFUNK A
Priority to DEN11990U priority Critical patent/DE1828733U/en
Publication of DE1828733U publication Critical patent/DE1828733U/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
    • H05K2201/10303—Pin-in-hole mounted pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10356—Cables

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)

Description

Anordnung einer Leitung an Leiterplatten für gedruckte Schaltungen Die Neuerung bezieht sich auf die Anordnung einer, vorzugsweise flexiblen, Leitung an Leiterplatten für gedruckte Schaltungen.Arrangement of a line on printed circuit boards The innovation relates to the arrangement of a, preferably flexible, line on printed circuit boards.

Es ist auch bei gedruckten Schaltungen häufig erforderlich, zusätzliche Leitungen einzufügen, und zwar insbesondere flexible Leitungen zur Herstellung von Verbindungen mehrerer Leiterplatten untereinander oder zum Anschließen von nicht auf den Leiterplatten anzuordnenden Schaltungsbauteilen, z. B. von Lautsprechern oder größeren Schaltern. Bisher wurden diese Leitungen entweder über Einstecklötösen angeschlossen oder direkt auf dem betreffenden, aufkaschierten Kupferleiter festgelötet. Die Lötösen bedeuten zusätzlichen Aufwand. Die direkte Verlötung mit dem Kupferleiter ist für diesen wiederum gefährlich, weil er durch Zug an dem Leitungsende leicht von der Leiterplatte abgerissen werden kann. Aber in beiden Fällen ist die Lötstelle an sich nicht zugentlastet, so daß immer die Gefahr besteht, daß das angelötete Leitungsende unmittelbar an der Lötstelle abbricht.It is also often necessary for printed circuits to carry out additional work Insert lines, in particular flexible lines for the production of Connections of several circuit boards with each other or for connecting not circuit components to be arranged on the printed circuit boards, e.g. B. from speakers or larger switches. So far, these lines were either via plug-in solder lugs connected or soldered directly to the relevant laminated copper conductor. The solder lugs mean additional work. Direct soldering to the copper conductor is in turn dangerous for this because it can be easily pulled by pulling on the end of the line can be torn off the circuit board. But in both cases the solder joint is not relieved of strain in itself, so there is always the risk that the soldered on The end of the line breaks off directly at the soldering point.

Mit der Neuerung werden die vorbeschriebenen Nachteile dadurch vermieden, daß für eine anzuschließende Leitung zwei Durchführungslöcher in geringem Abstand voneinander in die Leiterplatte eingelassen sind, von denen mindestens eines unmittelbar an der vorbestimmten Lötstelle angeordnet ist.With the innovation, the disadvantages described above are avoided by that for a line to be connected, two feed-through holes at a small distance are embedded from each other in the circuit board, at least one of which is immediately is arranged at the predetermined solder joint.

Die Neuerung ist an Hand eines in der Zeichnung dargestellten Schnittes durch eine Lötstelle im einzelnen erläutert. Dargestellt ist ein Ausschnitt aus einer Leiterplatte 1 mit einem aufkaschierten Kupferleiter 2. An diesen Leiter 2 ist ein Kondensator 3 angelötet und das Ende einer flexiblen Verbindungsleitung 4 soll hier ebenfalls angelötet werden. Zum Verlöten der Leitung 4 mit dem Kupferleiter 2 mußte sonst, wenn keine besondere Lötöse an einer solchen Stelle vorgesehen war, das Leitungsende von der Leiterseite der Platte her angelötet werden, d. h. also von Hand und nicht im Tauchverfahren. Neuerungsgemäß ist nun unmittelbar an der vorbestimmten Lötstelle ein Durchführungsloch 5 vorgesehen und in geringem Abstand daneben ein zweites Loch 6, dessen Durchmesser etwas größer ist als der Durchmesser des anzuschließenden Leitungsendes mit Isoliermantel.The innovation is based on a section shown in the drawing explained in detail by a soldering point. An excerpt from is shown a printed circuit board 1 with a laminated copper conductor 2. To this conductor 2 is a capacitor 3 soldered on and the end of a flexible one Connecting line 4 should also be soldered on here. For soldering the line 4 to the copper conductor 2 otherwise had to, if no special soldering lug was provided at such a point, the end of the line is soldered from the conductor side of the plate, d. H. so by hand and not by immersion. According to the innovation is now directly at the predetermined solder joint a through hole 5 is provided and at a small distance next to it a second hole 6, the diameter of which is slightly larger than the diameter of the cable end to be connected with an insulating jacket.

Zum Verlöten mit dem aufkaschierten Leiter 2 wird nun das abisolierte Leitungsende 4a von der leiterfreien Seite der Platte 1 her in das Durchführungsloch 5 unmittelbar an der Lötstelle 7 gesteckt und zusammen mit den eingesteckten Schaltungsbauteilen 3 im Tauchverfahren angelötet. Dann wird das freie Ende der Verbindungsleitung 4 durch das zweite, etwas größere Durchführungsloch 6 hindurchgefädelt. Damit ist dann durch die so gebildete Schlaufe die Anschlußlötstelle der Leitung 4 völlig zugentlastet. Die Neuerung gewährleistet also die Anwendung der einfachen Tauchlötung sowie einen völlig zugentlasteten Lötanschluß.For soldering with the laminated conductor 2 is now the stripped Line end 4a from the ladder-free side of plate 1 into the feed-through hole 5 plugged directly at the soldering point 7 and together with the plugged-in circuit components 3 soldered on in the immersion process. Then the free end of the connecting line 4 threaded through the second, somewhat larger through hole 6. So is then through the loop formed in this way, the connection solder point of the line 4 completely strain relieved. The innovation ensures the use of simple dip soldering as well as a completely strain-relieved solder connection.

Claims (2)

( Schutzansprüche
1. Anordnung einer, vorzugsweise flexiblen, Leitung an Leiterplatten für
gedruckte Schaltungen, dadurch gekennzeichnet, daß für eine anzuschließende Leitung zwei Durchführungslöcher in geringem Abstand voneinander in die Leiterplatte eingelassen sind, von denen mindestens eines unmittelbar an der vorbestimmten Lötstelle angeordnet ist. ( Protection claims
1. Arrangement of a, preferably flexible, line on circuit boards for
Printed circuits, characterized in that, for a line to be connected, two feed-through holes are made in the printed circuit board at a small distance from one another, at least one of which is arranged directly at the predetermined soldering point. 2. Anordnung nach Anspruch 1, dadurch gekennzeichnet, daß mindestens das der Lötstelle abgewandte Durchgangsloch im Durchmesser etwas größer gehalten ist als der Durchmesser des anzuschließenden Leitungsendes mit Isoliermantel.2. Arrangement according to claim 1, characterized in that at least the through hole facing away from the solder joint is kept slightly larger in diameter is than the diameter of the cable end to be connected with the insulating jacket.
DEN11990U 1960-12-23 1960-12-23 ARRANGEMENT OF A LINE ON CIRCUIT BOARDS FOR PRINTED CIRCUITS. Expired DE1828733U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DEN11990U DE1828733U (en) 1960-12-23 1960-12-23 ARRANGEMENT OF A LINE ON CIRCUIT BOARDS FOR PRINTED CIRCUITS.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DEN11990U DE1828733U (en) 1960-12-23 1960-12-23 ARRANGEMENT OF A LINE ON CIRCUIT BOARDS FOR PRINTED CIRCUITS.

Publications (1)

Publication Number Publication Date
DE1828733U true DE1828733U (en) 1961-03-30

Family

ID=32975898

Family Applications (1)

Application Number Title Priority Date Filing Date
DEN11990U Expired DE1828733U (en) 1960-12-23 1960-12-23 ARRANGEMENT OF A LINE ON CIRCUIT BOARDS FOR PRINTED CIRCUITS.

Country Status (1)

Country Link
DE (1) DE1828733U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19528315A1 (en) * 1995-05-29 1996-12-12 Telefunken Microelectron Method of soldering insulated wire with uninsulated end into circuit board soldering hole

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19528315A1 (en) * 1995-05-29 1996-12-12 Telefunken Microelectron Method of soldering insulated wire with uninsulated end into circuit board soldering hole
DE19528315C2 (en) * 1995-05-29 2000-07-20 Telefunken Microelectron Process for soldering an insulated wire

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